Patents by Inventor Jen An Wang

Jen An Wang has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Publication number: 20250044270
    Abstract: A system for notifying environmental pollution status includes wireless environment sensing devices and a portable wireless environmental pollution status notification device. The wireless environment sensing devices, respectively arranged in the different sensing locations of a physical environment, respectively store the sensing locations and respectively sense pollution related information corresponding to the different sensing locations to output the pollution related information and the sensing locations corresponding thereto. The portable wireless environmental pollution status notification device, wirelessly connected to the plurality of wireless environment sensing devices and located in the physical environment, receives the pollution related information and the sensing locations corresponding thereto and generates notification signals based on the pollution related information and the sensing locations corresponding thereto.
    Type: Application
    Filed: July 15, 2024
    Publication date: February 6, 2025
    Inventors: CHIA-JUI YANG, HERMAN CHUNGHWA RAO, CHUN-CHIEH KUO, HUA-PEI CHIANG, SHUI-SHU HSIAO, ZHENG-XIANG CHANG, CHYI-DAR JANG, TSUNG-JEN WANG, CHE-YU LIAO, CHIH-MIN CHAN, TENG-CHIEH YANG, CHANG-HUNG HSU
  • Publication number: 20250044545
    Abstract: A driving mechanism for moving an optical element is provided. The driving mechanism includes a fixed part, a movable part, and a driving assembly. The movable part is movably connected to the fixed part for holding the optical element. The driving assembly is configured for moving the optical element relative to the fixed part.
    Type: Application
    Filed: August 2, 2024
    Publication date: February 6, 2025
    Inventors: Chao-Chang HU, Ying-Jen WANG
  • Publication number: 20250044517
    Abstract: A package includes an optical engine attached to a package substrate, wherein the optical engine includes a first waveguide; and a waveguide structure attached to the package substrate adjacent the optical engine, wherein the waveguide structure includes a second waveguide within a transparent block, wherein a first end of the second waveguide is optically coupled to the first waveguide, wherein the waveguide structure is configured to be connected to an optical fiber component such that a second end of the second waveguide is optically coupled to an optical fiber of the optical fiber component.
    Type: Application
    Filed: August 3, 2023
    Publication date: February 6, 2025
    Inventors: Chao-Jen Wang, Szu-Wei Lu, Tsung-Fu Tsai, Chen-Hua Yu
  • Publication number: 20250044546
    Abstract: A driving mechanism for moving an optical element is provided. The driving mechanism includes a fixed part, a movable part, and a driving assembly. The movable part is movably connected to the fixed part for holding the optical clement. The driving assembly is configured for moving the optical element relative to the fixed part.
    Type: Application
    Filed: August 2, 2024
    Publication date: February 6, 2025
    Inventors: Chao-Chang HU, Ying-Jen WANG
  • Publication number: 20250044636
    Abstract: An optical system includes a pancake lens assembly and a varifocal lens device. The varifocal lens device is coupled to the pancake lens assembly in a way that an optical axis of the varifocal lens device is in alignment with an optical axis of the pancake lens assembly, thereby permitting the optical system to have an adjustable focal length.
    Type: Application
    Filed: October 21, 2024
    Publication date: February 6, 2025
    Inventors: Yi-hsin Lin, Ting-Wei Huang, Yu-Jen Wang
  • Patent number: 12216326
    Abstract: An optical member driving mechanism for connecting an optical member is provided, including a fixed portion and a first adhesive member. The fixed portion includes a first member and a second member, wherein the first member is fixedly connected to the second member via the first adhesive member.
    Type: Grant
    Filed: March 26, 2021
    Date of Patent: February 4, 2025
    Assignee: TDK TAIWAN CORP.
    Inventors: Hsiang-Chin Lin, Shou-Jen Liu, Guan-Bo Wang, Kai-Po Fan, Chan-Jung Hsu, Shao-Chung Chang, Shih-Wei Hung, Ming-Chun Hsieh, Wei-Pin Chin, Sheng-Zong Chen, Yu-Huai Liao, Sin-Hong Lin, Wei-Jhe Shen, Tzu-Yu Chang, Kun-Shih Lin, Che-Hsiang Chiu, Sin-Jhong Song
  • Patent number: 12218094
    Abstract: An electronic package structure and a method for manufacturing the same are provided. The electronic package structure includes a first electronic component, a second electronic component, an interconnection element, an insulation layer, and an encapsulant. The second electronic component is disposed adjacent to the first electronic component. The interconnection element is disposed between the first electronic component and the second electronic component. The insulation layer is disposed between the first electronic component and the second electronic component and has a side surface and a top surface connecting to the side surface. The encapsulant surrounds the interconnection element and at least partially covers the top surface of the insulation layer and has an extended portion in contact with the side surface of the insulation layer.
    Type: Grant
    Filed: March 19, 2024
    Date of Patent: February 4, 2025
    Assignee: ADVANCED SEMICONDUCTOR ENGINEERING, INC.
