Patents by Inventor Jen-Hua Wu

Jen-Hua Wu has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 11955405
    Abstract: A semiconductor package includes a package substrate; semiconductor devices disposed on the package substrate; a package ring disposed on a perimeter of the package substrate surrounding the semiconductor devices; a cover including silicon bonded to the package ring and covering the semiconductor devices; and a thermal interface structure (TIS) thermally connecting the semiconductor devices to the cover.
    Type: Grant
    Filed: January 17, 2022
    Date of Patent: April 9, 2024
    Assignee: Taiwan Semiconductor Manufacturing Company Limited
    Inventors: Jen Yu Wang, Chung-Jung Wu, Sheng-Tsung Hsiao, Tung-Liang Shao, Chih-Hang Tung, Chen-Hua Yu
  • Publication number: 20240076422
    Abstract: A supported metallocene catalyst includes a carrier and a metallocene component. The carrier includes an inorganic oxide particle and an alkyl aluminoxane material. The inorganic oxide particle includes at least one inorganic oxide compound selected from the group consisting of an oxide of Group 3A and an oxide of Group 4A. The alkyl aluminoxane material includes an alkyl aluminoxane compound and an alkyl aluminum compound that is present in amount ranging from greater than 0.01 wt % to less than 14 wt % base on 100 wt % of the alkyl aluminoxane material. The metallocene component is supported on the carrier, and includes one of a metallocene compound containing a metal from Group 3B, a metallocene compound containing a metal from Group 4B, and a combination thereof. A method for preparing the supported metallocene catalyst and a method for preparing polyolefin using the supported metallocene catalyst are also disclosed.
    Type: Application
    Filed: September 1, 2023
    Publication date: March 7, 2024
    Inventors: Jing-Cherng TSAI, Jen-Long WU, Wen-Hao KANG, Kuei-Pin LIN, Jing-Yu LEE, Jun-Ye HONG, Zih-Yu SHIH, Cheng-Hung CHIANG, Gang-Wei SHEN, Yu-Chuan SUNG, Chung-Hua WENG, Hsing-Ya CHEN
  • Patent number: 8108071
    Abstract: A method for coordinating cooperative robots is provided. The method includes following steps. An abnormal event is detected by a sensor disposed in an environment or in a robot. The abnormal event is broadcasted to the cooperative robots. Each robot determines whether the priority of the abnormal event is higher than that of its currently executing task. If the answer is “yes,” whether function attributes of the robot meet attributes of the abnormal event is then determined. If the function attributes of the cooperative robot do not meet the attributes of the abnormal event, the robot broadcasts to acquire help from other robots, thereby constituting an instantly designated task team. The instantly designated task team goes to where the abnormal event takes place to process the abnormal event. After the abnormal event has been eliminated, the instantly designated task team is dismissed and these robots resume their original tasks.
    Type: Grant
    Filed: January 8, 2008
    Date of Patent: January 31, 2012
    Assignee: Industrial Technology Research Institute
    Inventors: Yen-Chun Lin, Jen-Hua Wu, Kuo-Tsung Tseng
  • Patent number: 7547205
    Abstract: A microimprint/nanoimprint uniform pressing apparatus is used to provide uniform imprinting pressure to a molding material layer between a substrate and a mold. The uniform pressing apparatus includes a uniform pressing unit for being directly in contact with the mold or the substrate, so as to allow each point to have equal pressure during imprinting and utilize a simple structure to transmit uniform imprinting pressure.
    Type: Grant
    Filed: July 7, 2005
    Date of Patent: June 16, 2009
    Assignee: Industrial Technology Research Institute
    Inventors: Shou-Ren Chen, Chuan-Feng Chen, Yu-Lun Ho, Jen-Hua Wu, Wei-Han Wang, Lai-Sheng Chen
  • Publication number: 20090015404
    Abstract: A method for coordinating cooperative robots is provided. The method includes following steps. An abnormal event is detected by a sensor disposed in an environment or in a robot. The abnormal event is broadcasted to the cooperative robots. Each robot determines whether the priority of the abnormal event is higher than that of its currently executing task. If the answer is “yes,” whether function attributes of the robot meet attributes of the abnormal event is then determined. If the function attributes of the cooperative robot do not meet the attributes of the abnormal event, the robot broadcasts to acquire help from other robots, thereby constituting an instantly designated task team. The instantly designated task team goes to where the abnormal event takes place to process the abnormal event. After the abnormal event has been eliminated, the instantly designated task team is dismissed and these robots resume their original tasks.
    Type: Application
    Filed: January 8, 2008
    Publication date: January 15, 2009
    Applicant: INDUSTRIAL TECHNOLOGY RESEARCH INSTITUTE
    Inventors: Yen-Chun Lin, Jen-Hua Wu, Kuo-Tsung Tseng
  • Patent number: 7473088
    Abstract: A microimprint/nanoimprint device includes a mold, a substrate and an energy transferring module. The substrate is disposed oppositely to the mold and at least has a molding material layer. The energy transferring module includes an energy transferring member and at least one energy source, wherein the energy transferring member is connected to the substrate or the mold, and the energy source provides imprint energy to the substrate or the mold, such that at least part of the imprint energy goes through the energy transferring member to the substrate or the mold for performing imprint molding.
