Abstract: A lead semiconductor package includes a leadframe, a chip and an encapsulant. The leadframe has a central opening and multiple flat leads. The multiple flat leads define edges of the central opening. Each lead has an exposed portion and an inner thin portion. The inner thin portion is close to the central opening. The chip is mounted on the leads and is wire bonded to the inner thin portion. The inner thin portion is thicker than the exposed thick portion to provide a wire bonding space. Therefore, the semiconductor package is very thin. Further, the encapsulant covers the leadframe except portions of the leads and a portion of the chip to increase heat radiation.

Abstract: A semiconductor packaging structure mainly has a lead frame with a die pad and a plurality of leads, a wall portion formed by molding compound positioned around a periphery of the lead frame, a chip mounted on the die pad and electrically connected with the plurality of lead via gold wires, and a cover mounted on the wall portion to enclose the chip. An interval is defined between the die pad and the plurality of leads for filling with an isolating resin, the interval further communicates with multiple gaps and each gap is defined between two adjacent of the plurality of leads, wherein each gap is also filled with the isolating resin.

Abstract: A semiconductor packaging structure mainly has a lead frame with a die pad and a plurality of leads, a wall portion formed by molding compound positioned around a periphery of the lead frame, a chip mounted on the die pad and electrically connected with the plurality of lead via gold wires, and a cover mounted on the wall portion to enclose the chip. An interval is defined between the die pad and the plurality of leads for filling with an isolating resin, the interval further communicates with multiple gaps and each gap is defined between two adjacent of the plurality of leads, wherein each gap is also filled with the isolating resin.