Patents by Inventor Jen Chieh Huang
Jen Chieh Huang has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).
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Publication number: 20240136401Abstract: The present disclosure relates to an integrated chip. The integrated chip includes a substrate having a first semiconductor material. A second semiconductor material is disposed on the first semiconductor material and a passivation layer is disposed on the second semiconductor material. A first doped region and a second doped region extend through the passivation layer and into the second semiconductor material. A silicide is arranged within the passivation layer and along tops of the first doped region and the second doped region.Type: ApplicationFiled: January 5, 2024Publication date: April 25, 2024Inventors: Yin-Kai Liao, Sin-Yi Jiang, Hsiang-Lin Chen, Yi-Shin Chu, Po-Chun Liu, Kuan-Chieh Huang, Jyh-Ming Hung, Jen-Cheng Liu
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Publication number: 20240117070Abstract: Disclosed herein are recombinant antibodies or the fragment thereof for detecting ganglioside GM2 activator (GM2A) protein in vitro. Also disclosed herein are kits and methods for determining whether a subject has or is at risk of developing lung cancer with the aid of the present recombinant antibodies.Type: ApplicationFiled: October 4, 2023Publication date: April 11, 2024Inventors: Jen-Chieh YU, Wen-Chi HUANG
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Publication number: 20240119283Abstract: A method of performing automatic tuning on a deep learning model includes: utilizing an instruction-based learned cost model to estimate a first type of operational performance metrics based on a tuned configuration of layer fusion and tensor tiling; utilizing statistical data gathered during a compilation process of the deep learning model to determine a second type of operational performance metrics based on the tuned configuration of layer fusion and tensor tiling; performing an auto-tuning process to obtain a plurality of optimal configurations based on the first type of operational performance metrics and the second type of operational performance metrics; and configure the deep learning model according to one of the plurality of optimal configurations.Type: ApplicationFiled: October 6, 2023Publication date: April 11, 2024Applicant: MEDIATEK INC.Inventors: Jui-Yang Hsu, Cheng-Sheng Chan, Jen-Chieh Tsai, Huai-Ting Li, Bo-Yu Kuo, Yen-Hao Chen, Kai-Ling Huang, Ping-Yuan Tseng, Tao Tu, Sheng-Je Hung
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Publication number: 20240107414Abstract: This disclosure provides systems, methods and apparatus, including computer programs encoded on computer storage media, for switching a secondary cell to a primary cell. A user equipment (UE) monitors a first radio condition of the UE for beams of a primary cell and a second radio condition for beams of one or more secondary cells configured for the UE in carrier aggregation. The UE transmits a request to configure a candidate beam of at least one candidate secondary cell as a new primary cell in response to the first radio condition not satisfying a first threshold and the second radio condition for the at least one candidate secondary cell satisfying a second threshold. A base station determines to reconfigure at least one secondary cell as the new primary cell. The base station and the UE perform a handover of the UE to the new primary cell.Type: ApplicationFiled: September 23, 2022Publication date: March 28, 2024Inventors: Yu-Chieh HUANG, Kuhn-Chang LIN, Jen-Chun CHANG, Wen-Hsin HSIA, Chia-Jou LU, Sheng-Chih WANG, Chenghsin LIN, Yeong Leong CHOO, Chun-Hsiang CHIU, Chihhung HSIEH, Kai-Chun CHENG, Chung Wei LIN
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Patent number: 11924995Abstract: A water cooling head with sparse and dense fins, including a main body, a first fin set and a second fin set. Wherein a chamber is formed inside the main body, the main body has a first plate and a second plate, the main body forms an inlet channel and an outlet channel, so that the cooling water passes through the chamber. The first fin set and the second fin set are arranged in the chamber, and the first fin set and the second fin set are connected to the first plate respectively. The first fin set comprises several first fins spaced apart, the first fins divide the chamber to form several first channels. The second fin set comprises several second fins spaced apart, the second fins divide the chamber to form several second channels. The water cooling head can increase the overall heat sinking efficiency.Type: GrantFiled: April 23, 2021Date of Patent: March 5, 2024Inventors: Chi-Chuan Wang, Cheng-Chen Cheng, Chuan-Chan Huang, Jen-Chieh Huang
