Patents by Inventor Jen-Chun Wen

Jen-Chun Wen has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 12218419
    Abstract: An antenna module, comprising: a first antenna device, which is an AiM (Antenna in Module) and comprises at least one first antenna; a first FPC (flexible printed circuit), coupled to an outer surface of the first antenna device via a conductive structure; and at least one second antenna device, coupled to the first FPC, comprising at least one second antenna. By this way, an antenna module which can change directions of antennas via simplified structures is provided. Further, an antenna system applying the antenna module is also provided.
    Type: Grant
    Filed: December 20, 2022
    Date of Patent: February 4, 2025
    Assignee: MEDIATEK INC.
    Inventors: Chia-Yen Wei, Jen-Chun Wen
  • Publication number: 20230216186
    Abstract: An antenna module, comprising: a first antenna device, which is an AiM (Antenna in Module) and comprises at least one first antenna; a first FPC (flexible printed circuit), coupled to an outer surface of the first antenna device via a conductive structure; and at least one second antenna device, coupled to the first FPC, comprising at least one second antenna. By this way, an antenna module which can change directions of antennas via simplified structures is provided. Further, an antenna system applying the antenna module is also provided.
    Type: Application
    Filed: December 20, 2022
    Publication date: July 6, 2023
    Applicant: MEDIATEK INC.
    Inventors: Chia-Yen Wei, Jen-Chun Wen