Patents by Inventor Jelle NIJE

Jelle NIJE has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 11520238
    Abstract: A method of optimizing an apparatus for multi-stage processing of product units such as wafers, the method includes: receiving object data representing one or more parameters measured across the product units and associated with different stages of processing of the product units; and determining fingerprints of variation of the object data across the product units, the fingerprints being associated with different respective stages of processing of the product units. The fingerprints may be determined by decomposing the object data into components using principal component analysis for each different respective stage; analyzing commonality of the fingerprints through the different stages to produce commonality results; and optimizing an apparatus for processing product units based on the commonality results.
    Type: Grant
    Filed: September 20, 2021
    Date of Patent: December 6, 2022
    Assignee: ASML Netherlands B.V.
    Inventors: Jelle Nije, Alexander Ypma, Dimitra Gkorou, Georgios Tsirogiannis, Robert Jan Van Wijk, Tzu-Chao Chen, Frans Reinier Spiering, Sarathi Roy, Cédric Désiré Grouwstra
  • Publication number: 20220004108
    Abstract: A method of optimizing an apparatus for multi-stage processing of product units such as wafers, the method includes: receiving object data representing one or more parameters measured across the product units and associated with different stages of processing of the product units; and determining fingerprints of variation of the object data across the product units, the fingerprints being associated with different respective stages of processing of the product units. The fingerprints may be determined by decomposing the object data into components using principal component analysis for each different respective stage; analyzing commonality of the fingerprints through the different stages to produce commonality results; and optimizing an apparatus for processing product units based on the commonality results.
    Type: Application
    Filed: September 20, 2021
    Publication date: January 6, 2022
    Applicant: ASML NETHERLANDS B.V.
    Inventors: Jelle NIJE, Alexander YPMA, Dimitra GKOROU, Georgios TSIROGIANNIS, Robert Jan VAN WIJK, Tzu-Chao CHEN, Frans Reinier SPIERING, Sarathi ROY, Cédric Désiré GROUWSTRA
  • Patent number: 11150562
    Abstract: A method of optimizing an apparatus for multi-stage processing of product units such as wafers, the method includes: receiving object data representing one or more parameters measured across the product units and associated with different stages of processing of the product units; and determining fingerprints of variation of the object data across the product units, the fingerprints being associated with different respective stages of processing of the product units. The fingerprints may be determined by decomposing the object data into components using principal component analysis for each different respective stage; analyzing commonality of the fingerprints through the different stages to produce commonality results; and optimizing an apparatus for processing product units based on the commonality results.
    Type: Grant
    Filed: February 22, 2018
    Date of Patent: October 19, 2021
    Assignee: ASML Netherlands B.V.
    Inventors: Jelle Nije, Alexander Ypma, Dimitra Gkorou, Georgios Tsirogiannis, Robert Jan Van Wijk, Tzu-Chao Chen, Frans Reinier Spiering, Sarathi Roy, Cédric Désiré Grouwstra
  • Patent number: 11099485
    Abstract: A method of maintaining a set of fingerprints representing variation of one or more process parameters across wafers subjected to a device manufacturing method, the method including: receiving measurement data of one or more parameters measured on wafers; updating the set of fingerprints based on an expected evolution of the one or more process parameters; and evaluation of the updated set of fingerprints based on decomposition of the received measurement data in terms of the updated set of fingerprints. Each fingerprint may have a stored likelihood of occurrence, and the decomposition may involve: estimating, based the received measurement data, likelihoods of occurrence of the set of fingerprints in the received measurement data; and updating the stored likelihoods of occurrence based on the estimated likelihoods.
    Type: Grant
    Filed: April 9, 2018
    Date of Patent: August 24, 2021
    Assignee: ASML Netherlands B.V.
    Inventors: Alexander Ypma, Vahid Bastani, Dag Sonntag, Jelle Nije, Hakki Ergün Cekli, Georgios Tsirogiannis, Robert Jan Van Wijk
  • Publication number: 20210157247
    Abstract: A method of maintaining a set of fingerprints representing variation of one or more process parameters across wafers subjected to a device manufacturing method, the method including: receiving measurement data of one or more parameters measured on wafers; updating the set of fingerprints based on an expected evolution of the one or more process parameters; and evaluation of the updated set of fingerprints based on decomposition of the received measurement data in terms of the updated set of fingerprints. Each fingerprint may have a stored likelihood of occurrence, and the decomposition may involve: estimating, based the received measurement data, likelihoods of occurrence of the set of fingerprints in the received measurement data; and updating the stored likelihoods of occurrence based on the estimated likelihoods.
    Type: Application
    Filed: April 9, 2018
    Publication date: May 27, 2021
    Applicant: ASML NETHERLANDS B.V
    Inventors: Alexander YPMA, Vahid BASTANI, Dag SONNTAG, Jelle NIJE, Hakki Ergün CEKLI, Georgios TSIROGIANNIS, Robert Jan VAN WIJK
  • Publication number: 20200233315
    Abstract: A method of optimizing an apparatus for multi-stage processing of product units such as wafers, the method includes: receiving object data representing one or more parameters measured across the product units and associated with different stages of processing of the product units; and determining fingerprints of variation of the object data across the product units, the fingerprints being associated with different respective stages of processing of the product units. The fingerprints may be determined by decomposing the object data into components using principal component analysis for each different respective stage; analyzing commonality of the fingerprints through the different stages to produce commonality results; and optimizing an apparatus for processing product units based on the commonality results.
    Type: Application
    Filed: February 22, 2018
    Publication date: July 23, 2020
    Applicant: ASML NETHERLANDS B.V.
    Inventors: Jelle NIJE, Alexander YPMA, Dimitra GKOROU, Georgios TSIROGIANNIS, Robert Jan VAN WIJK, Tzu-Chao CHEN, Frans Reinier SPIERING, Sarathi ROY, Cédric Désiré GROUWSTRA