Patents by Inventor Jen-Chuan Yeh

Jen-Chuan Yeh has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 8254619
    Abstract: An MEM microphone carrier module is composed of a substrate and a cover plate. The substrate includes a space layer, a bottom layer, a recession recessed from a top side of the space layer, and a groove formed in the recession. The bottom layer has a metallic plate defining a predetermined pattern and exposed outside a surface thereof. The bottom layer is a single-layer structure formed by the molding of the metallic plate and the insulating glue, such that the substrate is thinner to need lower production cost and take less assembly time than the prior art.
    Type: Grant
    Filed: August 13, 2010
    Date of Patent: August 28, 2012
    Assignee: Lingsen Precision Industries Ltd.
    Inventors: Jen-Chuan Yeh, Jyong-Yue Tian, Kuo-Ting Lee
  • Patent number: 8238107
    Abstract: A cap for a MEMS package includes a main body having a bottom surface, a top surface, a plurality of accommodations recessed from the bottom surface towards the top surface, and a plurality of slots recessed from the top surface towards the bottom surface in a way that the top surface is defined into a plurality of regions corresponding to the accommodations respectively. After completion of the MEMS package, the package can be cut along the slots into a plurality of MEMS package units, such that the cutting work can be done quickly and the cutting burrs can be minimized.
    Type: Grant
    Filed: February 26, 2010
    Date of Patent: August 7, 2012
    Assignee: Lingsen Precision Industries, Ltd
    Inventors: Jen-Chuan Yeh, Kuo-Ting Lee
  • Publication number: 20110293119
    Abstract: An MEM microphone carrier module is composed of a substrate and a cover plate. The substrate includes a space layer, a bottom layer, a recession recessed from a top side of the space layer, and a groove formed in the recession. The bottom layer has a metallic plate defining a predetermined pattern and exposed outside a surface thereof. The bottom layer is a single-layer structure formed by the molding of the metallic plate and the insulating glue, such that the substrate is thinner to need lower production cost and take less assembly time than the prior art.
    Type: Application
    Filed: August 13, 2010
    Publication date: December 1, 2011
    Applicant: LINGSEN PRECISION INDUSTRIES LTD.
    Inventors: Jen-Chuan YEH, Jyong-Yue Tian, Kuo-Ting Lee
  • Publication number: 20110180924
    Abstract: A MEMS module package includes a carrier, a lid capped on the carrier, a spacer disposed between the carrier and the lid, and a chip mounted on the spacer and electrically connected with the carrier. The spacer has a channel in communication between a chamber and a receiving hole of the lid, and the chip is received in the chamber of the lid and corresponding to the channel of the spacer. Therefore, an external signal can be transmitted from the receiving hole of the lid into the chamber of the lid through the channel of the spacer so as be received by the chip.
    Type: Application
    Filed: February 18, 2010
    Publication date: July 28, 2011
    Applicant: LINGSEN PRECISION INDUSTRIES, LTD.
    Inventors: Jyong-Yue TIAN, Jen-Chuan Yeh
  • Publication number: 20110174532
    Abstract: A cap for a MEMS package includes a main body having a bottom surface, a top surface, a plurality of accommodations recessed from the bottom surface towards the top surface, and a plurality of slots recessed from the top surface towards the bottom surface in a way that the top surface is defined into a plurality of regions corresponding to the accommodations respectively. After completion of the MEMS package, the package can be cut along the slots into a plurality of MEMS package units, such that the cutting work can be done quickly and the cutting burrs can be minimized.
    Type: Application
    Filed: February 26, 2010
    Publication date: July 21, 2011
    Applicant: LINGSEN PRECISION INDUSTRIES LTD.
    Inventors: Jen-Chuan YEH, Kuo-Ting Lee
  • Patent number: 6742931
    Abstract: A rolling ball separator structure of a linear drive member includes multiple separators mounted between the multiple rolling balls and each having a body and an outer ring structure. Thus, the body may be deformed elastically, thereby preventing the multiple separators from interfering with the return face of the rolling path during the returning process of the rolling balls, and thereby absorbing the gap variation of the uneven force during the returning process of the rolling balls, and the outer ring structure may maintain the relative position of the rolling balls, so that the rolling balls will not collide directly during the returning process.
    Type: Grant
    Filed: April 29, 2002
    Date of Patent: June 1, 2004
    Assignee: Hiwin Technologies Corp.
    Inventors: Chau-Chang Chou, Binghung Luo, Jen-Chuan Yeh
  • Publication number: 20030190098
    Abstract: A rolling ball separator structure of a linear drive member includes multiple separators mounted between the multiple rolling balls and each having a body and an outer ring structure. Thus, the body may be deformed elastically, thereby preventing the multiple separators from interfering with the return face of the rolling path during the returning process of the rolling balls, and thereby absorbing the gap variation of the uneven force during the returning process of the rolling balls, and the outer ring structure may maintain the relative position of the rolling balls, so that the rolling balls will not collide directly during the returning process.
    Type: Application
    Filed: April 29, 2002
    Publication date: October 9, 2003
    Inventors: Chau-Chang Chou, Binghung Luo, Jen-Chuan Yeh