Abstract: An exemplary camera module includes a lens holder, a lens module, an image sensor chip, at least three apart bonding pads, and a light transmittance element. The lens module is received in the lens holder. The lens module includes a barrel and at least one lens received in the barrel. The image sensor chip includes a photosensitive area configured for receiving light transmitted through the lens module. The image sensor chip is attached to an end of the lens holder facing away from the lens module. The bonding pads are arranged on the image sensor chip around the photosensitive area. The light transmittance element is fixed on the image sensor chip via the at least three bonding pads. The present invention also relates to a method for manufacturing the camera module.

Abstract: A method for assembling a camera module includes following steps: providing a circuit board having a connecting region; disposing a liquid anisotropic conductive adhesive on the connecting region of the circuit board; placing an image sensor module, on the connecting region of the circuit board; thermal press-bonding the image sensor module onto the circuit board to fix the image sensor module with the circuit board. Because the anisotropic conductive adhesive before being disposed on the circuit board is liquid and doesn't needs to be cut, flow-shop operations are easy to achieve, and costs are decreased.

Abstract: A camera module includes an image sensor, a lens module and a holder. The holder defines a cavity, the cavity including a first receiving portion, with the lens module received therein, and a second receiving portion. The side surface of the image sensor tightly contacts the inner surface of the holder surrounding the second receiving portion. In the camera module, an optical center of the image sensor can keep accurately aligning with an optical center of the lens module. Accordingly, the camera module can keep good quality for imaging. A method for making the camera module is also provided.