Patents by Inventor Jen-Hsien HSU

Jen-Hsien HSU has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 12218164
    Abstract: A semiconductor image sensing structure includes a substrate having a first region and a second region, a metal grid in the first region, and a hybrid metal shield in the second region. The hybrid metal shield includes a first metallization layer, a second metallization layer disposed over the first metallization layer, a third metallization layer disposed over the second metallization layer, and a fourth metallization layer disposed over the third metallization layer. An included angle of the second metallization layer is between approximately 40° and approximately 60°.
    Type: Grant
    Filed: January 28, 2022
    Date of Patent: February 4, 2025
    Assignee: TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY LTD.
    Inventors: Ming-Hsien Yang, Wen-I Hsu, Kuan-Fu Lu, Feng-Chi Hung, Jen-Cheng Liu, Dun-Nian Yaung, Chun-Hao Chou, Kuo-Cheng Lee
  • Publication number: 20220401913
    Abstract: A silver-doped, nano-porous hydroxyapatite material is provided that can be utilized to capture radioactive iodine, 129I. Methods of using the silver-doped, nano-porous hydroxyapatite material to remove radioactive iodine, and methods of manufacturing the material are also provided.
    Type: Application
    Filed: July 5, 2022
    Publication date: December 22, 2022
    Inventors: Cheol-Woon KIM, Richard K. BROW, Jen-Hsien HSU
  • Publication number: 20190224642
    Abstract: A silver-doped, nano-porous hydroxyapatite material is provided that can be utilized to capture radioactive iodine, 129I. Methods of using the silver-doped, nano-porous hydroxyapatite material to remove radioactive iodine, and methods of manufacturing the material are also provided.
    Type: Application
    Filed: January 25, 2019
    Publication date: July 25, 2019
    Inventors: Cheol-Woon KIM, Richard K. BROW, Jen-Hsien HSU