Abstract: A semiconductor packaging assembly includes a redistribution layered structure having a plurality of device regions and a plurality of cutting regions separating the device regions, a plurality of recess structures respectively formed in the cutting regions, a plurality of chips respectively disposed in the device regions, and an encapsulating layer formed on the redistribution layered structure to fill the recess structures and enclose the chips.

Abstract: A semiconductor package structure includes a first redistribution layer, a plurality of conductive connectors, a chip, and an encapsulant. The first redistribution layer has a first surface and a second surface opposite to the first surface. The first redistribution layer includes at least one conductive pattern and at least one dielectric layer stacked on each other. The conductive pattern includes a plurality of landing pads, and each of the landing pads is separated from the dielectric layer. The conductive connectors are located on the first surface. Each of the conductive connectors is corresponding to and electrically connected to one of the landing pads. The chip is located on the first surface. The chip is electrically connected to the first redistribution layer. The encapsulant encapsulates the chip and the conductive connectors. A manufacturing method of a semiconductor package structure is also provided.

Abstract: A semiconductor package structure includes a first redistribution layer, a plurality of conductive connectors, a chip, and an encapsulant. The first redistribution layer has a first surface and a second surface opposite to the first surface. The first redistribution layer includes at least one conductive pattern and at least one dielectric layer stacked on each other. The conductive pattern includes a plurality of landing pads, and each of the landing pads is separated from the dielectric layer. The conductive connectors are located on the first surface. Each of the conductive connectors is corresponding to and electrically connected to one of the landing pads. The chip is located on the first surface. The chip is electrically connected to the first redistribution layer. The encapsulant encapsulates the chip and the conductive connectors. A manufacturing method of a semiconductor package structure is also provided.

Abstract: A fan-out semiconductor package includes a layer of adhesive covering a temporary carrier, a first redistribution layer disposed on the layer of adhesive, the first redistribution layer including a first metal layer having recessed areas. Metal pillars are plated to a first group of the recessed areas in the first metal layer. A semiconductor chip next is bonded to a second group of the recessed areas and a molding compound covers the semiconductor chip. The molding compound is then ground to expose tops of the metal pillars. A second redistribution layer including a second passivation layer adhering to the molding compound and a second metal layer covering openings exposing the tops of the metal pillars are then added.

Abstract: A manufacturing method of a package structure is provided. The method includes the following steps. A redistribution circuit layer is formed on a first carrier. A die is disposed on the redistribution circuit layer. An encapsulant is formed to encapsulate the die. The first carrier is removed to expose a surface of the redistribution circuit layer. A plurality of recesses are formed on the surface of the redistribution circuit layer. A plurality of conductive terminals are formed corresponding to the recesses on the redistribution circuit layer. Another manufacturing method of a package structure is also provided.

Abstract: A multimedia playing method is provided. First, N audio files selected by a user are received, wherein N>0. Then, the memory space required for playing each of the N audio files for a predetermined time is respectively detected. Next, whether total memory space required by the N audio files is not smaller than a predetermined value is determined. If the total memory space required by the N audio files is not smaller than the predetermined value, the predetermined time is reduced and the step of respectively detecting the memory space required for playing each of the N audio files for the predetermined time is executed again. If the total memory space required by the N audio files is smaller than the predetermined value, an initial part of each of the N audio files to be played for the predetermined time is stored into the memory.

Abstract: A multimedia playing method is provided. First, N audio files selected by a user are received, wherein N>0. Then, the memory space required for playing each of the N audio files for a predetermined time is respectively detected. Next, whether total memory space required by the N audio files is not smaller than a predetermined value is determined. If the total memory space required by the N audio files is not smaller than the predetermined value, the predetermined time is reduced and the step of respectively detecting the memory space required for playing each of the N audio files for the predetermined time is executed again. If the total memory space required by the N audio files is smaller than the predetermined value, an initial part of each of the N audio files to be played for the predetermined time is stored into the memory.