Patents by Inventor Jen-Chih CHENG
Jen-Chih CHENG has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).
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Publication number: 20240107414Abstract: This disclosure provides systems, methods and apparatus, including computer programs encoded on computer storage media, for switching a secondary cell to a primary cell. A user equipment (UE) monitors a first radio condition of the UE for beams of a primary cell and a second radio condition for beams of one or more secondary cells configured for the UE in carrier aggregation. The UE transmits a request to configure a candidate beam of at least one candidate secondary cell as a new primary cell in response to the first radio condition not satisfying a first threshold and the second radio condition for the at least one candidate secondary cell satisfying a second threshold. A base station determines to reconfigure at least one secondary cell as the new primary cell. The base station and the UE perform a handover of the UE to the new primary cell.Type: ApplicationFiled: September 23, 2022Publication date: March 28, 2024Inventors: Yu-Chieh HUANG, Kuhn-Chang LIN, Jen-Chun CHANG, Wen-Hsin HSIA, Chia-Jou LU, Sheng-Chih WANG, Chenghsin LIN, Yeong Leong CHOO, Chun-Hsiang CHIU, Chihhung HSIEH, Kai-Chun CHENG, Chung Wei LIN
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Patent number: 11927400Abstract: This disclosure relates to a method for fabricating a vapor chamber. The method includes positioning a capillary structure on a first cover, forming an accommodation space, a flow channel, and a plurality of posts on a first surface of a second cover, covering the first cover with the second cover, positioning the first cover and the second cover such that the plurality of posts are spaced apart from the capillary structure by a distance, and pressure welding the first cover and the second cover so as to form a chamber between the first cover and second cover and a passage connected to the chamber and to pressure weld the plurality of posts with the capillary structure.Type: GrantFiled: April 13, 2023Date of Patent: March 12, 2024Assignee: COOLER MASTER CO., LTD.Inventors: Jen-Chih Cheng, Lei-Lei Liu
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Patent number: 11913725Abstract: A heat dissipation device includes a first casing and a second casing coupled to the first casing. The second casing includes a body having an inner surface and an outer surface opposite the inner surface, and a first portion and a second portion, each of the first and second portions having a different cross-sectional area. The heat dissipation device further includes a plurality of columns on the inner surface, and a first wick structure disposed on the inner surface and in the first portion and the second portion.Type: GrantFiled: December 11, 2019Date of Patent: February 27, 2024Assignee: COOLER MASTER CO., LTD.Inventor: Jen-Chih Cheng
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Patent number: 11885571Abstract: A pulsating vapor chamber has an inner board, a first outer board, a second outer board, an asymmetric loop, and a working fluid. The inner board has a first surface and a second surface. The first and second outer boards are mounted on the first surface and the second surface of the inner board respectively. The asymmetric loop is located between the first and second outer boards and has multiple channels communicating with each other in sequence. A part of the channels are formed between the first outer board and the inner board, and the remaining channels are formed between the second outer board and the inner board. With the asymmetric loop, even if the vapor chamber is disposed horizontally, pressure may be changed by different amount in the channels so that the working fluid is still able to oscillate or circulate.Type: GrantFiled: November 25, 2020Date of Patent: January 30, 2024Assignee: Cooler Master Co., Ltd.Inventor: Jen-Chih Cheng
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Publication number: 20230304752Abstract: A universal mounting mechanism including a mounting bracket configured to mount a liquid-cooling heat exchange apparatus to a substrate or an electronic component and at least one universal fastener assembly is provided. The at least one universal fastener assembly is orthogonally assembled through the mounting bracket. The liquid-cooling heat exchange apparatus includes a first liquid-cooling heat exchange apparatus having a first waterblock set or a second liquid-cooling heat exchange apparatus having a second waterblock set. The first waterblock set has a first block thickness, and the second waterblock set has a second block thickness. The substrate or the electronic component includes receiving portions having a fastened thickness. A thickness of the second block thickness and the fastened thickness is greater than a thickness of the first block thickness and the fastened thickness.Type: ApplicationFiled: February 21, 2023Publication date: September 28, 2023Inventors: Bo-zhang Chen, Jen-chih Cheng
