Abstract: A semiconductor device includes a substrate, a sensing device, and a transistor. The sensing device includes a dielectric layer, a sensing pad, a first sensing electrode, and a second sensing electrode. The dielectric layer is over the substrate. The sensing pad is over and in contact with the dielectric layer. The first sensing electrode and the second sensing electrode are over and in contact with the dielectric layer. The first sensing electrode and the second sensing electrode surround the sensing pad, and a distance between the first sensing electrode and the second sensing electrode is greater than a distance between the sensing pad and the first sensing electrode. The transistor is over the substrate. A gate of the transistor is connected to the sensing pad.

Abstract: A robot controlling method includes: obtaining a depth image by a depth camera; receiving the depth image and obtaining an object parameter according to the depth image by a processing circuit; generating an attractive force parameter according to a target trajectory by the processing circuit; generating a repulsive force parameter according to a first vector between the object parameter and a robot by the processing circuit; generating a virtual force parameter according to a second vector between the object parameter and the robot by the processing circuit; and outputting a control signal to the robot to drive the robot according to the attractive force parameter, the repulsive force parameter and the virtual force parameter by the processing circuit.

Abstract: A robot controlling method includes: obtaining a depth image by a depth camera; receiving the depth image and obtaining an object parameter according to the depth image by a processing circuit; generating an attractive force parameter according to a target trajectory by the processing circuit; generating a repulsive force parameter according to a first vector between the object parameter and a robot by the processing circuit; generating a virtual force parameter according to a second vector between the object parameter and the robot by the processing circuit; and outputting a control signal to the robot to drive the robot according to the attractive force parameter, the repulsive force parameter and the virtual force parameter by the processing circuit.

Abstract: A control method is disclosed. The control method is suitable for an electronic device including first processing cores. The control method includes operations as follows. A device status of the electronic device is monitored. A threshold loading level of the first processing cores is dynamically set according to the device status. A loading management of multi-processor is performed according to a current loading level of the processing cores and the threshold loading level.

Abstract: A control method is disclosed. The control method is suitable for an electronic device including first processing cores. The control method includes operations as follows. A device status of the electronic device is monitored. A threshold loading level of the first processing cores is dynamically set according to the device status. A loading management of multi-processor is performed according to a current loading level of the processing cores and the threshold loading level.

Abstract: An encapsulant composition is provided, including at least one resin monomer, a filler and a photoinitiator, wherein the at least one resin monomer is selected from the group consisting of acrylic resin monomer, epoxy resin monomer, silicone resin monomer and compositions thereof, and the filler is of about 0.1˜15 weight % of the encapsulant composition. A method for forming encapsulant materials is also provided.

Abstract: An encapsulant composition is provided. The encapsulant composition includes at least one silane-containing monomer and at least one resin monomer selected from the group consisting of acrylic resin monomers and epoxy resin monomers, a filler of about 0.1-15 wt % of the encapsulant composition, and an initiator. The invention also provides a method for fabricating an encapsulant material.

Abstract: A fuel cell, a plate having through-plane conductivity and a manufacturing method of the plate are disclosed. The plate having through-plane conductivity includes a substrate and a plurality of linear conductors. The linear conductors are respectively coated with a metal material, and are oriented by a magnetic field to arrange in the substrate with an extending direction perpendicular to a plane surface of the substrate. The substrate is made of an epoxy resin material, the linear conductors are carbon fibers, and the metal material is a magnetic material, such as iron, cobalt or nickel. The fuel cell includes bipolar plates that are respectively made of the above-described plate having through-plane conductivity.

Abstract: An encapsulant composition is provided, including at least one resin monomer, a filler and a photoinitiator, wherein the at least one resin monomer is selected from the group consisting of acrylic resin monomer, epoxy resin monomer, silicone resin monomer and compositions thereof, and the filler is of about 0.1˜15 weight % of the encapsulant composition. A method for forming encapsulant materials is also provided.

Abstract: An encapsulant composition is provided, including at least one resin monomer, a filler and a photoinitiator, wherein the at least one resin monomer is selected from the group consisting of acrylic resin monomer, epoxy resin monomer, silicone resin monomer and compositions thereof, and the filler is of about 0.1˜15 weight % of the encapsulant composition. A method for forming encapsulant materials is also provided.

Abstract: An encapsulant composition is provided. The encapsulant composition includes at least one silicone resin monomer and at least one resin monomer selected from the group consisting of acrylic resin monomers and epoxy resin monomers, a filler of about 0.1-15 wt % of the encapsulant composition, and an initiator. The invention also provides a method for fabricating an encapsulant material.

Abstract: An encapsulant composition is provided, including at least one resin monomer, a filler and a photoinitiator, wherein the at least one resin monomer is selected from the group consisting of acrylic resin monomer, epoxy resin monomer, silicone resin monomer and compositions thereof, and the filler is of about 0.1˜15 weight % of the encapsulant composition. A method for forming encapsulant materials is also provided.