Abstract: In an embodiment, a structure includes: a first integrated circuit die including first die connectors; a first dielectric layer on the first die connectors; first conductive vias extending through the first dielectric layer, the first conductive vias connected to a first subset of the first die connectors; a second integrated circuit die bonded to a second subset of the first die connectors with first reflowable connectors; a first encapsulant surrounding the second integrated circuit die and the first conductive vias, the first encapsulant and the first integrated circuit die being laterally coterminous; second conductive vias adjacent the first integrated circuit die; a second encapsulant surrounding the second conductive vias, the first encapsulant, and the first integrated circuit die; and a first redistribution structure including first redistribution lines, the first redistribution lines connected to the first conductive vias and the second conductive vias.

Abstract: A pen cap and a pen barrel coupling structure provides the pen cap formed in hollow to hold a magnet and an opening at one end and the pen barrel couplable with the opening of the pen cap and having a metal element attractable to the magnet. The pen cap and pen barrel have respectively a first coupling portion and a second coupling portion that correspond to and engageable with each other. The first and second coupling portions form a first coupling position to allow the magnet and metal element attracting to each other to form an anchor condition, and a second coupling position to separate the magnet and metal element to release the anchor condition. Thus by moving the pen cap against the pen barrel to the second coupling position, the pen cap can be separated from the pen barrel to make use of the pen easier.