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Publication number: 20230296333Abstract: A heat dissipation device includes a body including a first metal sheet and a second metal sheet coupled to the first metal sheet. The first metal sheet at least partially defines a first channel including a first plurality of curves, a second channel including a second plurality of curves, and an interconnecting channel fluidly coupled to the first channel and the second channel. The first channel and the interconnecting channel at least partially surround the second channel, a unit volume of the first channel is a same as a unit volume of the interconnecting channel, and the unit volumes of the first channel and the interconnecting channel are different from a unit volume of the second channel.Type: ApplicationFiled: May 26, 2023Publication date: September 21, 2023Inventor: Jen-chih Cheng
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Publication number: 20230251044Abstract: This disclosure relates to a method for fabricating a vapor chamber. The method includes positioning a capillary structure on a first cover, forming an accommodation space, a flow channel, and a plurality of posts on a first surface of a second cover, covering the first cover with the second cover, positioning the first cover and the second cover such that the plurality of posts are spaced apart from the capillary structure by a distance, and pressure welding the first cover and the second cover so as to form a chamber between the first cover and second cover and a passage connected to the chamber and to pressure weld the plurality of posts with the capillary structure.Type: ApplicationFiled: April 13, 2023Publication date: August 10, 2023Applicant: COOLER MASTER CO., LTD.Inventors: Jen-Chih CHENG, Lei-Lei LIU
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Patent number: 11703287Abstract: A heat dissipation device includes a body including a first metal sheet and a second metal sheet coupled to the first metal sheet. The first metal sheet at least partially defines a first channel including a first plurality of curves, a second channel including a second plurality of curves, and an interconnecting channel fluidly coupled to the first channel and the second channel. The first channel and the interconnecting channel at least partially surround the second channel, a unit volume of the first channel is a same as a unit volume of the interconnecting channel, and the unit volumes of the first channel and the interconnecting channel are different from a unit volume of the second channel.Type: GrantFiled: January 21, 2021Date of Patent: July 18, 2023Assignee: COOLER MASTER CO., LTD.Inventor: Jen-chih Cheng
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Patent number: 11662155Abstract: A pulse loop heat exchanger, under vacuum, having a working fluid therein, comprising a heat exchanger body, a first continuity plate, and a second continuity plate is provided. The heat exchanger body, first continuity plate comprises a plurality of channels and grooves on different elevated plane levels, respectfully. The different elevated plane levels result in increased output pressure gain in downward working fluid flow portions of the grooves, boosting thermo-fluidic transport oscillation driving forces throughout the heat exchanger. In addition to providing for fluid transport and boosting oscillation driving forces, the third elevated continuity channel also provides an internal reservoir. The heat exchanger is formed by an aluminum extrusion and stamping process and comprises three main steps, a providing step, a closing and welding step, and an insertion, vacuuming and closing step.Type: GrantFiled: February 1, 2022Date of Patent: May 30, 2023Assignee: COOLER MASTER CO., LTD.Inventor: Jen-chih Cheng
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Patent number: 11659690Abstract: A fixing structure of a heat dissipation device is provided. The fixing structure has a plate portion and at least one fixing set. The plate portion forms an opening and at least one groove. The opening and the groove form through the plate portion. The opening is configured to fix a heat dissipation assembly. The fixing set is mounted through the groove and can be moved in an extending direction of the groove and a direction perpendicular to the plate portion. The shape of the groove may correspond to various locations of the fixing hole on the various substrates. The fixing set can be moved in the groove to align various fixing holes of the substrate. In other words, with the movable fixing sets, the fixing structure can be mounted on various substrates or correspond to the electronic component in various shapes and dimensions.Type: GrantFiled: July 22, 2021Date of Patent: May 23, 2023Assignee: Cooler Master Co., Ltd.Inventors: Jen-Chih Cheng, Shui-Fa Tsai
