Abstract: The present disclosure, in some embodiments, relates an integrated chip. The integrated chip includes a substrate. A through-substrate-via (TSV) extends through the substrate. A dielectric liner separates the TSV from the substrate. The dielectric liner is along one or more sidewalls of the substrate. The TSV includes a horizontally extending surface and a protrusion extending outward from the horizontally extending surface. The TSV has a maximum width along the horizontally extending surface.

Abstract: A smart zipper includes a zipper, a voltage generator, a voltage detector, and a processor. The zipper includes a first left tooth and a first right tooth. The first left tooth is electrically connected to a first left wire and is supplied with a supply voltage. The first right tooth is electrically connected to a first right wire. The voltage generator generates the supply voltage. The voltage detector detects the voltage of the first right wire to generate a first detection signal. The processor determines first coupling information about whether the first left tooth is electrically connected to the first right tooth, according to the first detection signal.

Abstract: A smart zipper includes a zipper, a voltage generator, a voltage detector, and a processor. The zipper includes a first left tooth and a first right tooth. The first left tooth is electrically connected to a first left wire and is supplied with a supply voltage. The first right tooth is electrically connected to a first right wire. The voltage generator generates the supply voltage. The voltage detector detects the voltage of the first right wire to generate a first detection signal. The processor determines first coupling information about whether the first left tooth is electrically connected to the first right tooth, according to the first detection signal.