Abstract: A method for handling a semiconductor substrate includes: placing a semiconductor substrate over a semiconductor apparatus, where a central portion of the semiconductor substrate overlies a carrying surface of a chuck table of the semiconductor apparatus, an edge portion of the semiconductor substrate overlies a top surface of a first flexible member of the semiconductor apparatus, the first flexible member is disposed within a recess of the chuck table and extends along a perimeter of the carrying surface, and a gap forms among the semiconductor substrate, the carrying surface of the chuck table, and the top surface of the first flexible member; and introducing a vacuum in vacuum holes in the chuck table to form a vacuum seal among the semiconductor substrate, the chuck table, and the first flexible member.

Abstract: A semiconductor package and a manufacturing method are provided. The semiconductor package includes a carrier substrate, a through substrate via (TSV), a first conductive pattern, and an encapsulated die. The TSV penetrates through the carrier substrate and includes a first portion and a second portion connected to the first portion, the first portion includes a first slanted sidewall with a first slope, the second portion includes a second slanted sidewall with a second slope, and the first slope is substantially milder than the second slope. The first conductive pattern is disposed on the carrier substrate and connected to the first portion of the TSV. The encapsulated die is disposed on the carrier substrate and electrically coupled to the TSV through the first conductive pattern.

Abstract: A semiconductor package and a manufacturing method are provided. The semiconductor package includes a carrier substrate, a through substrate via (TSV), a first conductive pattern, and an encapsulated die. The TSV penetrates through the carrier substrate and includes a first portion and a second portion connected to the first portion, the first portion includes a first slanted sidewall with a first slope, the second portion includes a second slanted sidewall with a second slope, and the first slope is substantially milder than the second slope. The first conductive pattern is disposed on the carrier substrate and connected to the first portion of the TSV. The encapsulated die is disposed on the carrier substrate and electrically coupled to the TSV through the first conductive pattern.

Abstract: A method for coordinating cooperative robots is provided. The method includes following steps. An abnormal event is detected by a sensor disposed in an environment or in a robot. The abnormal event is broadcasted to the cooperative robots. Each robot determines whether the priority of the abnormal event is higher than that of its currently executing task. If the answer is “yes,” whether function attributes of the robot meet attributes of the abnormal event is then determined. If the function attributes of the cooperative robot do not meet the attributes of the abnormal event, the robot broadcasts to acquire help from other robots, thereby constituting an instantly designated task team. The instantly designated task team goes to where the abnormal event takes place to process the abnormal event. After the abnormal event has been eliminated, the instantly designated task team is dismissed and these robots resume their original tasks.

Abstract: A microimprint/nanoimprint uniform pressing apparatus is used to provide uniform imprinting pressure to a molding material layer between a substrate and a mold. The uniform pressing apparatus includes a uniform pressing unit for being directly in contact with the mold or the substrate, so as to allow each point to have equal pressure during imprinting and utilize a simple structure to transmit uniform imprinting pressure.

Abstract: A method for coordinating cooperative robots is provided. The method includes following steps. An abnormal event is detected by a sensor disposed in an environment or in a robot. The abnormal event is broadcasted to the cooperative robots. Each robot determines whether the priority of the abnormal event is higher than that of its currently executing task. If the answer is “yes,” whether function attributes of the robot meet attributes of the abnormal event is then determined. If the function attributes of the cooperative robot do not meet the attributes of the abnormal event, the robot broadcasts to acquire help from other robots, thereby constituting an instantly designated task team. The instantly designated task team goes to where the abnormal event takes place to process the abnormal event. After the abnormal event has been eliminated, the instantly designated task team is dismissed and these robots resume their original tasks.

Abstract: A microimprint/nanoimprint device includes a mold, a substrate and an energy transferring module. The substrate is disposed oppositely to the mold and at least has a molding material layer. The energy transferring module includes an energy transferring member and at least one energy source, wherein the energy transferring member is connected to the substrate or the mold, and the energy source provides imprint energy to the substrate or the mold, such that at least part of the imprint energy goes through the energy transferring member to the substrate or the mold for performing imprint molding.

Abstract: The present invention relates to a demolding method and device, being used for detaching a mold and a substrate after completing an imprinting process, in which the mold is forced to detach from the substrate partially and form a gap therebetween by inserting at least a blade module between the two, and thus, as air is sucked into the gap and the adhesion force of vacuum effect exerting between the mold and the substrate is eliminated, the blade module is further applied to detach the mold from the substrate completely.

Abstract: The present invention relates to a demolding method and device, being used for detaching a mold and a substrate after completing an imprinting process, in which the mold is forced to detach from the substrate partially and form a gap therebetween by inserting at least a blade module between the two, and thus, as air is sucked into the gap and the adhesion force of vacuum effect exerting between the mold and the substrate is eliminated, the blade module is further applied to detach the mold from the substrate completely.

Abstract: A microimprint/nanoimprint uniform pressing apparatus is used to provide uniform imprinting pressure to a molding material layer between a substrate and a mold. The uniform pressing apparatus includes a uniform pressing unit for being directly in contact with the mold or the substrate, so as to allow each point to have equal pressure during imprinting and utilize a simple structure to transmit uniform imprinting pressure.

Abstract: A vibration isolation device for isolating a vibration source from a carried member, includes: a carrier for carrying the carried member; a housing positioned on the vibration source, and formed with an accommodating space; a cover for sealing an open end of the housing; a base mounted in the accommodating space, and extended through the cover to be connected to the carrier; a plurality of connecting members mounted in the accommodating space and around the base, wherein each of the connecting members is connected to the base and the cover; and a plurality of actuators provided in the connecting members respectively, for changing vibration of the connecting members and the base when the vibration source vibrates, so as to minimize vibration of the carrier, thereby achieving the effect of isolating vertical and horizontal vibrations.

Abstract: A microimprint/nanoimprint device includes a mold, a substrate and an energy transferring module. The substrate is disposed oppositely to the mold and at least has a molding material layer. The energy transferring module includes an energy transferring member and at least one energy source, wherein the energy transferring member is connected to the substrate or the mold, and the energy source provides imprint energy to the substrate or the mold, such that at least part of the imprint energy goes through the energy transferring member to the substrate or the mold for performing imprint molding.

Abstract: A vibration isolation device for isolating a vibration source from a carried member, includes: a carrier for carrying the carried member; a housing positioned on the vibration source, and formed with an accommodating space; a cover for sealing an open end of the housing; a base mounted in the accommodating space, and extended through the cover to be connected to the carrier; a plurality of connecting members mounted in the accommodating space and around the base, wherein each of the connecting members is connected to the base and the cover; and a plurality of actuators provided in the connecting members respectively, for changing vibration of the connecting members and the base when the vibration source vibrates, so as to minimize vibration of the carrier, thereby achieving the effect of isolating vertical and horizontal vibrations.

Abstract: The microstructure imprint device of the invention comprises: a supporting plate, a substrate, a moldable layer, a mold, and a microwave source, wherein the microwave discharged from the microwave source is being provided to the substrate, the moldable layer and the mold for heating up the moldable laye so as to soften the moldable layer, and the substrate having a layer of moldable layer arranged thereon is being placed on the supporting plate, and the mold is disposed at a position corresponding to the substrate and the supporting plate such that the mold can be pressed on the moldable layer for pattern transferring. The device the present invention is capable of enhancing the thermal state of a moldable layer in a short time by means of electromagnetic wave, such that the moldable layer can be heated in a short time and further the moldable layer can be softened.