Patents by Inventor Jen-Cheng Lin

Jen-Cheng Lin has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 12178817
    Abstract: The present invention relates to a novel type of PPAR? modulator having a pyrimido[5,4-d]pyrimidine main structure. The PPAR? modulator can enhance the expression and nuclear translocation of PPAR? in cells. The present invention also relates to a pharmaceutical composition comprising the PPAR? modulator of the invention encapsulated in a pharmaceutically acceptable cell-penetrating drug delivery system so that it can be directly delivered into cells. The present invention thus provides a method of preventing or treating PPAR?-related disorders or conditions comprising administering to a subject in need thereof a therapeutically effective amount of the PPAR? modulator of the invention or the pharmaceutical composition of the invention.
    Type: Grant
    Filed: January 27, 2016
    Date of Patent: December 31, 2024
    Assignee: REALINN LIFE SCIENCE LIMITED
    Inventors: Jen Cheng Lin, Chun-Chieh Lin, Hsu-Tung Lee, Yu-Ming Fan, Jui-Chi Tsai, Ying-Chi Du
  • Patent number: 11660345
    Abstract: The invention provides a method for enhancing the delivery of an anti-platelet drug for the treatment of acute stroke, comprising delivering a composition comprising an anti-platelet drug and a vehicle that can reduce the binding rate of plasma proteins, so that the anti-platelet drug can achieve the effect of treating acute stroke at a low dose. By use of the neuro-protective efficacy of anti-platelet drug, the invention allows the drug to release slowly to the site of treatment by combining anti-platelet drugs with a vehicle that can reduce the binding rate of plasma proteins to effectively reduce the dose of the anti-platelet drug and consequently reduce the side effects such as hypotension caused by administration of a high dose of the anti-platelet drugs. The invention also provides a pharmaceutical composition for enhancing treatment of acute stroke and a method for treating acute stroke using the pharmaceutical composition of the invention.
    Type: Grant
    Filed: April 4, 2018
    Date of Patent: May 30, 2023
    Assignee: REALINN LIFE SCIENCE LIMITED
    Inventors: Jen Cheng Lin, Chun-Chieh Lin, Hsu-Tung Lee, Yu-Ming Fan, Jui-Chi Tsai
  • Patent number: 11252838
    Abstract: A water-cooing heat dissipation device includes a vapor chamber, a heat conduction cylinder, and a cover. A first chamber is formed in the vapor chamber. The heat conduction cylinder extends from a surface of the vapor chamber. A second chamber communicating with the first chamber is formed in the heat conduction cylinder. A working fluid flows in the first chamber and the second chamber. The cover covers the vapor chamber; the heat conduction cylinder is disposed in the cover. By means of the working fluid flowing in the first chamber and the second chamber which communicate with each other, heat can be delivered rapidly from the vapor chamber to the heat conduction cylinder.
    Type: Grant
    Filed: April 26, 2019
    Date of Patent: February 15, 2022
    Assignee: COOLER MASTER CO., LTD.
    Inventor: Jen-Cheng Lin
  • Publication number: 20190254192
    Abstract: A water-cooing heat dissipation device includes a vapor chamber, a heat conduction cylinder, and a cover. A first chamber is formed in the vapor chamber. The heat conduction cylinder extends from a surface of the vapor chamber. A second chamber communicating with the first chamber is formed in the heat conduction cylinder. A working fluid flows in the first chamber and the second chamber. The cover covers the vapor chamber; the heat conduction cylinder is disposed in the cover. By means of the working fluid flowing in the first chamber and the second chamber which communicate with each other, heat can be delivered rapidly from the vapor chamber to the heat conduction cylinder.
    Type: Application
    Filed: April 26, 2019
    Publication date: August 15, 2019
    Applicant: COOLER MASTER CO., LTD.
    Inventor: Jen-Cheng LIN
  • Patent number: 10327355
    Abstract: A water-cooling heat dissipation device includes a vapor chamber, a heat conduction cylinder, and a cover. A first chamber is formed in the vapor chamber. The heat conduction cylinder extends from a surface of the vapor chamber. A second chamber communicating with the first chamber is formed in the heat conduction cylinder. A working fluid flows in the first chamber and the second chamber. The cover covers the vapor chamber; the heat conduction cylinder is disposed in the cover. By means of the working fluid flowing in the first chamber and the second chamber which communicate with each other, heat can be delivered rapidly from the vapor chamber to the heat conduction cylinder.
    Type: Grant
    Filed: March 12, 2015
    Date of Patent: June 18, 2019
    Assignee: COOLER MASTER CO., LTD.
