Patents by Inventor Jen-Huei Dung

Jen-Huei Dung has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Wireless bonded semiconductor device and method for packaging the same
    Publication number: 20030095393
    Abstract: A wireless bonded semiconductor device comprises a semiconductor chip packaged on a metal lead frame, in which the semiconductor chip contains at least one contact electrically connected to a lead frame and a connecting-pin terminal leading out from its bottom face, and at least one contact and a plurality of individual connecting-pin terminals leading out from its top face, there is no metal bonding wire exists between the surface contact and individual connecting-pin terminals, instead a matrix of the connecting-pin terminal with pre-determined extension length that directly folded and bonded onto the surface contact of the semiconductor chip is employed.
    Type: Application
    Filed: September 18, 2002
    Publication date: May 22, 2003
    Applicant: Chino-Excel Technologies Corp.
    Inventors: Kou-Way Tu, Feng-Tso Chien, You-Ren Li, Jen-Huei Dung