Patents by Inventor Jen-Hao Hsueh
Jen-Hao Hsueh has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).
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Patent number: 11611973Abstract: Examples pertaining to improvement on user equipment (UE) uplink latency in wireless communications are described. When an apparatus is in a special mode, a processor of the apparatus transmits to a network a request for permission to perform an uplink (UL) transmission for a plurality of times. The processor then receives from the network a grant. In response to receiving the grant, the processor performs the UL transmission to the network. In transmitting the request for the plurality of times, the processor transmits the request for the plurality of times at a frequency higher than a frequency at which the request to perform UL transmissions is transmitted to the network when the apparatus is in a normal operational mode.Type: GrantFiled: June 30, 2021Date of Patent: March 21, 2023Inventors: Chiao-Chih Chang, Chien-Liang Lin, Jen-Hao Hsueh, Cheng-Che Chen, Sheng-Yi Ho, I-Wei Tsai, Zhen Jiang, Wen-Jean Yang
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Publication number: 20210329664Abstract: Examples pertaining to improvement on user equipment (UE) uplink latency in wireless communications are described. When an apparatus is in a special mode, a processor of the apparatus transmits to a network a request for permission to perform an uplink (UL) transmission for a plurality of times. The processor then receives from the network a grant. In response to receiving the grant, the processor performs the UL transmission to the network. In transmitting the request for the plurality of times, the processor transmits the request for the plurality of times at a frequency higher than a frequency at which the request to perform UL transmissions is transmitted to the network when the apparatus is in a normal operational mode.Type: ApplicationFiled: June 30, 2021Publication date: October 21, 2021Inventors: Chiao-Chih Chang, Chien-Liang Lin, Jen-Hao Hsueh, Cheng-Che Chen, Sheng-Yi Ho, I-Wei Tsai, Zhen Jiang, Wen-Jean Yang
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Patent number: 11096089Abstract: A data packaging method applied in a communication device is disclosed The method includes: transmitting a plurality of first data packets including a plurality of first data contents; storing the plurality of first data contents; obtaining allocated resources for a second data packet; inserting a second data content into the second data packet; determining whether any resources remain in the second data packet after the second data content is inserted into the second data packet; selecting a portion among the plurality of first data contents in response to any resources remaining in the second data packet after the second data content is inserted into the second data packet; inserting the selected portion into the second data packet; and transmitting the second data packet including the second data content and the selected portion; wherein the plurality of first data packets are transmitted previous to the second data packet.Type: GrantFiled: July 23, 2019Date of Patent: August 17, 2021Assignee: MEDIATEK INC.Inventor: Jen-Hao Hsueh
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Patent number: 11089612Abstract: Examples pertaining to improvement on user equipment (UE) uplink latency in wireless communications are described. When an apparatus is in a special mode, a processor of the apparatus transmits to a network a request for permission to perform an uplink (UL) transmission for a plurality of times. The processor then receives from the network a grant. In response to receiving the grant, the processor performs the UL transmission to the network. In transmitting the request for the plurality of times, the processor transmits the request for the plurality of times at a frequency higher than a frequency at which the request to perform UL transmissions is transmitted to the network when the apparatus is in a normal operational mode.Type: GrantFiled: October 2, 2019Date of Patent: August 10, 2021Inventors: Chiao-Chih Chang, Chien-Liang Lin, Jen-Hao Hsueh, Cheng-Che Chen, Sheng-Yi Ho, I-Wei Tsai, Zhen Jiang, Wen-Jean Yang
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Publication number: 20200154457Abstract: Examples pertaining to improvement on user equipment (UE) uplink latency in wireless communications are described. When an apparatus is in a special mode, a processor of the apparatus transmits to a network a request for permission to perform an uplink (UL) transmission for a plurality of times. The processor then receives from the network a grant. In response to receiving the grant, the processor performs the UL transmission to the network. In transmitting the request for the plurality of times, the processor transmits the request for the plurality of times at a frequency higher than a frequency at which the request to perform UL transmissions is transmitted to the network when the apparatus is in a normal operational mode.Type: ApplicationFiled: October 2, 2019Publication date: May 14, 2020Inventors: Chiao-Chih Chang, Chien-Liang Lin, Jen-Hao Hsueh, Cheng-Che Chen, Sheng-Yi Ho, I-Wei Tsai, Zhen Jiang, Vincent Yang
