Abstract: An IoT device according to an embodiment encrypts IoT data using a peripheral device and transmits the IoT data to a server, and a user device requests and obtains necessary IoT data from the server, thereby achieving real-time IoT data sharing. The IoT device performs only relatively low-performance operation of attribute-based encryption to encrypt IoT data collected through a sensor and outsources the remaining high-performance operations of attribute-based encryption to the peripheral device providing external communication network connection to the IoT device to generate a final ciphertext. A user device generates an attribute bloom filter using an access policy thereof, requests and obtains IoT data encrypted according to attribute-based encryption. A cloud server receives and stores IoT data encrypted by the IoT device and the peripheral device according to attribute-based encryption and transmits IoT data retrieved using the attribute bloom filter as a query to the user device.

Abstract: Provided is a semiconductor memory device. The semiconductor includes a One Time Programmable (OTP) cell array, a converging circuit and a sense amplifier circuit. The OTP cell array includes a plurality of OTP cells connected to a plurality of bit lines, each bit line extending in a first direction. The converging includes a common node contacting a first bit line and a second bit line. The sense amplifier circuit includes a sense amplifier connected to the common node, the sense amplifier configured to amplify a signal of the common node.

Abstract: A semiconductor memory device includes a memory cell array configured to store data including a verification code; a sensing unit configured to sense the stored data including the verification code; and a verification unit configured to determine whether the sensing unit is able to sense the stored data based on a sensing condition, wherein the verification unit is configured to determine whether the sensing unit is able to sense the stored data based on the sensing condition and a value of the verification code sensed by the sensing unit.

Abstract: Provided is a semiconductor memory device. The semiconductor includes a One Time Programmable (OTP) cell array, a converging circuit and a sense amplifier circuit. The OTP cell array includes a plurality of OTP cells connected to a plurality of bit lines, each bit line extending in a first direction. The converging includes a common node contacting a first bit line and a second bit line. The sense amplifier circuit includes a sense amplifier connected to the common node, the sense amplifier configured to amplify a signal of the common node.

Abstract: The present invention relates to a method and apparatus for manufacturing a solar cell module using a laser. In the present invention, a tabbing process for bonding a solar cell and metal electrodes is performed by a local irradiation with a laser, so that the heating area can be localized only to a required zone (bonding area) for the tabbing process, thereby minimizing a direct heating zone which occurs in the process. Therefore, it is possible to reduce the damage such as cracks and breakage due to thermal expansion/contraction of a solar cell which is conventionally configured to have a multi-layered structure made of different materials, to improve the bonding strength and the bonding uniformity, and to reduce the processing time, thereby improving the production efficiency.

Abstract: A semiconductor memory device includes a memory cell array configured to store data including a verification code; a sensing unit configured to sense the stored data including the verification code; and a verification unit configured to determine whether the sensing unit is able to sense the stored data based on a sensing condition, wherein the verification unit is configured to determine whether the sensing unit is able to sense the stored data based on the sensing condition and a value of the verification code sensed by the sensing unit.

Abstract: A semiconductor memory device includes a bitline sensing amp detecting and amplifying data of a pair of bitlines from a memory cell, a column selecting unit transmitting the data of the pair of bitlines to a pair of local datalines in response to a column selecting signal, a dataline precharging unit precharging the pair of local datalines to a precharging voltage level in response to a precharging signal, and a dataline sensing amp detecting and amplifying data transmitted to the pair of local datalines. The dataline sensing amp includes a charge sync unit discharging the pair of local datalines at the precharging voltage level in response to a first dataline sensing enabling signal and data of the pair of local datalines, and a data sensing unit transmitting data of the pair of local datalines to a pair of global datalines in response to a second dataline sensing enabling signal.

Abstract: Disclosed is a solar cell module which incorporates layers of design is adapted for integration into construction as exterior walls incorporated into the steel frame of buildings, and comprises a double glass module having an external panel and an internal panel of tempered glass, with solar cells and layers of design between the external tempered glass panel and internal tempered glass panel.

Abstract: A memory core capable of decreasing the area of core conjunction region is disclosed. The memory core includes a first sub word-line driving circuit and a first sub word-line control signal generating circuit. The first sub word-line driving circuit is disposed in a first region, and generates a first word-line driving signal to provide the first word-line driving signal to an array unit. The first sub word-line control signal generating circuit is disposed in the first region, and generates the first sub word-line control signal based on a sub word-line driving signal. Therefore, the memory core has a small size and, consequently so can the semiconductor device.

Abstract: A semiconductor memory device includes a bitline sensing amp detecting and amplifying data of a pair of bitlines from a memory cell, a column selecting unit transmitting the data of the pair of bitlines to a pair of local datalines in response to a column selecting signal, a dataline precharging unit precharging the pair of local datalines to a precharging voltage level in response to a precharging signal, and a dataline sensing amp detecting and amplifying data transmitted to the pair of local datalines. The dataline sensing amp includes a charge sync unit discharging the pair of local datalines at the precharging voltage level in response to a first dataline sensing enabling signal and data of the pair of local datalines, and a data sensing unit transmitting data of the pair of local datalines to a pair of global datalines in response to a second dataline sensing enabling signal.

Abstract: A memory core capable of decreasing the area of core conjunction region is disclosed. The memory core includes a first sub word-line driving circuit and a first sub word-line control signal generating circuit. The first sub word-line driving circuit is disposed in a first region, and generates a first word-line driving signal to provide the first word-line driving signal to an array unit. The first sub word-line control signal generating circuit is disposed in the first region, and generates the first sub word-line control signal based on a sub word-line driving signal. Therefore, the memory core has a small size and, consequently so can the semiconductor device.

Abstract: The present invention relates to a method and apparatus for manufacturing a solar cell module using a laser. In the present invention, a tabbing process for bonding a solar cell and metal electrodes is performed by a local irradiation with a laser, so that the heating area can be localized only to a required zone (bonding area) for the tabbing process, thereby minimizing a direct heating zone which occurs in the process. Therefore, it is possible to reduce the damage such as cracks and breakage due to thermal expansion/contraction of a solar cell which is conventionally configured to have a multi-layered structure made of different materials, to improve the bonding strength and the bonding uniformity, and to reduce the processing time, thereby improving the production efficiency.

Abstract: A memory core capable of decreasing the area of core conjunction region is disclosed. The memory core includes a first sub word-line driving circuit and a first sub word-line control signal generating circuit. The first sub word-line driving circuit is disposed in a first region, and generates a first word-line driving signal to provide the first word-line driving signal to an array unit. The first sub word-line control signal generating circuit is disposed in the first region, and generates the first sub word-line control signal based on a sub word-line driving signal. Therefore, the memory core has a small size and, consequently so can the semiconductor device.

Abstract: A fuse circuit can include a cut-off unit circuit configured to electrically isolate a fuse from an input to a status information circuit after latching of status information associated with status of the fuse. Other fuse related circuits and methods are disclosed.

Abstract: A memory core capable of decreasing the area of core conjunction region is disclosed. The memory core includes a first sub word-line driving circuit and a first sub word-line control signal generating circuit. The first sub word-line driving circuit is disposed in a first region, and generates a first word-line driving signal to provide the first word-line driving signal to an array unit. The first sub word-line control signal generating circuit is disposed in the first region, and generates the first sub word-line control signal based on a sub word-line driving signal. Therefore, the memory core has a small size and, consequently so can the semiconductor device.

Abstract: A fuse circuit can include a cut-off unit circuit configured to electrically isolate a fuse from an input to a status information circuit after latching of status information associated with status of the fuse. Other fuse related circuits and methods are disclosed.