    Inventors: Wei-Jen Wang, Yi Dao Wang, Tung Yao Lin
  • Publication number: 20250038073
    Abstract: A package structure and a method for forming the same are provided. The package structure includes a first package structure and a second package structure. The first package structure includes a first device formed over a first substrate. The first device includes a first conductive plug connected to a through substrate via (TSV) structure formed in the first substrate. A buffer layer surrounds the first substrate. A first bonding layer is formed over the first substrate and the buffer layer. The second package structure includes a second device formed over a second substrate. A second bonding layer is formed over the second device. A hybrid bonding structure is between the first package structure and the second package structure by bonding the first bonding layer to the second bonding layer.
    Type: Application
    Filed: July 27, 2023
    Publication date: January 30, 2025
    Applicant: Taiwan Semiconductor Manufacturing Company, Ltd.
    Inventors: Ke-Han SHEN, Chih-Yuan CHEN, Jiung WU, Hung-Yi Kuo, Chung-Ju LEE, Tung-He CHOU, Ji CUI, Kuo-Chung YEE, Chen-Hua YU, Cheng-Chieh HSIEH, Yu-Jen LIEN, Yian-Liang KUO, Shih-Hao TSENG, Jen Yu WANG, Tzu-Chieh Chou
  • Publication number: 20250035603
    Abstract: A positioning pollutant-measuring system includes a cloud server, a wireless base station, an automatic moving vehicle, and a positioning pollutant-measuring device. The automatic moving vehicle carries the positioning pollutant-measuring device and passes through different locations. The positioning pollutant-measuring device receives location related parameters from the wireless base station and measures the air flow rates or the air humidity of the different locations to adjust a resolution for measuring pollutants corresponding to the different locations.
    Type: Application
    Filed: June 24, 2024
    Publication date: January 30, 2025
    Inventors: Chia-Jui YANG, HERMAN CHUNGHWA RAO, Chun-Chieh KUO, Hua-Pei CHIANG, Shui-Shu HSIAO, Zheng-Xiang CHANG, Chyi-Dar JANG, Tsung-Jen WANG, Che-Yu LIAO, Chih-Min CHAN, Teng-Chieh YANG, CHANG-HUNG HSU
  • Publication number: 20250039646
    Abstract: An internal radio wave transmission system of building includes a base layer and a transmission layer, with a radio wave transmission channel between the two layers. The radio wave transmission system in a building includes a signal transceiver device, a first reflective plate and a second reflective plate. The signal transceiver device is connected with a telecommunication room, and the signal transceiver device emits and receives radio wave signals. The first reflective plate is disposed in the channel and corresponds to positions of the base layer and the signal transceiver device to receive and guide the radio wave signals. The second reflective plate is disposed in the channel and corresponds to a position of the transmission layer to receive and guide the radio wave signals to terminal equipment located in the transmission layer. The invention ensures the effective transmission of the radio wave signals inside the building.
    Type: Application
    Filed: June 20, 2024
    Publication date: January 30, 2025
    Inventors: TZUU-YAW LU, HERMAN CHUNGHWA RAO, Chun-Chieh KUO, Hua-Pei CHIANG, CHYI-DAR JANG, TSUNG-JEN WANG, CHI-HUNG LIN, WEI-DI HWANG, FANG-CHI YEN, CHIEN-LI HOU
  • Patent number: 12211635
    Abstract: An arrangement to cool a coil, comprising an enclosure, which at least partially incorporates or houses the coil, and a device to create an airflow to cool the coil, wherein the coil comprises at least one cooling channel to guide the airflow through the windings of the coil and an outer air duct lying radially in the outer circumference area of the coil or lying radially inside below an outer part of the coil, characterized in that an air guidance plate is placed at or near one longitudinal end of the outer air duct and/or of the coil to prevent bypasses of the airflow and/or to block at least partially the airflow through and/or along the outer air duct, achieves the object to cool a coil, especially a coil of a transformer, in an efficient manner using space-saving means.
    Type: Grant
    Filed: March 10, 2020
    Date of Patent: January 28, 2025
    Assignee: HITACHI ENERGY LTD
    Inventors: Yong Wang, Jens Tepper, Jiahua Weng
  • Patent number: 12211876
    Abstract: The present disclosure, in some embodiments, relates to an image sensor integrated chip. The image sensor integrated chip includes a semiconductor substrate having sidewalls that form one or more trenches. The one or more trenches are disposed along opposing sides of a photodiode and vertically extend from an upper surface of the semiconductor substrate to within the semiconductor substrate. A doped region is arranged along the upper surface of the semiconductor substrate and along opposing sides of the photodiode. A first dielectric lines the sidewalls of the semiconductor substrate and the upper surface of the semiconductor substrate. A second dielectric lines sidewalls and an upper surface of the first dielectric. The doped region has a width laterally between a side of the photodiode and a side of the first dielectric. The width of the doped region varies at different heights along the side of the photodiode.
    Type: Grant
    Filed: June 16, 2023
    Date of Patent: January 28, 2025
    Assignee: Taiwan Semiconductor Manufacturing Company, Ltd.