    Inventor: Jen-Cheng Lin
  • Patent number: 10299406
    Abstract: The present invention provides a liquid cooling heat sink device for cooling a heat source. The liquid cooling heat sink device includes a heat conduction module, a liquid supply module, and a liquid guiding module. The heat conduction module includes a vapor chamber and at least one heat conducting column. The vapor chamber has at least one space and one side of the vapor chamber contacts the heat source. The heat conducting column is mounted on one side of the vapor chamber, and the side of the vapor chamber is distal from the heat source. The liquid supply module is mounted on one side of the vapor chamber and has a casing and a pump. The casing has a liquid entrance terminal and a liquid exit terminal out of the casing. The liquid guiding module is mounted on one side of the vapor chamber and a receiving space is formed between the vapor chamber and the liquid guiding module.
    Type: Grant
    Filed: January 19, 2016
    Date of Patent: May 21, 2019
    Assignee: COOLER MASTER CO., LTD.
    Inventors: Jen-Cheng Lin, Shui-Fa Tsai
  • Publication number: 20190053403
    Abstract: The present invention provides a liquid cooling heat sink device for cooling a heat source. The liquid cooling heat sink device includes a heat conduction module, a liquid supply module, and a liquid guiding module. The heat conduction module includes a vapor chamber and at least one heat conducting column. The vapor chamber has at least one space and one side of the vapor chamber contacts the heat source. The heat conducting column is mounted on one side of the vapor chamber, and the side of the vapor chamber is distal from the heat source. The liquid supply module is mounted on one side of the vapor chamber and has a casing and a pump. The casing has a liquid entrance terminal and a liquid exit terminal out of the casing. The liquid guiding module is mounted on one side of the vapor chamber and a receiving space is formed between the vapor chamber and the liquid guiding module.
    Type: Application
    Filed: January 19, 2016
    Publication date: February 14, 2019
    Applicant: COOLER MASTER CO., LTD.
    Inventors: Jen-Cheng LIN, Shui-Fa TSAI
  • Publication number: 20180289814
    Abstract: The invention provides a method for enhancing the delivery of an anti-platelet drug for the treatment of acute stroke, comprising delivering a composition comprising an anti-platelet drug and a vehicle that can reduce the binding rate of plasma proteins, so that the anti-platelet drug can achieve the effect of treating acute stroke at a low dose. By use of the neuro-protective efficacy of anti-platelet drug, the invention allows the drug to release slowly to the site of treatment by combining anti-platelet drugs with a vehicle that can reduce the binding rate of plasma proteins to effectively reduce the dose of the anti-platelet drug and consequently reduce the side effects such as hypotension caused by administration of a high dose of the anti-platelet drugs. The invention also provides a pharmaceutical composition for enhancing treatment of acute stroke and a method for treating acute stroke using the pharmaceutical composition of the invention.
    Type: Application
    Filed: April 4, 2018
    Publication date: October 11, 2018
    Inventor: Jen Cheng Lin
  • Publication number: 20180015090
    Abstract: The present invention relates to a novel type of PPAR? modulator having a pyrimido[5,4-d]pyrimidine main structure. The PPAR? modulator can enhance the expression and nuclear translocation of PPAR? in cells. The present invention also relates to a pharmaceutical composition comprising the PPAR? modulator of the invention encapsulated in a pharmaceutically acceptable cell-penetrating drug delivery system so that it can be directly delivered into cells. The present invention thus provides a method of preventing or treating PPAR?-related disorders or conditions comprising administering to a subject in need thereof a therapeutically effective amount of the PPAR? modulator of the invention or the pharmaceutical composition of the invention.
    Type: Application
    Filed: January 27, 2016
    Publication date: January 18, 2018
    Applicant: REALINN LIFE SCIENCE LIMITED
    Inventors: Jen Cheng LIN, Chun-Chieh LIN, Hsu-Tung LEE, Yu-Ming FAN, Jui-Chi TSAI, Ying-Chi DU
  • Publication number: 20160227672
    Abstract: A water-cooling heat dissipation device includes a vapor chamber, a heat conduction cylinder, and a cover. A first chamber is formed in the vapor chamber. The heat conduction cylinder extends from a surface of the vapor chamber. A second chamber communicating with the first chamber is formed in the heat conduction cylinder. A working fluid flows in the first chamber and the second chamber. The cover covers the vapor chamber; the heat conduction cylinder is disposed in the cover. By means of the working fluid flowing in the first chamber and the second chamber which communicate with each other, heat can be delivered rapidly from the vapor chamber to the heat conduction cylinder.
    Type: Application
    Filed: March 12, 2015
    Publication date: August 4, 2016
    Inventor: JEN-CHENG LIN
  • Publication number: 20150064238
    Abstract: The invention provides a method for enhancing the delivery of an anti-platelet drug for the treatment of acute stroke, comprising delivering a composition comprising an anti-platelet drug and a vehicle that can reduce the binding rate of plasma proteins, so that the anti-platelet drug can achieve the effect of treating acute stroke at a low dose. By use of the neuro-protective efficacy of anti-platelet drug, the invention allows the drug to release slowly to the site of treatment by combining anti-platelet drugs with a vehicle that can reduce the binding rate of plasma proteins to effectively reduce the dose of the anti-platelet drug and consequently reduce the side effects such as hypotension caused by, administration of a high dose of the anti-platelet drugs. The invention also provides a pharmaceutical composition for enhancing treatment of acute stroke and a method for treating acute stroke using the pharmaceutical composition of the invention.
