Patents by Inventor Jen F. Hwang

Jen F. Hwang has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Decoration board for electric wire laid
    Patent number: 4583802
    Abstract: A decoration board for concealing electric wires laid indoors, having a wire-laying board formed with partially formed wire-receiving grooves and an engaging board formed with partially formed wire-receiving grooves, the two boards secured together defining wire-receiving conduits. The decoration board is formed in sections which can be connected together by a board joint, inner angle board joint and external angle joint. The board joint may be provided with an opening for receiving an electrical receptacle.
    Type: Grant
    Filed: February 10, 1984
    Date of Patent: April 22, 1986
    Inventor: Jen F. Hwang