Abstract: A tape automated bonding (TAB) process in which a tape-carrier through its finger leads is bonded to composite bumps on an IC chip wherein the composite bumps are constructed by a polymeric material layer and at least one metal layer. The polymeric material layer has a lower rigidity (or a lower Young's modules) than those of the metal layers. Structural damages during the bonding process that is frequently caused by a rigid metal bump is eliminated. The TAB bonding process can be carried out by using either an all-metal lead frame, a plated metal lead frame, or a polymer reinforced metal lead frame. The polymer/metal composite bumps constructed on the IC chip require a smaller bonding force when bonded in a thermal bonder.

Abstract: A composite bump structure comprising a first metal layer, a polymer bump formed on the first metal layer, and a second metal layer covering the polymer bump and the first metal layer. The first metal layer is formed above an input/output pad on an integrated circuit element. The polymer bump is positioned substantially off the center of the input/output pad. An open area next to the polymer bump above the input/output pad is established for probing test. The open area having the first and second metal layers and the input/output pad underneath can provide good testability.

Abstract: The present invention comprises a test system for non-destructively testing the attachment strength of a plurality of electric wires each connected to a corresponding input/output (I/O) port in an integrated circuit (IC) dice. The test system comprises a test bench for placing said integrated circuit dice thereon. The test system further comprises a force asserting means including a testing pin for asserting a controlled amount of pressing force along a predefined direction to each of the electric wires near said corresponding I/O ports on said IC dice. The test system also includes a control means including a testing arm connecting to the testing pin for controlling and positioning the testing pin to apply the controlled amount of force to each of the electric wires. The control means further includes a force measurement means for measuring the amount of force applied to each of the electric wires.

Abstract: An improveent in a Tape Automated Bonding (TAB) apparatus wherein a support for the device being bonded to a tape, or film carrier, is provided that will automatically adjust the position of the device supported thereon to conform to the bonding surface of the thermode. The support of the invention has a central member that provides for swivelling and a second member that prevents relative rotation.