Patents by Inventor Jen-Heng HUANG

Jen-Heng HUANG has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 9583239
    Abstract: An electrode component with electrode layers formed on intermediate layers includes a ceramic substrate, two intermediate layers formed on two opposite surfaces of the ceramic substrate, two electrode layers respectively formed on the two intermediate layers, two lead wires respectively connected to the electrode layers, and an insulating layer enclosing the ceramic substrate, the intermediate layers, the electrode layers, and portions of the two lead wires. The intermediate layer formed between the ceramic substrate and the electrode layer replaces the fabrication means for conventional silver electrode layer to provide good binding strength between the ceramic substrate and the electrode layer.
    Type: Grant
    Filed: March 12, 2015
    Date of Patent: February 28, 2017
    Assignee: THINKING ELECTRONIC INDUSTRIAL CO., LTD.
    Inventors: Xun Xu, Jen-Heng Huang, Zhiwei Jia
  • Patent number: 9449742
    Abstract: An electrode component includes a ceramic substrate, two electrode layers formed on two opposite surfaces of the ceramic substrate, two pins respectively connected to the two electrode layers, and an insulating layer enclosing the ceramic substrate, the electrode layers and a portion of each pin. Each electrode layer is formed of two or more base metal materials or alloys thereof, and the concentrations of the base metal materials progressively vary across the electrode layer. Accordingly, the production cost is lowered, environmental pollution caused by evaporation and thermal dissolution of organic solvent can be prevented, risk of separable electrode interface at high-voltage discharge is mitigated, and the fabrication process of the electrode layer is shortened while maintaining bonding strength between the electrode layers and the ceramic substrate and solderability between the electrode layers and the pins.
    Type: Grant
    Filed: February 28, 2015
    Date of Patent: September 20, 2016
    Assignee: THINKING ELECTRONIC INDUSTRIAL CO., LTD.
    Inventor: Jen-Heng Huang
  • Publication number: 20160086699
    Abstract: An electrode component includes a ceramic substrate, two electrode layers formed on two opposite surfaces of the ceramic substrate, two pins respectively connected to the two electrode layers, and an insulating layer enclosing the ceramic substrate, the electrode layers and a portion of each pin. Each electrode layer is formed of two or more base metal materials or alloys thereof, and the concentrations of the base metal materials progressively vary across the electrode layer. Accordingly, the production cost is lowered, environmental pollution caused by evaporation and thermal dissolution of organic solvent can be prevented, risk of separable electrode interface at high-voltage discharge is mitigated, and the fabrication process of the electrode layer is shortened while maintaining bonding strength between the electrode layers and the ceramic substrate and solderability between the electrode layers and the pins.
    Type: Application
    Filed: February 28, 2015
    Publication date: March 24, 2016
    Inventor: Jen-Heng Huang
  • Publication number: 20160035466
    Abstract: An electrode component with pretreated layers includes a ceramic substrate, two pretreated layers formed on two opposite surfaces of the ceramic substrate, two electrode layers respectively formed on the two pretreated layers, two pins respectively connected to the electrode layers, and an insulating layer enclosing the ceramic substrate, the pretreated layers, the electrode layers, and portions of the two pins. The pretreated layer formed between the ceramic substrate and the electrode layer replaces the fabrication means for conventional silver electrode layer to provide good binding strength between the ceramic substrate and the electrode layer. Besides same electrical characteristics for original products, the electrode component can get rid of the use of precious silver in screen printed silver electrode and avoid pollution caused by evaporation and thermal dissolution of organic solvent while lowering the ohmic contact resistance between the electrode layer and the ceramic substrate.
    Type: Application
    Filed: March 12, 2015
    Publication date: February 4, 2016
    Applicant: THINKING ELECTRONIC INDUSTRIAL CO., LTD.
    Inventors: Xun XU, Jen-Heng HUANG, Zhiwei JIA