Abstract: A device is disclosed and includes an input stage circuit, a switching circuit, and a first latch circuit. The input stage circuit generates a first input signal having a first voltage and a second input signal based on a third input signal. The switching circuit operates in response to a first control signal, and adjusts a voltage level of a first data line according to the first input signal and a voltage level of a second data line according to the second input signal. The first latch circuit is coupled to the switching circuit by the first data line and the second data line. The first latch circuit latches a data in response to the first control signal and a second control signal, and adjusts the voltage level of the first data line based on a second voltage different from the first voltage.

Abstract: A memory circuit includes a memory array comprising a first portion comprising a plurality of first memory cells, and a second portion comprising a plurality of second memory cells. The memory circuit includes an input/output (I/O) circuit physically disposed next to the memory array along a first lateral direction. The I/O circuit is operatively coupled to the first portion and the second portion through a first access line and a second access line, respectively. The memory circuit includes a first pre-charge circuit physically disposed opposite the first portion from the I/O circuit, and configured to charge the first access line prior to accessing the first memory cells. The memory circuit includes a second pre-charge circuit physically disposed opposite the second portion from the first pre-charge circuit, and configured to charge at least a portion of the second access line prior to accessing the second memory cells.

Abstract: A method of performing an in-memory computation includes storing a first subset of data in a first segment of a first memory array and a second subset of the data in a second segment of the first memory array, latching a first data bit from a first column of memory cells in the first segment of the first memory array, sequentially reading a plurality of second data bits from a second column of memory cells in the second segment of the first memory array, and performing a logic operation on each combination of the latched first data bit and each second data bit.

Abstract: Circuit devices, such as integrated circuit devices, are constructed with combination circuits that include two or more cascading transistors, and one or more metal layers disposed over the cascading transistors. The cascading transistors include multiple internal nodes (e.g., common source/drain regions). The multiple internal nodes are not connected to a common metal stripe (the same metal stripe) in the one or more metal layers. The absence of the connections between the internal nodes and a common metal stripe reduce or eliminate the load on the internal nodes. The transistors in the cascading transistors are independent of each other.

Abstract: In one embodiment, a static random access memory (SRAM) device is provided. The SRAM device includes a memory cell, a bit line couple to the memory cell, a voltage supply line coupled to the memory cell, a control circuitry. The control circuitry is configured to charge a voltage supply line while the voltage supply line is electrically isolated from a bit line. A portion of the charge is transferred from the voltage supply line to the bit line. The voltage supply line is recharged while the voltage supply line is electrically isolated from the bit line storing the transferred portion of the charge. The memory cell is accessed using the recharge on the voltage supply line.

Abstract: A memory device has a memory cell operated in a first power domain having a first voltage level. A memory word line is connected to the memory cell, and a memory bit line is connected to the memory cell. A word line decoder circuit is operated in the first power domain, and a word line driver circuit is configured to receive a row address signal from the word line decoder circuit and output a word line enable signal to the memory word line. An IO circuit is connected to the memory bit line, and the IO circuit is operated in a second power domain having a second voltage level lower than the first voltage level. A tracking word line is connected to a tracking cell, and the tracking word line is configured to output a tracking cell enable signal in the first power domain. A tracking bit line is connected to the tracking cell, and the tracking bit line is configured to output a trigger signal in the first power domain to the IO circuit.

Abstract: Disclosed herein are related to an integrated circuit to regulate a supply voltage. In one aspect, the integrated circuit includes a metal rail including a first point, at which a first functional circuit is connected, and a second point, at which a second functional circuit is connected. In one aspect, the integrate circuit includes a voltage regulator coupled between the first point of the metal rail and the second point of the metal rail. In one aspect, the voltage regulator senses a voltage at the second point of the metal rail and adjusts a supply voltage at the first point of the metal rail, according to the sensed voltage at the second point of the metal rail.

Abstract: A memory device and a method of operating the same are disclosed. In one aspect, the memory device includes a plurality of memory arrays and a controller including a plurality of buffers including a first buffer connected to a first memory array and a second buffer connected to a second memory array. The first and second memory arrays are disposed on opposing sides of the controller. The memory device can include a first wire extending in a first direction and connected to the first buffer, a second wire extending in the first direction and connected to the second buffer, and a third wire connected to the first and second wires and extending in a second direction that is substantially perpendicular to the first direction. The third wire can be electrically connected to the controller, and respective lengths of the first wire and the second wire are substantially the same.