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Patent number: 11915977Abstract: A stacked integrated circuit (IC) device and a method are disclosed. The stacked IC device includes a first semiconductor element. The first substrate includes a dielectric block in the first substrate; and a plurality of first conductive features formed in first inter-metal dielectric layers over the first substrate. The stacked IC device also includes a second semiconductor element bonded on the first semiconductor element. The second semiconductor element includes a second substrate and a plurality of second conductive features formed in second inter-metal dielectric layers over the second substrate. The stacked IC device also includes a conductive deep-interconnection-plug coupled between the first conductive features and the second conductive features. The conductive deep-interconnection-plug is isolated by dielectric block, the first inter-metal-dielectric layers and the second inter-metal-dielectric layers.Type: GrantFiled: April 12, 2021Date of Patent: February 27, 2024Assignee: TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, LTD.Inventors: Shu-Ting Tsai, Jeng-Shyan Lin, Dun-Nian Yaung, Jen-Cheng Liu, Feng-Chi Hung, Chih-Hui Huang, Sheng-Chau Chen, Shih Pei Chou, Chia-Chieh Lin
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Publication number: 20230309243Abstract: The disclosure provides a conductive slurry, which includes a conductive paste comprising polar materials and a hydrophobic agent mixed with the conductive paste. The hydrophobic agent includes solvent and hydrophobic particles. The solvent of the hydrophobic agent includes a non-polar material.Type: ApplicationFiled: March 22, 2023Publication date: September 28, 2023Applicant: Lite-On Technology CorporationInventor: Jen-Chieh Huang
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Publication number: 20230271073Abstract: A bicycle trainer includes a base having a base portion and a standing portion, a supporting frame rotationally pivoted on the standing portion of the base around an axle, a cassette module mounted on the supporting frame and having multiple sprockets, and a flywheel module mounted on the supporting frame. A height adjusting member includes the standing portion, the supporting frame and a fixing element. The fixing element is placed in or between the standing portion and the supporting frame for keeping the supporting frame at a predetermined angle with respect to the standing portion.Type: ApplicationFiled: February 23, 2023Publication date: August 31, 2023Inventors: Hsiao-Wen HSU, Jen-Chieh HUANG, Chao-Wen CHEN, Chin-Lai HUANG, Wen-Hai LO
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Publication number: 20220346269Abstract: A water cooling head with sparse and dense fins, including a main body, a first fin set and a second fin set. Wherein a chamber is formed inside the main body, the main body has a first plate and a second plate, the main body forms an inlet channel and an outlet channel, so that the cooling water passes through the chamber. The first fin set and the second fin set are arranged in the chamber, and the first fin set and the second fin set are connected to the first plate respectively. The first fin set comprises several first fins spaced apart, the first fins divide the chamber to form several first channels. The second fin set comprises several second fins spaced apart, the second fins divide the chamber to form several second channels. The water cooling head can increase the overall heat sinking efficiency.Type: ApplicationFiled: April 23, 2021Publication date: October 27, 2022Inventors: Chi-Chuan WANG, Cheng-Chen CHENG, Chuan-Chan HUANG, Jen-Chieh HUANG
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Patent number: 11437206Abstract: A waterproof pressing structure including a first membrane, at least one first contact, a second membrane, at least one second contact, an insulation layer and a hydrophobic material is provided. The first contact is located on the first membrane, the second contact is located on the second membrane, and the insulation layer is interposed between the first membrane and the second membrane, wherein the first membrane, the second membrane and the insulation layer are stacked in a vertical direction, and the hydrophobic material is respectively formed on the two surfaces of the first contact and the second contact to form a low surface tension zone between the first contact and the second contact.Type: GrantFiled: January 21, 2021Date of Patent: September 6, 2022Inventor: Jen-Chieh Huang