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Publication number: 20220369500Abstract: A fixing structure of a heat dissipation device is provided. The fixing structure has a plate portion and at least one fixing set. The plate portion forms an opening and at least one groove. The opening and the groove form through the plate portion. The opening is configured to fix a heat dissipation assembly. The fixing set is mounted through the groove and can be moved in an extending direction of the groove and a direction perpendicular to the plate portion. The shape of the groove may correspond to various locations of the fixing hole on the various substrates. The fixing set can be moved in the groove to align various fixing holes of the substrate. In other words, with the movable fixing sets, the fixing structure can be mounted on various substrates or correspond to the electronic component in various shapes and dimensions.Type: ApplicationFiled: July 22, 2021Publication date: November 17, 2022Inventors: Jen-Chih Cheng, Shui-Fa Tsai
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Publication number: 20220155024Abstract: A pulse loop heat exchanger, under vacuum, having a working fluid therein, comprising a heat exchanger body, a first continuity plate, and a second continuity plate is provided. The heat exchanger body, first continuity plate comprises a plurality of channels and grooves on different elevated plane levels, respectfully. The different elevated plane levels result in increased output pressure gain in downward working fluid flow portions of the grooves, boosting thermo-fluidic transport oscillation driving forces throughout the heat exchanger. In addition to providing for fluid transport and boosting oscillation driving forces, the third elevated continuity channel also provides an internal reservoir. The heat exchanger is formed by an aluminum extrusion and stamping process and comprises three main steps, a providing step, a closing and welding step, and an insertion, vacuuming and closing step.Type: ApplicationFiled: February 1, 2022Publication date: May 19, 2022Applicant: COOLER MASTER CO., LTD.Inventor: Jen-chih CHENG
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Publication number: 20220155023Abstract: A heat dissipation device includes a first casing and a second casing coupled to the first casing. The second casing includes a body having an inner surface and an outer surface opposite the inner surface, and a first portion and a second portion, each of the first and second portions having a different cross-sectional area. The heat dissipation device further includes a plurality of columns on the inner surface, and a first wick structure disposed on the inner surface and in the first portion and the second portion.Type: ApplicationFiled: February 4, 2022Publication date: May 19, 2022Inventors: Xuemei WANG, Xiong ZHANG, Jen-Chih CHENG
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Patent number: 11320211Abstract: A heat dissipation device, includes a vapor chamber including a heat conduction chamber and a first wick structure, the heat conduction chamber having a recessed portion, and the first wick structure disposed in the heat conduction chamber; and a heat pipe including a pipe body and a second wick structure disposed in the pipe body, the pipe body positioned in the recessed portion of the heat conduction chamber. The first wick structure and the second wick structure are metallically bonded.Type: GrantFiled: August 31, 2018Date of Patent: May 3, 2022Assignee: COOLER MASTER CO., LTD.Inventors: Lei-Lei Liu, Xiao-Min Zhang, Jen-Chih Cheng
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Patent number: 11255610Abstract: A pulse loop heat exchanger, under vacuum, having a working fluid therein, comprising a heat exchanger body, a first continuity plate, and a second continuity plate is provided. The heat exchanger body, first continuity plate and second continuity plate comprise a plurality of channels and grooves on different elevated plane levels, respectfully. The different elevated plane levels result in increased output pressure gain in downward working fluid flow portions of the grooves, boosting thermo-fluidic transport oscillation driving forces throughout the heat exchanger. The second continuity plate comprises a second continuity plate attachment surface having a third elevated continuity channel. In addition to providing for fluid transport and boosting oscillation driving forces, the third elevated continuity channel also provides an internal reservoir.Type: GrantFiled: July 22, 2020Date of Patent: February 22, 2022Assignee: COOLER MASTER CO., LTD.Inventor: Jen-chih Cheng
