Patents by Inventor Jen-Hsin Lee

Jen-Hsin Lee has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Moldboard positioning assembly and use thereof
    Patent number: 7959126
    Abstract: A moldboard positioning assembly is adapted for positioning at least two spaced-apart moldboards each having at least one through hole. The moldboard positioning assembly includes a spacer block and two threaded connecting poles. The spacer block is adapted for passing through the through hole of one of the moldboards and is adapted to be disposed between and to abut against the moldboards. The threaded connecting poles respectively project from two opposite ends of the spacer block, and each of the threaded connecting poles is adapted to penetrate through the through hole of a corresponding one of the moldboards. The spacer block has a cross section larger than that of the threaded connecting poles.
    Type: Grant
    Filed: October 2, 2007
    Date of Patent: June 14, 2011
    Inventor: Jen-Hsin Lee
  • MOLDBOARD POSITIONING ASSEMBLY AND USE THEREOF
    Publication number: 20080111052
    Abstract: A moldboard positioning assembly is adapted for positioning at least two spaced-apart moldboards each having at least one through hole. The moldboard positioning assembly includes a spacer block and two threaded connecting poles. The spacer block is adapted for passing through the through hole of one of the moldboards and is adapted to be disposed between and to abut against the moldboards. The threaded connecting poles respectively project from two opposite ends of the spacer block, and each of the threaded connecting poles is adapted to penetrate through the through hole of a corresponding one of the moldboards. The spacer block has a cross section larger than that of the threaded connecting poles.
    Type: Application
    Filed: October 2, 2007
    Publication date: May 15, 2008
    Inventor: Jen-Hsin LEE