Abstract: A protective assembly includes a cover plate, a buffer layer, and a flexible substrate. The buffer layer is disposed on the cover plate and made of transparent polymer. The buffer layer has a light transmittance greater than about 85%, a thickness ranging from about 3 ?m to about 15 ?m, and a Poisson's ratio greater than about 0.4. The flexible substrate is disposed on the buffer layer and doped with an inorganic compound. The flexible substrate has a thickness ranging from about 3 ?m to about 10 ?m and a Young's coefficient ranging from about 1 GPa to about 10 GPa.

Abstract: A protective assembly includes a cover plate, a buffer layer, and a flexible substrate. The buffer layer is disposed on the cover plate and made of transparent polymer. The buffer layer has a light transmittance greater than about 85%, a thickness ranging from about 3 ?m to about 15 ?m, and a Poisson's ratio greater than about 0.4. The flexible substrate is disposed on the buffer layer and doped with an inorganic compound. The flexible substrate has a thickness ranging from about 3 ?m to about 10 ?m and a Young's coefficient ranging from about 1 GPa to about 10 GPa.

Abstract: An electronic device includes a cover plate, a touch sensing layer, and a display module. The cover plate includes a glass layer and at least one transparent covering layer. The glass layer has a first surface and a second surface. The transparent covering layer is disposed on and in contact with at least one of the first surface or the second surface of the glass layer and is laminated with the glass layer. The touch sensing layer is disposed under the cover plate. The display module is disposed under the touch sensing layer.

Abstract: An electronic device includes a cover plate, a touch sensing layer, and a display module. The cover plate includes a glass layer and at least one transparent covering layer. The glass layer has a first surface and a second surface. The transparent covering layer is disposed on and in contact with at least one of the first surface or the second surface of the glass layer and is laminated with the glass layer. The touch sensing layer is disposed under the cover plate. The display module is disposed under the touch sensing layer.

Abstract: A touch panel module includes a substrate, a sensor layer disposed on the substrate, a first glue layer disposed on the sensor layer and an anti-electromagnetic interference layer disposed on the first glue layer. The touch panel module with anti-electromagnetic interference can be formed independently, and may be combined with other electronic device to form a touch device, thereby reducing the thickness of the touch device and simplifying the process steps.

Abstract: A touch panel module includes a substrate, a sensor layer disposed on the substrate, a first glue layer disposed on the sensor layer and an anti-electromagnetic interference layer disposed on the first glue layer. The touch panel module with anti-electromagnetic interference can be formed independently, and may be combined with other electronic device to form a touch device, thereby reducing the thickness of the touch device and simplifying the process steps.

Abstract: A touch panel module includes a substrate, a sensor layer disposed on the substrate, a first glue layer disposed on the sensor layer and an anti-electromagnetic interference layer disposed on the first glue layer. The touch panel module with anti-electromagnetic interference can be formed independently, and may be combined with other electronic device to form a touch device, thereby reducing the thickness of the touch device and simplifying the process steps.

Abstract: A touch panel module includes a substrate, a sensor layer disposed on the substrate, a first glue layer disposed on the sensor layer and an anti-electromagnetic interference layer disposed on the first glue layer. The touch panel module with anti-electromagnetic interference can be formed independently, and may be combined with other electronic device to form a touch device, thereby reducing the thickness of the touch device and simplifying the process steps.