Patents by Inventor Jen-Chin Wu

Jen-Chin Wu has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Publication number: 20100122515
    Abstract: The poison-filter material of the invention includes a substrate and a metal oxide. The substrate includes numerous holes, and the metal oxide is adhered to a surface of the substrate and the holes. The method for producing the poison-filter material of the invention includes the following steps of sonicating and impregnating a substrate into a metallic salt aqueous solution; and calcining the substrate to form a metal oxide on a surface of the substrate and numerous holes of the substrate, such that the poison-filter material is produced. In the invention, the metallic salt aqueous solution is fully oscillated to impregnate the porous substrate, and metal oxide is formed on the surface and holes of the substrate after high-temperature calcination. Therefore, the adsorbent material of the invention can effectively adsorb noxious gas and lower penetrability of noxious gas.
    Type: Application
    Filed: November 18, 2008
    Publication date: May 20, 2010
    Inventors: Han-Wen Kuo, Jin-Feng Wang, Feng-Mei Fang, Jen-Chin Wu, Shiaw-Ruey Lin, Yuh Sung, Chen-Chia Huang, Chun-Yu Kao, Chien-Hung Chen
  • Publication number: 20100028652
    Abstract: The present invention relates to a metal structure with anti-erosion wear-proof and manufactured method thereof. The metal structure with anti-erosion wear-proof includes a metal substrate; a protective layer formed on the metal substrate, the protective layer has a plurality of openings; and an oxide layer formed on the protective layer. The manufactured method of metal structure with anti-erosion wear-proof includes the steps of providing a metal substrate; forming a protective layer on the metal substrate, the protective layer has a plurality of openings; and forming an oxide layer on the protective layer. The present invention transforms the surface of the protective layer into the oxide layer to increase the anti-erosion and wear-proof character of the metal substrate.
    Type: Application
    Filed: July 29, 2008
    Publication date: February 4, 2010
    Applicant: CHUNG SHAN INSTITUTE OF SCIENCE AND TECHNOLOGY, ARMAMENTS BUREAU, M.N.D.
    Inventors: CHIA-HUA CHANG, JEN-CHIN WU, CHIN-LUNG CHANG, PI-CHUN HO
  • Patent number: 7270732
    Abstract: A method for enhancing bonding strength of a metal spraying thickened layer of electroformed mold inserts includes the following procedures: forming a plurality of stereoscopic reinforced ribs on an electroformed metal shell mold by metal spraying; covering the stereoscopic reinforced ribs and the electroformed metal shell mold to become an integrated body by electroforming; forming a metal thickened layer by metal spraying; forming a second electroformed cover and forming a metal key bond between the electroformed cover and the metal thickened layer. The method of the invention can shorten fabrication time of the electroformed mold insert and improve the mechanical strength and soldering affinity of the metal thickened layer.
    Type: Grant
    Filed: October 21, 2004
    Date of Patent: September 18, 2007
    Assignee: Chung Shan Institute of Science and Technology
    Inventors: Chia-Hua Chang, Jen-Chin Wu
  • Publication number: 20070041097
    Abstract: A method for fabricating a micro-lens mold comprises forming a thick film on a substrate, patterning the thick film to form a micro-capillary, filling the micro-capillary with a heat curing glue liquor, rotating the substrate so that the liquid in the micro-capillary presents a circular arc shape as a micro-lens because of the surface tension of the material itself and the adhesion of the micro-capillary, and curing and shaping the heat curing glue liquor by the irradiation of a light source or by heating.
    Type: Application
    Filed: August 18, 2005
    Publication date: February 22, 2007
    Inventors: Jen-Chin Wu, Hsi-Harng Yang, Chia-Hua Chang, Chi-Haw Chian
  • Publication number: 20070039826
    Abstract: A thickening method of an electroforming shim is provided to increase the thickness of a metal shim. In this embodiment, an active solder with a rare earth element is used to increase the moisture on the substrate surface for the solder during the combining process. Afterwards the oxides of the rare earth element are expelled by mechanical stirring to produce a clean contact surface. The melted fillers moisturize on the substrate surface to achieve the combination.