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Publication number: 20210350986Abstract: A waterproof pressing structure including a first membrane, at least one first contact, a second membrane, at least one second contact, an insulation layer and a hydrophobic material is provided. The first contact is located on the first membrane, the second contact is located on the second membrane, and the insulation layer is interposed between the first membrane and the second membrane, wherein the first membrane, the second membrane and the insulation layer are stacked in a vertical direction, and the hydrophobic material is respectively formed on the two surfaces of the first contact and the second contact to form a low surface tension zone between the first contact and the second contact.Type: ApplicationFiled: January 21, 2021Publication date: November 11, 2021Inventor: Jen-Chieh HUANG
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Patent number: 10925183Abstract: A 3D extended cooling mechanism includes cabinet, air intake module, heat exchange module including heat exchanger, air baffle and bottom plate, first wind tunnel defined above the air baffle, second wind tunnel defined between air baffle and bottom plate and third wind tunnel defined between bottom plate and bottom of cabinet. First, second and third wind tunnels accept the air drawn by air intake module to form a respective cold air stream. Heat exchanger accepts cold air stream of first wind tunnel for heat exchange, enabling hot air produced in heat exchange to be delivered to air outlet of cabinet for discharge. First, second, and third wind tunnels are designed to dissipate the relatively low temperature airflow into high temperature sensitive heat source components in the longitudinal direction and the lateral direction so that heat source elements can be efficiently dissipated at the same time to achieve three-dimensional expansion cooling.Type: GrantFiled: February 21, 2019Date of Patent: February 16, 2021Assignee: ADLINK TECHNOLOGY INC.Inventors: Hsuan-Chan Chiang, Guan-Yi Wang, Jen-Chieh Huang
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Patent number: 10910175Abstract: The disclosure provides a key structure, including a carrier, a buffer layer, a circuit film, a balance rod and a key cap. The carrier includes a body and a positioning element protruding from the body. The positioning element has a positioning hole. The buffer layer is disposed around the positioning hole. The circuit film and the balance rod are disposed on the body. The balance rod has an opposite first end portion and a second end portion. The first end portion passes through the positioning hole and presses against the buffer layer. The key cap is connected with the second end portion, and the circuit film and the balance rod are positioned between the key cap and the body.Type: GrantFiled: April 18, 2019Date of Patent: February 2, 2021Assignees: LITE-ON ELECTRONICS (GUANGZHOU) LIMITED, Lite-On Technology CorporationInventors: Kuan-Ming Huang, Jen-Chieh Huang
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Patent number: 10825621Abstract: A keyboard key structure includes a plurality of keycaps. Each keycap has a keycap body and an outward layer. The keycap body has an appearance with a first color. The outward layer has an appearance with a second color different from the first color. The outward layer is formed above the keycap body. The outward layer is formed with an engraving portion. The first color is exposed in the engraving portion. The present invention also provides a method of manufacturing a keycap of a keyboard key.Type: GrantFiled: February 25, 2016Date of Patent: November 3, 2020Assignees: LITE-ON ELECTRONICS (GUANGZHOU) LIMITED, LITE-ON TECHNOLOGY CORPORATIONInventors: Che-Hui Tsai, Te-Wei Li, Chieh-Liang Hsiao, Jen-Chieh Huang
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Publication number: 20200275584Abstract: A 3D extended cooling mechanism includes cabinet, air intake module, heat exchange module including heat exchanger, air baffle and bottom plate, first wind tunnel defined above the air baffle, second wind tunnel defined between air baffle and bottom plate and third wind tunnel defined between bottom plate and bottom of cabinet. First, second and third wind tunnels accept the air drawn by air intake module to form a respective cold air stream. Heat exchanger accepts cold air stream of first wind tunnel for heat exchange, enabling hot air produced in heat exchange to be delivered to air outlet of cabinet for discharge. First, second, and third wind tunnels are designed to dissipate the relatively low temperature airflow into high temperature sensitive heat source components in the longitudinal direction and the lateral direction so that heat source elements can be efficiently dissipated at the same time to achieve three-dimensional expansion cooling.Type: ApplicationFiled: February 21, 2019Publication date: August 27, 2020Inventors: Hsuan-Chan CHIANG, Guan-Yi WANG, Jen-Chieh HUANG
