Abstract: The invention provides a metal thermal interface material (TIM) with through-holes in its body and/or zigzags or wave shapes on its border, which is suitable for use at thermal interfaces of a thermal conduction path from an integrated circuit die to its associated heat sink in a packaged microelectronic component. The invention also includes a thermal module and a packaged microelectronic component including the metal thermal interface material.

Abstract: The invention provides an electrically conductive composite having high conductivity, hermeticity, high mechanical strength, low surface roughness, lightweight, and thin profile. The composite comprises a rubber modified with vinyl ester resin. After curing in mold, the composite may serve as a bipolar plate in a fuel cell. For example, the bipolar plate is combined with a membrane electrode assembly (MEA) to form a proton exchange membrane fuel cell (PEMFC).

Abstract: A melting temperature adjustable metal thermal interface material (TIM) is provided. The metal TIM includes In, Bi, Sn, and Ga. A content of Ga ranges from 0.01 wt % to 3 wt %. The metal TIM has an initial melting temperature lower than 60° C. and has no element hazardous to the environment.

Abstract: The invention provides a metal thermal interface material (TIM) with through-holes in its body and/or zigzags or wave shapes on its border, which is suitable for use at thermal interfaces of a thermal conduction path from an integrated circuit die to its associated heat sink in a packaged microelectronic component. The invention also includes a thermal module and a packaged microelectronic component including the metal thermal interface material.

Abstract: A melting temperature adjustable metal thermal interface material (TIM) is provided. The metal TIM includes In, Bi, Sn, and Ga. A content of Ga ranges from 0.01 wt % to 3 wt %. The metal TIM has an initial melting temperature lower than 60° C. and has no element hazardous to the environment.

Abstract: The invention provides an electrically conductive composite having high conductivity, hermeticity, high mechanical strength, low surface roughness, lightweight, and thin profile. The composite comprises a rubber modified with vinyl ester resin. After curing in mold, the composite may serve as a bipolar plate in a fuel cell. For example, the bipolar plate is combined with a membrane electrode assembly (MEA) to form a proton exchange membrane fuel cell (PEMFC).

Abstract: A heat dissipation device for an electronic device includes a first heat dissipation element contacting the electronic device, wherein the material of the first heat dissipation element includes a composite material with high thermal conductivity comprising carbon fiber or porous graphite. The material with high thermal conductivity includes a fibrous structure and a matrix.

Abstract: The thermal conductivity of the alloy of the invention can achieve 146 W/m·K, an increase of 45% compared with that of common aluminum die casting alloy-ADC12. The casting defects like shrinkage cavity, micro-porosity and amount of dross also become much less than those of pure aluminum. Further, the fluidity and mold erosion resistance of this alloy is also better than that of pure aluminum and almost equivalent to that of ADC12. When the aluminum die casting alloy of the invention is applied to a heat sink, the thermal resistance is even lower than that of ADC12 and 1070 pure aluminum.

Abstract: A heat dissipation device with an optimal fin arrangement for cooling a CPU. The optimal angle, height, width, and shape of the fins provide superior heat dissipation. The heat dissipation device can be combined with a fan device to form a heat dissipating unit.