    Type: Grant
    Filed: October 4, 2005
    Date of Patent: January 6, 2009
    Assignee: Industrial Technology Research Institute
    Inventors: Yu-Lun Ho, Lai-Sheng Chen, Wei-Han Wang, Jen-Hua Wu, Chuan-Feng Chen, Shou-Ren Chen
  • Patent number: 7462320
    Abstract: The present invention relates to a demolding method and device, being used for detaching a mold and a substrate after completing an imprinting process, in which the mold is forced to detach from the substrate partially and form a gap therebetween by inserting at least a blade module between the two, and thus, as air is sucked into the gap and the adhesion force of vacuum effect exerting between the mold and the substrate is eliminated, the blade module is further applied to detach the mold from the substrate completely.
    Type: Grant
    Filed: December 2, 2005
    Date of Patent: December 9, 2008
    Assignee: Industrial Technology Research Institute
    Inventors: Yu-Lun Ho, Jen-Hua Wu, Wei-Han Wang, Shou-Ren Chen, Lai-Sheng Chen
  • Publication number: 20070092594
    Abstract: The present invention relates to a demolding method and device, being used for detaching a mold and a substrate after completing an imprinting process, in which the mold is forced to detach from the substrate partially and form a gap therebetween by inserting at least a blade module between the two, and thus, as air is sucked into the gap and the adhesion force of vacuum effect exerting between the mold and the substrate is eliminated, the blade module is further applied to detach the mold from the substrate completely.
    Type: Application
    Filed: December 2, 2005
    Publication date: April 26, 2007
    Inventors: Yu-Lun Ho, Jen-Hua Wu, Wei-Han Wang, Shou-Ren Chen, Lai-Sheng Chen
  • Publication number: 20060246169
    Abstract: A microimprint/nanoimprint uniform pressing apparatus is used to provide uniform imprinting pressure to a molding material layer between a substrate and a mold. The uniform pressing apparatus includes a uniform pressing unit for being directly in contact with the mold or the substrate, so as to allow each point to have equal pressure during imprinting and utilize a simple structure to transmit uniform imprinting pressure.
    Type: Application
    Filed: July 7, 2005
    Publication date: November 2, 2006
    Inventors: Shou-Ren Chen, Chuan-Feng Chen, Yu-Lun Ho, Jen-Hua Wu, Wei-Han Wang, Lai-Sheng Chen
  • Patent number: 7114692
    Abstract: A vibration isolation device for isolating a vibration source from a carried member, includes: a carrier for carrying the carried member; a housing positioned on the vibration source, and formed with an accommodating space; a cover for sealing an open end of the housing; a base mounted in the accommodating space, and extended through the cover to be connected to the carrier; a plurality of connecting members mounted in the accommodating space and around the base, wherein each of the connecting members is connected to the base and the cover; and a plurality of actuators provided in the connecting members respectively, for changing vibration of the connecting members and the base when the vibration source vibrates, so as to minimize vibration of the carrier, thereby achieving the effect of isolating vertical and horizontal vibrations.
    Type: Grant
    Filed: March 10, 2005
    Date of Patent: October 3, 2006
    Assignee: Industrial Technology Research Institute
    Inventors: Yann-Shuoh Sun, Wei-Han Wang, Jen-Hua Wu, Yen-Chieh Mao
  • Publication number: 20060198917
    Abstract: A microimprint/nanoimprint device includes a mold, a substrate and an energy transferring module. The substrate is disposed oppositely to the mold and at least has a molding material layer. The energy transferring module includes an energy transferring member and at least one energy source, wherein the energy transferring member is connected to the substrate or the mold, and the energy source provides imprint energy to the substrate or the mold, such that at least part of the imprint energy goes through the energy transferring member to the substrate or the mold for performing imprint molding.
    Type: Application
    Filed: October 4, 2005
    Publication date: September 7, 2006
    Inventors: Yu-Lun Ho, Lai-Sheng Chen, Wei-Han Wang, Jen-Hua Wu, Chuan-Feng Chen, Shou-Ren Chen
  • Publication number: 20060131471
    Abstract: A vibration isolation device for isolating a vibration source from a carried member, includes: a carrier for carrying the carried member; a housing positioned on the vibration source, and formed with an accommodating space; a cover for sealing an open end of the housing; a base mounted in the accommodating space, and extended through the cover to be connected to the carrier; a plurality of connecting members mounted in the accommodating space and around the base, wherein each of the connecting members is connected to the base and the cover; and a plurality of actuators provided in the connecting members respectively, for changing vibration of the connecting members and the base when the vibration source vibrates, so as to minimize vibration of the carrier, thereby achieving the effect of isolating vertical and horizontal vibrations.
    Type: Application
    Filed: March 10, 2005
    Publication date: June 22, 2006
    Inventors: Yann-Shuoh Sun, Wei-Han Wang, Jen-Hua Wu, Yen-Chieh Mao
  • Publication number: 20060027949
    Abstract: The microstructure imprint device of the invention comprises: a supporting plate, a substrate, a moldable layer, a mold, and a microwave source, wherein the microwave discharged from the microwave source is being provided to the substrate, the moldable layer and the mold for heating up the moldable laye so as to soften the moldable layer, and the substrate having a layer of moldable layer arranged thereon is being placed on the supporting plate, and the mold is disposed at a position corresponding to the substrate and the supporting plate such that the mold can be pressed on the moldable layer for pattern transferring. The device the present invention is capable of enhancing the thermal state of a moldable layer in a short time by means of electromagnetic wave, such that the moldable layer can be heated in a short time and further the moldable layer can be softened.
    Type: Application
    Filed: September 13, 2004
    Publication date: February 9, 2006
    Inventors: Wei-Han Wang, Chia-Hung Lin, Yu-Lun Ho, Jen-Hua Wu