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Publication number: 20200066466Abstract: The disclosure provides a key structure, including a carrier, a buffer layer, a circuit film, a balance rod and a key cap. The carrier includes a body and a positioning element protruding from the body. The positioning element has a positioning hole. The buffer layer is disposed around the positioning hole. The circuit film and the balance rod are disposed on the body. The balance rod has an opposite first end portion and a second end portion. The first end portion passes through the positioning hole and presses against the buffer layer. The key cap is connected with the second end portion, and the circuit film and the balance rod are positioned between the key cap and the body.Type: ApplicationFiled: April 18, 2019Publication date: February 27, 2020Applicants: LITE-ON ELECTRONICS (GUANGZHOU) LIMITED, Lite-On Technology CorporationInventors: Kuan-Ming Huang, Jen-Chieh Huang
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Publication number: 20170076881Abstract: A keyboard key structure includes a plurality of keycaps. Each keycap has a keycap body and an outward layer. The keycap body has an appearance with a first color. The outward layer has an appearance with a second color different from the first color. The outward layer is formed above the keycap body. The outward layer is formed with an engraving portion. The first color is exposed in the engraving portion. The present invention also provides a method of manufacturing a keycap of a keyboard key.Type: ApplicationFiled: February 25, 2016Publication date: March 16, 2017Inventors: CHE-HUI TSAI, TE-WEI LI, CHIEH-LIANG HSIAO, JEN-CHIEH HUANG
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Patent number: 8769367Abstract: A wireless communications device for IP address negotiations is provided and comprises a wireless module, a connection device, and a processing unit. The wireless module provides wireless communications from and to a service network. The connection device is coupled to the terminal device. The processing unit is coupled to the connection device and the wireless module, receiving an IP address request message from the terminal device via the connection device, and requests an IP address and a DNS address from the service network via the wireless module in response to an IP address request message from the terminal device. Also, the processing unit determines whether allocated IP address and DNS address have been received from the service network, and sends a rejection message to the terminal device to trigger the terminal device to resend the IP address request message in response to determining that the allocated IP address and DNS address have not been received from the service network.Type: GrantFiled: January 28, 2010Date of Patent: July 1, 2014Assignee: Mediatek Inc.Inventors: Jen-Chieh Huang, Yuan-Chieh Lin
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Publication number: 20130336204Abstract: A control method for a wireless communications device supporting a specific protocol includes detecting a data transfer speed at a physical layer of the wireless communications device regarding an architecture of the specific protocol, and accordingly generating a detection result; and adjusting queuing data volume of the wireless communications device according to the detection result. An associated control module for the wireless communications device is also provided. The associated control module includes a speed detection unit for performing the operation of detecting the data transfer speed at the physical layer of the wireless communications device, and a control unit for performing the operation of adjusting the queuing data volume of the wireless communications device.Type: ApplicationFiled: June 13, 2012Publication date: December 19, 2013Inventors: Jen-Chieh Huang, Ying-Chieh Liao, Yu-Ting Chen, Tsung-Chieh Chang
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Publication number: 20130312940Abstract: A heat dissipating device disposed on a heat source and in a flow channel is disclosed. The heat dissipating device includes a first fin set, a second fin set, and a baffle. The first fin set is disposed at an entrance of the flow channel, and the second fin set is disposed at an exit of the flow channel. The baffle is disposed between the first fin set and the second fin set, and divides the flow channel into a first flow channel and a second flow channel. The sectional area of the entrance of the first flow channel is larger than that of the exit of the first flow channel. The sectional area of the entrance of the second flow channel is smaller than that of the exit of the second flow channel.Type: ApplicationFiled: May 22, 2013Publication date: November 28, 2013Applicant: Celestica Technology Consultancy (Shanghai) Co., Ltd.Inventor: Jen Chieh HUANG