    Inventors: Chun-Yuan Chen, Ching-Chun Wang, Dun-Nian Yaung, Hsiao-Hui Tseng, Jhy-Jyi Sze, Shyh-Fann Ting, Tzu-Jui Wang, Yen-Ting Chiang, Yu-Jen Wang, Yuichiro Yamashita
  • Publication number: 20250028138
    Abstract: An optical element driving mechanism is provided, including a first movable part, a fixed part, and a first driving assembly. The first movable part is connected to a first optical element. The first movable part is movable relative to the fixed part. The first driving assembly drives the first movable part to move.
    Type: Application
    Filed: July 19, 2024
    Publication date: January 23, 2025
    Inventors: Ya-Hsiu WU, Kai-Po FAN, Ying-Jen WANG, Sin-Jhong SONG
  • Publication number: 20250025805
    Abstract: A party popper contains: a cylinder, a sealing element, a drive element, a flexible fitting element, and a weaken structure. The cylinder includes a first segment and a second segment. The sealing element is a film and is configured to close the second segment. The multiple streamers are filled in the cylinder. A diameter of the drive element is equal to a diameter of the cylinder. The flexible fitting element is made of flexible material with low elastic modulus, and the flexible fitting element includes a cap, a neck section, and a head. The weaken structure surrounds the neck section, and a pulling length is defined to pull off the weaken structure by pulling the weaken structure from the head to the neck section and the cap, such that the weaken structure is pulled off to remove the neck section and the head from the cap.
    Type: Application
    Filed: July 20, 2023
    Publication date: January 23, 2025
    Inventor: Yu-Jen Wang
  • Publication number: 20250028145
    Abstract: An optical element driving mechanism is provided. The optical element driving mechanism includes a fixed portion, a movable portion and a first driving component. The movable portion is connected to an optical element having an optical axis. The movable portion is movable relative to the fixed portion. The first driving component is configured to drive the movable portion to move relative to the fixed portion.
    Type: Application
    Filed: July 19, 2024
    Publication date: January 23, 2025
    Inventors: Ying-Jen WANG, Yi-Ho CHEN, Ya-Hsiu WU
  • Publication number: 20250028150
    Abstract: An optical element driving mechanism is provided, including a first movable part, a fixed part, and a first driving assembly. The first movable part is connected to a first optical element. The first movable part is movable relative to the fixed part.
    Type: Application
    Filed: July 19, 2024
    Publication date: January 23, 2025
    Inventors: Ya-Hsiu WU, Kai-Po FAN, Ying-Jen WANG, Sin-Jhong SONG
  • Publication number: 20250028144
    Abstract: An optical element driving mechanism is provided. The optical element driving mechanism includes a fixed portion, a movable portion and a first driving component. The movable portion is connected to an optical element having an optical axis. The movable portion is movable relative to the fixed portion. The first driving component is configured to drive the movable portion to move relative to the fixed portion.
    Type: Application
    Filed: July 11, 2024
    Publication date: January 23, 2025
    Inventors: Ying-Jen WANG, Yi-Ho CHEN, Ya-Hsiu WU
  • Publication number: 20250028151
    Abstract: An optical element driving mechanism is provided, including a fixed part, a movable part, a metallic member and a driving assembly. The fixed part includes a base. The movable part is movably connected to the fixed part, and carries an optical element, the optical element has an optical axis. The metallic member is disposed on the base, and includes an inner electrical connection part and an outer electrical connection part, the inner electrical connection part and the outer electrical connection part are connected to each other. The driving assembly includes at least one driving magnetic element and drives the movable part to move relative to the fixed part.
    Type: Application
    Filed: October 9, 2024
    Publication date: January 23, 2025
    Inventors: Chien-Lun HUANG, Shao-Chung CHANG, Wei-Cheng WANG, Che-Hsiang CHIU, Fu-Yuan WU, Shou-Jen LIU
  • Publication number: 20250028146
    Abstract: An optical element driving mechanism is provided. The optical element driving mechanism includes a first movable portion, a fixed portion and a first driving component. The first movable portion is configured to connect a first optical element. The fixed portion has a main axis. The first movable portion is movable relative to the fixed portion. The first driving component is configured to drive the first movable portion to move relative to the fixed portion.
    Type: Application
    Filed: July 19, 2024
    Publication date: January 23, 2025
    Inventors: Ying-Jen WANG, Yi-Ho CHEN, Ya-Hsiu WU
  • Publication number: 20250028148
    Abstract: An optical element driving mechanism is provided, which includes a fixed portion, a first movable portion, and a driving assembly. The first movable portion is used for connecting to a first optical element. The first movable portion is movable relative to the fixed portion. The first driving assembly is used for driving the first movable portion to move relative to the fixed portion.
    Type: Application
    Filed: July 19, 2024
    Publication date: January 23, 2025
    Inventors: Ya-Hsiu WU, Kai-Po FAN, Ying-Jen WANG, Sin-Jhong SONG