Patents by Inventor Jelena Larsen

Jelena Larsen has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Air trapped circuit board test pad via
    Publication number: 20080036481
    Abstract: A circuit board with vias that are suitable for use as test pads can be made according to a method whereby a first end of a via is blocked prior to heating solder paste that covers the opposite end of the via. As a result, air is trapped in the via when the solder paste is heated, which prevents melted solder paste from flowing in. Instead, the solder paste forms a dome shaped test pad over the via, which facilitates contact with the test probe. When applied to OSP circuit boards, the result is an OSP board with at least via that has a blocking material at one end and a solder dome over the opposite end.
    Type: Application
    Filed: July 24, 2007
    Publication date: February 14, 2008
    Applicant: Microsoft Corporation
    Inventors: Chee Fong, Harjit Singh, Jelena Larsen, Raul Rodriquez-Montanez, Rodney Amen
  • High density surface mount part array layout and assembly technique
    Publication number: 20070177364
    Abstract: A printed wiring assembly comprising, a printed wiring board, a ball grid array coupled to the printed wiring board, and a high density surface mount part array disposed on the printed wiring board.
    Type: Application
    Filed: January 31, 2006
    Publication date: August 2, 2007
    Applicant: Microsoft Corporation
    Inventors: Jelena Larsen, Chee Fong, Peter Atkinson, Raul Rodriguez-Montanez
  • Air trapped circuit board test pad via
    Publication number: 20070068701
    Abstract: A circuit board with vias that are suitable for use as test pads can be made according to a method whereby a first end of a via is blocked prior to heating solder paste that covers the opposite end of the via. As a result, air is trapped in the via when the solder paste is heated, which prevents melted solder paste from flowing in. Instead, the solder paste forms a dome shaped test pad over the via, which facilitates contact with the test probe. When applied to OSP circuit boards, the result is an OSP board with at least via that has a blocking material at one end and a solder dome over the opposite end.
    Type: Application
    Filed: September 26, 2005
    Publication date: March 29, 2007
    Applicant: Microsoft Corporation
    Inventors: Chee Fong, Harjit Singh, Jelena Larsen, Raul Rodriguez-Montanez, Rodney Amen