Patents by Inventor Jen-Kai OU

Jen-Kai OU has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • SEMICONDUCTOR DEVICE PACKAGE AND METHOD FOR MANUFACTURING THE SAME
    Publication number: 20230335533
    Abstract: A semiconductor device includes: a substrate having a first surface and a second surface opposite to the first surface; an electronic component disposed on the first surface of the substrate; a sensor disposed adjacent to the second surface of the substrate; an electrical contact disposed on the first surface of the substrate; and a package body exposing a portion of the electrical contact.
    Type: Application
    Filed: June 20, 2023
    Publication date: October 19, 2023
    Applicant: Advanced Semiconductor Engineering, Inc.
    Inventors: Chih-Ming HUNG, Meng-Jen WANG, Tsung-Yueh TSAI, Jen-Kai OU
  • Semiconductor device package and method for manufacturing the same
    Patent number: 11682653
    Abstract: A semiconductor device includes: a substrate having a first surface and a second surface opposite to the first surface; an electronic component disposed on the first surface of the substrate; a sensor disposed adjacent to the second surface of the substrate; an electrical contact disposed on the first surface of the substrate; and a package body exposing a portion of the electrical contact.
    Type: Grant
    Filed: February 19, 2021
    Date of Patent: June 20, 2023
    Assignee: ADVANCED SEMICONDUCTOR ENGINEERING, INC.
    Inventors: Chih-Ming Hung, Meng-Jen Wang, Tsung-Yueh Tsai, Jen-Kai Ou
  • SEMICONDUCTOR DEVICE PACKAGE AND METHOD FOR MANUFACTURING THE SAME
    Publication number: 20210175205
    Abstract: A semiconductor device includes: a substrate having a first surface and a second surface opposite to the first surface; an electronic component disposed on the first surface of the substrate; a sensor disposed adjacent to the second surface of the substrate; an electrical contact disposed on the first surface of the substrate; and a package body exposing a portion of the electrical contact.
    Type: Application
    Filed: February 19, 2021
    Publication date: June 10, 2021
    Applicant: Advanced Semiconductor Engineering, Inc.
    Inventors: Chih-Ming HUNG, Meng-Jen WANG, Tsung-Yueh TSAI, Jen-Kai OU
  • Semiconductor device package and method for manufacturing the same
    Patent number: 10937761
    Abstract: A semiconductor device includes: a substrate having a first surface and a second surface opposite to the first surface; an electronic component disposed on the first surface of the substrate; a sensor disposed adjacent to the second surface of the substrate; an electrical contact disposed on the first surface of the substrate; and a package body exposing a portion of the electrical contact.
    Type: Grant
    Filed: December 10, 2019
    Date of Patent: March 2, 2021
    Assignee: ADVANCED SEMICONDUCTOR ENGINEERING, INC.
    Inventors: Chih-Ming Hung, Meng-Jen Wang, Tsung-Yueh Tsai, Jen-Kai Ou
  • SEMICONDUCTOR DEVICE PACKAGE AND METHOD FOR MANUFACTURING THE SAME
    Publication number: 20200118968
    Abstract: A semiconductor device includes: a substrate having a first surface and a second surface opposite to the first surface; an electronic component disposed on the first surface of the substrate; a sensor disposed adjacent to the second surface of the substrate; an electrical contact disposed on the first surface of the substrate; and a package body exposing a portion of the electrical contact.
    Type: Application
    Filed: December 10, 2019
    Publication date: April 16, 2020
    Applicant: Advanced Semiconductor Engineering, Inc.
    Inventors: Chih-Ming HUNG, Meng-Jen WANG, Tsung-Yueh TSAI, Jen-Kai OU
  • Semiconductor package device
    Patent number: 10545581
    Abstract: An electronic device includes a piezoelectric module, a sensing module and a buffer element. The piezoelectric module includes a substrate and a piezoelectric element. The substrate defines an opening penetrating the substrate. The piezoelectric element is disposed on the substrate and across the opening of the substrate. The sensing module is disposed over the piezoelectric module. The buffer element is disposed between the piezoelectric module and the sensing module.
    Type: Grant
    Filed: October 5, 2017
    Date of Patent: January 28, 2020
    Assignee: ADVANCED SEMICONDUCTOR ENGINEERING, INC.
    Inventors: Jen-Kai Ou, Meng-Jen Wang, Tsung-Yueh Tsai, Chih-Ming Hung
  • Semiconductor device package and method for manufacturing the same
    Patent number: 10522505
    Abstract: A surface mount structure includes a substrate, a sensor, an electrical contact and a package body. The substrate has a first surface and a second surface opposite to the first surface. The sensor is disposed adjacent to the second surface of the substrate. The electrical contact is disposed on the first surface of the substrate. The package body covers the first surface and the second surface of the substrate, a portion of the sensor and a first portion of the electrical contact.
    Type: Grant
    Filed: March 12, 2018
    Date of Patent: December 31, 2019
    Assignee: ADVANCED SEMICONDUCTOR ENGINEERING, INC.
    Inventors: Chih-Ming Hung, Meng-Jen Wang, Tsung-Yueh Tsai, Jen-Kai Ou
  • SEMICONDUCTOR PACKAGE DEVICE
    Publication number: 20190107897
    Abstract: An electronic device includes a piezoelectric module, a sensing module and a buffer element. The piezoelectric module includes a substrate and a piezoelectric element. The substrate defines an opening penetrating the substrate. The piezoelectric element is disposed on the substrate and across the opening of the substrate. The sensing module is disposed over the piezoelectric module. The buffer element is disposed between the piezoelectric module and the sensing module.
    Type: Application
    Filed: October 5, 2017
    Publication date: April 11, 2019
    Applicant: Advanced Semiconductor Engineering, Inc.
    Inventors: Jen-Kai OU, Meng-Jen WANG, Tsung-Yueh TSAI, Chih-Ming HUNG
  • SEMICONDUCTOR DEVICE PACKAGE AND METHOD FOR MANUFACTURING THE SAME
    Publication number: 20180294247
    Abstract: A surface mount structure includes a substrate, a sensor, an electrical contact and a package body. The substrate has a first surface and a second surface opposite to the first surface. The sensor is disposed adjacent to the second surface of the substrate. The electrical contact is disposed on the first surface of the substrate. The package body covers the first surface and the second surface of the substrate, a portion of the sensor and a first portion of the electrical contact.
    Type: Application
    Filed: March 12, 2018
    Publication date: October 11, 2018
    Applicant: Advanced Semiconductor Engineering, Inc.
    Inventors: Chih-Ming HUNG, Meng-Jen WANG, Tsung-Yueh TSAI, Jen-Kai OU