    Type: Application
    Filed: August 18, 2005
    Publication date: February 22, 2007
    Inventors: Chia-Hua Chang, Cherng-Yuh Su, Jen-Chin Wu, Jun-Lung Hsi
  • Patent number: 7117577
    Abstract: A method is designed to fasten a mold shell with a mold seat without causing the mold shell to crack. The method involves a first step in which a metal shell is formed on a model by electrocasting. The metal shell is then provided with at least one nut therewith by soldering through electrocasting. The metal shell is separated from the model and is then provided with a metal layer of a thickness by arc spraying, with the metal layer circumventing the nut. The mold seat is provided with at least one through hole. The mold shell is fastened with the mold seat by a bolt which is engaged with the nut via the through hole of the mold seat.
    Type: Grant
    Filed: September 29, 2003
    Date of Patent: October 10, 2006
    Assignee: Chung-Shan Institute of Science & Technology
    Inventors: Jen-Chin Wu, Chia-Hua Chang, Ming-Jen Wang
  • Publication number: 20060086615
    Abstract: A method for enhancing bonding strength of a metal spraying thickened layer of electroformed mold inserts includes the following procedures: forming a plurality of stereoscopic reinforced ribs on an electroformed metal shell mold by metal spraying; covering the stereoscopic reinforced ribs and the electroformed metal shell mold to become an integrated body by electroforming; forming a metal thickened layer by metal spraying; forming a second electroformed cover and forming a metal key bond between the electroformed cover and the metal thickened layer. The method of the invention can shorten fabrication time of the electroformed mold insert and improve the mechanical strength and soldering affinity of the metal thickened layer.
    Type: Application
    Filed: October 21, 2004
    Publication date: April 27, 2006
    Inventors: Chia-Hua Chang, Jen-Chin Wu
  • Publication number: 20060086614
    Abstract: A reinforced and thickened mold insert and a method of manufacturing the same include the procedures of: first, providing an original mandrel that has an electroformed metal mold insert; next, forming a plurality of protrusive or indented coupling reinforced sections on the electroformed metal mold insert; finally forming a thickened metal layer on the electroformed metal mold insert and the coupling reinforced sections by metal spraying. The coupling reinforced sections can increase the bonding power between the electroformed metal mold insert and the thickened metal layer.
    Type: Application
    Filed: October 21, 2004
    Publication date: April 27, 2006
    Inventors: Chia-Hua Chang, Jen-Chin Wu, Ming-Jen Wang
  • Publication number: 20050281956
    Abstract: A thermal spraying method is provided for manufacturing anti-sliding plates. The method uses a mask located upon a plate with a specific height. The mask has plural openings of a specific shape. When a thermal spraying device thermal-sprays thread material from the upper side of the mask, melted thread material passes through the openings to form anti-sliding spots of a specific shape on the plate. By means of thermal spraying on the mask with the openings, an anti-sliding plate with high roughness is efficiently produced.
    Type: Application
    Filed: June 18, 2004
    Publication date: December 22, 2005
    Inventors: Chia-Hua Chang, Jen-Chin Wu, Jin-Bao Liu
  • Publication number: 20050066510
    Abstract: A method is designed to fasten a mold shell with a mold seat without causing the mold shell to crack. The method involves a first step in which a metal shell is formed on a model by electrocasting. The metal shell is then provided with at least one nut therewith by soldering through electrocasting. The metal shell is separated from the model and is then provided with a metal layer of a thickness by arc spraying, with the metal layer circumventing the nut. The mold seat is provided with at least one through hole. The mold shell is fastened with the mold seat by a bolt which is engaged with the nut via the through hole of the mold seat.
    Type: Application
    Filed: September 29, 2003
    Publication date: March 31, 2005
    Applicant: Chung-Shan Institute of Science & Technology
    Inventors: Jen-Chin Wu, Chia-Hua Chang, Ming-Jen Wang