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Publication number: 20200068436Abstract: A data packaging method applied in a communication device is disclosed The method includes: transmitting a plurality of first data packets including a plurality of first data contents; storing the plurality of first data contents; obtaining allocated resources for a second data packet; inserting a second data content into the second data packet; determining whether any resources remain in the second data packet after the second data content is inserted into the second data packet; selecting a portion among the plurality of first data contents in response to any resources remaining in the second data packet after the second data content is inserted into the second data packet; inserting the selected portion into the second data packet; and transmitting the second data packet including the second data content and the selected portion; wherein the plurality of first data packets are transmitted previous to the second data packet.Type: ApplicationFiled: July 23, 2019Publication date: February 27, 2020Inventor: Jen-Hao Hsueh
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Patent number: 7474082Abstract: This present invention relates to a voltage converting apparatus with auto-adjusting boost-multiple, which includes a microprocessor unit, a boost multiple control unit, a boost unit, and a voltage converting unit. According to the digital signal, the microprocessor unit generates an output voltage information and a converting multiple information. According to the output voltage information, the boost multiple control unit computes the corresponding relation between an output voltage and an input voltage in order to generate the boost multiple information. Based on the boost multiple information, the boost unit can amplify the output voltage to generate an converting operation voltage. The voltage converting unit operates between the converting operation voltage and a fist voltage, and converts a reference voltage into the output voltage according to the converting multiple information.Type: GrantFiled: October 18, 2006Date of Patent: January 6, 2009Assignee: Novatek Microelectronics Corp.Inventors: Yi-Pin Huang, Feng-Jung Kuo, Jen-Hao Hsueh, Wen-Ping Chou
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Publication number: 20080036433Abstract: This present invention relates to a voltage converting apparatus with auto-adjusting boost-multiple, which includes a microprocessor unit, a boost multiple control unit, a boost unit, and a voltage converting unit. According to the digital signal, the microprocessor unit generates an output voltage information and a converting multiple information. According to the output voltage information, the boost multiple control unit computes the corresponding relation between an output voltage and an input voltage in order to generate the boost multiple information. Based on the boost multiple information, the boost unit can amplify the output voltage to generate an converting operation voltage. The voltage converting unit operates between the converting operation voltage and a fist voltage, and converts a reference voltage into the output voltage according to the converting multiple information.Type: ApplicationFiled: October 18, 2006Publication date: February 14, 2008Applicant: NOVATEK MICROELECTRONICS CORP.Inventors: Yi-Pin Huang, Feng-Jung Kuo, Jen-Hao Hsueh, Wen-Ping Chou
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Publication number: 20070290340Abstract: A chip structure including a chip, at least an arrangement of side pads and multiple bumps is provided. The chip has an active surface, and the arrangement of side pads is disposed on the active surface and close to a side of the active surface. The arrangement of side pads includes multiple pads arranged along the extending direction of the side, and the bumps are disposed on the pads. Each bump has a first portion and a second portion, wherein the second portion is connected to the first portion along an axis perpendicular to the extending direction of the side. In addition, the width of the first portion in the extending direction of the side is larger than that of the second portion in the extending direction of the side. The second portion of the bump is located between the first portions of two bumps adjacent to the bump.Type: ApplicationFiled: August 30, 2006Publication date: December 20, 2007Applicant: NOVATEK MICROELECTRONICS CORP.Inventors: Jen-Hao Hsueh, Feng-Jung Kuo, Wen-Ping Chou, Hsiang-Yi Liu