    Type: Application
    Filed: July 28, 2014
    Publication date: March 5, 2015
    Inventor: Jen Cheng Lin
  • Publication number: 20140345832
    Abstract: A plate-type heat pipe includes a first main body, a capillary structure and a support structure. The first main body has a first face and a second face. The capillary structure is disposed on the first face and the support structure is disposed on the side of the capillary structure opposite to the first main body. When pressing the first main body, capillary structure and support structure, the layers are tightly connected.
    Type: Application
    Filed: May 23, 2013
    Publication date: November 27, 2014
    Applicant: COOLER MASTER CO., LTD.
    Inventors: JEN-CHENG LIN, CHIEN-HUNG SUN, TE-HSUAN CHIN
  • Publication number: 20140345831
    Abstract: A plate-type heat pipe includes a first plate, a capillary structure and a support structure. The first plate, the capillary structure and the support structure are arranged in sequence, and the first plate, the capillary structure and the support structure are tightly connected by pressing. A method of manufacturing a plate-type heat pipe is also discussed.
    Type: Application
    Filed: May 23, 2013
    Publication date: November 27, 2014
    Applicant: COOLER MASTER CO., LTD.
    Inventors: JEN-CHENG LIN, CHIEN-HUNG SUN, TE-HSUAN CHIN
  • Publication number: 20140174700
    Abstract: A method of manufacturing a vapor chamber includes steps of: providing a first metal cover plate with a plurality of first engaging recesses, a second metal cover plate with a plurality of second engaging recesses, and a plurality of support members, wherein a width of a first end of each support member is larger than a width of each first engaging recess, and a width of a second end of each support member is larger than a width of each second engaging recess; making the first end abut against the first engaging recess and making the second end abut against the second engaging recess; and punching the first metal cover plate and the second metal cover plate so as to rivet the first end into the first engaging recess in a tight-fitting manner and rivet the second end into the second engaging recess in a tight-fitting manner.
    Type: Application
    Filed: December 20, 2012
    Publication date: June 26, 2014
    Applicant: COOLER MASTER CO., LTD.
    Inventors: Jen-Cheng Lin, Chien-Hung Sun, Chun Zhou
  • Publication number: 20140166243
    Abstract: A method of manufacturing a vapor chamber includes steps of: attaching a first edge of a first metal cover plate to a second edge of a second metal cover plate; placing the first metal cover plate and the second metal cover plate on a die after attachment; and using a punch head to punch the first edge and the second edge in a direction toward the die so as to seal the first edge and the second edge.
    Type: Application
    Filed: December 19, 2012
    Publication date: June 19, 2014
    Applicant: COOLER MASTER CO., LTD.
    Inventors: Jen-Cheng Lin, Chien-Hung Sun, Chun Zhou
  • Patent number: 7037073
    Abstract: The cooling fan has a frame and at least one light-emitting diode (LED). The frame has a central block with a circuit and multiple ribs. The ribs are formed on the rear surface of the frame, extend to the center of the inner space and have at least one set hole. The at least one LED is mounted respectively in the at least one set hole to emit light and faces to the front surface of the frame.
    Type: Grant
    Filed: July 16, 2004
    Date of Patent: May 2, 2006
    Assignee: Cooler Master Co., Ltd.
    Inventor: Jen-Cheng Lin
  • Patent number: 7016189
    Abstract: A damper adapted to be sandwiched between a computer casing and a hard disk includes multiple pads adapted to be sandwiched between the computer casing and a side face of the hard disk such that impact to the computer casing and transmitted to the hard disk is reduced and thus the hard disk is protected from damage.
    Type: Grant
    Filed: November 5, 2003
    Date of Patent: March 21, 2006
    Inventor: Jen-Cheng Lin
  • Publication number: 20060012973
    Abstract: The cooling fan has a frame and at least one light-emitting diode (LED). The frame has a central block with a circuit and multiple ribs. The ribs are formed on the rear surface of the frame, extend to the center of the inner space and have at least one set hole. The at least one LED is mounted respectively in the at least one set hole to emit light and faces to the front surface of the frame.
    Type: Application
    Filed: July 16, 2004
    Publication date: January 19, 2006
    Applicant: Cooler Master Co., Ltd.
    Inventor: Jen-Cheng Lin
  • Patent number: D506818
    Type: Grant
    Filed: June 2, 2003
    Date of Patent: June 28, 2005
    Inventor: Jen-Cheng Lin
  • Patent number: D509580
    Type: Grant
    Filed: June 21, 2004
    Date of Patent: September 13, 2005
    Inventor: Jen-Cheng Lin