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Publication number: 20210222964Abstract: A heat dissipation device includes a body including a first metal sheet and a second metal sheet coupled to the first metal sheet. The first metal sheet at least partially defines a first channel including a first plurality of curves, a second channel including a second plurality of curves, and an interconnecting channel fluidly coupled to the first channel and the second channel. The first channel and the interconnecting channel at least partially surround the second channel, a unit volume of the first channel is a same as a unit volume of the interconnecting channel, and the unit volumes of the first channel and the interconnecting channel are different from a unit volume of the second channel.Type: ApplicationFiled: January 21, 2021Publication date: July 22, 2021Inventor: Jen-chih Cheng
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Publication number: 20210222955Abstract: A pulse loop heat exchanger, under vacuum, having a working fluid therein, comprising a heat exchanger body, a first continuity plate, and a second continuity plate is provided. The heat exchanger body, first continuity plate and second continuity plate comprise a plurality of channels and grooves on different elevated plane levels, respectfully. The different elevated plane levels result in increased output pressure gain in downward working fluid flow portions of the grooves, boosting thermo-fluidic transport oscillation driving forces throughout the heat exchanger. The second continuity plate comprises a second continuity plate attachment surface having a third elevated continuity channel. In addition to providing for fluid transport and boosting oscillation driving forces, the third elevated continuity channel also provides an internal reservoir.Type: ApplicationFiled: July 22, 2020Publication date: July 22, 2021Applicant: COOLER MASTER CO., LTD.Inventor: Jen-chih CHENG
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Publication number: 20210080190Abstract: A pulsating vapor chamber has an inner board, a first outer board, a second outer board, an asymmetric loop, and a working fluid. The inner board has a first surface and a second surface. The first and second outer boards are mounted on the first surface and the second surface of the inner board respectively. The asymmetric loop is located between the first and second outer boards and has multiple channels communicating with each other in sequence. A part of the channels are formed between the first outer board and the inner board, and the remaining channels are formed between the second outer board and the inner board. With the asymmetric loop, even if the vapor chamber is disposed horizontally, pressure may be changed by different amount in the channels so that the working fluid is still able to oscillate or circulate.Type: ApplicationFiled: November 25, 2020Publication date: March 18, 2021Applicant: COOLER MASTER CO., LTD.Inventor: Jen-Chih CHENG
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Patent number: 10883768Abstract: A pulsating vapor chamber has an inner board, a first outer board, a second outer board, an asymmetric loop, and a working fluid. The inner board has a first surface and a second surface. The first and second outer boards are mounted on the first surface and the second surface of the inner board respectively. The asymmetric loop is located between the first and second outer boards and has multiple channels communicating with each other in sequence. A part of the channels are formed between the first outer board and the inner board, and the remaining channels are formed between the second outer board and the inner board. With the asymmetric loop, even if the vapor chamber is disposed horizontally, pressure may be changed by different amount in the channels so that the working fluid is still able to oscillate or circulate.Type: GrantFiled: October 11, 2018Date of Patent: January 5, 2021Assignee: COOLER MASTER CO. LTD.Inventor: Jen-Chih Cheng
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Publication number: 20200400382Abstract: This disclosure relates to a method for fabricating a vapor chamber. The method includes positioning a capillary structure on a first cover, forming an accommodation space, a flow channel, and a plurality of posts on a first surface of a second cover, covering the first cover with the second cover, positioning the first cover and the second cover such that the plurality of posts are spaced apart from the capillary structure by a distance, and pressure welding the first cover and the second cover so as to form a chamber between the first cover and second cover and a passage connected to the chamber and to pressure weld the plurality of posts with the capillary structure.Type: ApplicationFiled: April 1, 2020Publication date: December 24, 2020Inventors: Jen-Chih CHENG, Lei-Lei LIU