Patents by Inventor Jen-Chung Chiu

Jen-Chung Chiu has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Publication number: 20230386778
    Abstract: The current disclosure is directed to a repellent electrode used in a source arc chamber of an ion implanter. The repellent electrode includes a shaft and a repellent body having a repellent surface. The repellent surface has a surface shape that substantially fits the shape of the inner chamber space of the source arc chamber where the repellent body is positioned. A gap between the edge of the repellent body and the inner sidewall of the source arc chamber is minimized to a threshold level that is maintained to avoid a short between the conductive repellent body and the conductive inner sidewall of the source arc chamber.
    Type: Application
    Filed: August 10, 2023
    Publication date: November 30, 2023
    Inventors: Ching-Heng YEN, Jen-Chung CHIU, Tai-Kun KAO, Lu-Hsun LIN, Tsung-Min LIN
  • Patent number: 11830700
    Abstract: The current disclosure is directed to a repellent electrode used in a source arc chamber of an ion implanter. The repellent electrode includes a shaft and a repellent body having a repellent surface. The repellent surface has a surface shape that substantially fits the shape of the inner chamber space of the source arc chamber where the repellent body is positioned. A gap between the edge of the repellent body and the inner sidewall of the source arc chamber is minimized to a threshold level that is maintained to avoid a short between the conductive repellent body and the conductive inner sidewall of the source arc chamber.
    Type: Grant
    Filed: March 11, 2022
    Date of Patent: November 28, 2023
    Assignee: Taiwan Semiconductor Manufacturing Co., Ltd.
    Inventors: Ching-Heng Yen, Jen-Chung Chiu, Tai-Kun Kao, Lu-Hsun Lin, Tsung-Min Lin
  • Publication number: 20220199351
    Abstract: The current disclosure is directed to a repellent electrode used in a source arc chamber of an ion implanter. The repellent electrode includes a shaft and a repellent body having a repellent surface. The repellent surface has a surface shape that substantially fits the shape of the inner chamber space of the source arc chamber where the repellent body is positioned. A gap between the edge of the repellent body and the inner sidewall of the source arc chamber is minimized to a threshold level that is maintained to avoid a short between the conductive repellent body and the conductive inner sidewall of the source arc chamber.
    Type: Application
    Filed: March 11, 2022
    Publication date: June 23, 2022
    Inventors: Ching-Heng YEN, Jen-Chung CHIU, Tai-Kun KAO, Lu-Hsun LIN, Tsung-Min LIN
  • Patent number: 11295926
    Abstract: The current disclosure is directed to a repellent electrode used in a source arc chamber of an ion implanter. The repellent electrode includes a shaft and a repellent body having a repellent surface. The repellent surface has a surface shape that substantially fits the shape of the inner chamber space of the source arc chamber where the repellent body is positioned. A gap between the edge of the repellent body and the inner sidewall of the source arc chamber is minimized to a threshold level that is maintained to avoid a short between the conductive repellent body and the conductive inner sidewall of the source arc chamber.
    Type: Grant
    Filed: November 27, 2019
    Date of Patent: April 5, 2022
    Assignee: Taiwan Semiconductor Manufacturing Co., Ltd.
    Inventors: Ching-Heng Yen, Jen-Chung Chiu, Tai-Kun Kao, Lu-Hsun Lin, Tsung-Min Lin
  • Publication number: 20200211809
    Abstract: The current disclosure is directed to a repellent electrode used in a source arc chamber of an ion implanter. The repellent electrode includes a shaft and a repellent body having a repellent surface. The repellent surface has a surface shape that substantially fits the shape of the inner chamber space of the source arc chamber where the repellent body is positioned. A gap between the edge of the repellent body and the inner sidewall of the source arc chamber is minimized to a threshold level that is maintained to avoid a short between the conductive repellent body and the conductive inner sidewall of the source arc chamber.
    Type: Application
    Filed: November 27, 2019
    Publication date: July 2, 2020
    Inventors: Ching-Heng YEN, Jen-Chung CHIU, Tai-Kun KAO, Lu-Hsun LIN, Tsung-Min LIN
  • Patent number: 10319557
    Abstract: Ion generators for ion implanters are provided. The ion generator for an ion implanter includes an ion source arc chamber including an arc chamber housing and a thermal electron emitter coupled to the arc chamber housing. In addition, the thermal electron emitter includes a filament and a cathode, and the cathode has a solid top portion made of a work function modified conductive material including tungsten (W) and a work function modification metal.
    Type: Grant
    Filed: August 31, 2017
    Date of Patent: June 11, 2019
    Assignee: TAIWAN SEMICONDUCTOR MANUFACTURING CO., LTD.
    Inventors: Tai-Kun Kao, Tsung-Min Lin, Jen-Chung Chiu, Ren-Dou Lee
  • Publication number: 20190066967
    Abstract: Ion generators for ion implanters are provided. The ion generator for an ion implanter includes an ion source arc chamber including an arc chamber housing and a thermal electron emitter coupled to the arc chamber housing. In addition, the thermal electron emitter includes a filament and a cathode, and the cathode has a solid top portion made of a work function modified conductive material including tungsten (W) and a work function modification metal.
    Type: Application
    Filed: August 31, 2017
    Publication date: February 28, 2019
    Applicant: Taiwan Semiconductor Manufacturing Co., Ltd.
    Inventors: Tai-Kun KAO, Tsung-Min LIN, Jen-Chung CHIU, Ren-Dou LEE
  • Publication number: 20170243719
    Abstract: A method for generating an ion beam in an ion implantation process is provided. The method includes supplying a working gas into a first portion of an arc chamber which is separated from a second portion of the arc chamber by an intermediate plate. The method further includes guiding the working gas into the second portion of the arc chamber via a plurality of gas outlets formed at two opposite edges of the intermediate plate. The method also includes generating an ion beam from the working gas in the second portion of the arc chamber.
    Type: Application
    Filed: November 3, 2016
    Publication date: August 24, 2017
    Inventors: Tai-Kun KAO, Tsung-Min LIN, Jen-Chung CHIU
  • Patent number: 9741537
    Abstract: A method for generating an ion beam in an ion implantation process is provided. The method includes supplying a working gas into a first portion of an arc chamber which is separated from a second portion of the arc chamber by an intermediate plate. The method further includes guiding the working gas into the second portion of the arc chamber via a plurality of gas outlets formed at two opposite edges of the intermediate plate. The method also includes generating an ion beam from the working gas in the second portion of the arc chamber.
    Type: Grant
    Filed: November 3, 2016
    Date of Patent: August 22, 2017
    Assignee: TAIWAN SEMICONDUCTOR MANUFACTURING CO., LTD.
    Inventors: Tai-Kun Kao, Tsung-Min Lin, Jen-Chung Chiu