Abstract: Disclosed herein are related to a memory system including unit storage circuits. In one aspect, each of the unit storage circuits abuts an adjacent one of the unit storage circuits. In one aspect, each of the unit storage circuits includes a first group of memory cells, a second group of memory cells, a first sub-word line driver to apply a first control signal to the first group of memory cells through a first sub-word line extending along a direction, and a second sub-word line driver to apply a second control signal to the second group of memory cells through a second sub-word line extending along the direction. In one aspect, the memory system includes a common word line driver abutting one of the unit storage circuits and configured to apply a common control signal to the unit storage circuits through a word line extending along the direction.

Abstract: A memory circuit includes a first and second bit line coupled to a set of memory cells, a local input output (LIO) circuit coupled to the set of memory cells by the first and second bit line. The LIO circuit includes a first and second data line, and a first control circuit. The LIO circuit further includes a switching circuit configured to transfer a first and second input signal to the corresponding first and second data line during a write operation of the set of memory cells, and to electrically isolate the first and second data line from the first and second input signal during a read operation of the set of memory cells. The LIO circuit further includes a first latch circuit configured as a sense amplifier during the read operation, and configured as a write-in latch during the write operation.

Abstract: A memory device includes a memory cell in a first power domain of a first power supply voltage, a bit line coupled to the memory cell, and a write assist circuit. The write assist circuit includes an input, an output electrically couplable to the bit line in a write operation of the memory cell, an input circuit electrically coupled to the input, and an output circuit electrically coupled between the input circuit and the output. The input circuit is in a second power domain of a second power supply voltage different from the first power supply voltage, and the output circuit is in the first power domain.

Abstract: A device includes first and second gate electrodes, a word line and a first metal island. The first gate electrode corresponds to transistors of a memory cell. The second gate electrode is separated from the first gate electrode and corresponds to the transistors. The word line is coupled to the memory cell and located between the first and the second gate electrodes. The first metal island is configured to couple a first power supply to the memory cell. A first boundary of the first metal island is located between first and second boundaries of the first gate electrode and is located between first and second boundaries of the word line, and each of the first boundary of the first gate electrode and the first boundary of the word line is located between first and second boundaries of the first metal island.

Abstract: A memory circuit includes a NAND logic gate configured to generate a first signal responsive to at least one of a first bit line signal or a second bit line signal, a first P-type transistor coupled to the NAND logic gate, and configured to receive a first clock signal, a first N-type transistor coupled to the NAND logic gate, and configured to receive a first pre-charge signal, and a first latch coupled to the NAND logic gate, and configured to latch the first signal in response to an inverted first pre-charge signal. The inverted first pre-charge signal is inverted from the first pre-charge signal.

Abstract: Circuit devices, such as integrated circuit devices, are constructed with combination circuits that include two or more cascading transistors, and one or more metal layers disposed over the cascading transistors. The cascading transistors include multiple internal nodes (e.g., common source/drain regions). The multiple internal nodes are not connected to a common metal stripe (the same metal stripe) in the one or more metal layers. The absence of the connections between the internal nodes and a common metal stripe reduce or eliminate the load on the internal nodes. The transistors in the cascading transistors are independent of each other.

Abstract: In one embodiment, a static random access memory (SRAM) device is provided. The SRAM device includes a memory cell, a bit line couple to the memory cell, a voltage supply line coupled to the memory cell, a control circuitry. The control circuitry is configured to charge a voltage supply line while the voltage supply line is electrically isolated from a bit line. A portion of the charge is transferred from the voltage supply line to the bit line. The voltage supply line is recharged while the voltage supply line is electrically isolated from the bit line storing the transferred portion of the charge. The memory cell is accessed using the recharge on the voltage supply line.

Abstract: The present disclosure provides a bone harvester for harvesting a bone core from a bone. Also provided are tools operable with the bone harvester, including a pushing tool and a bone harvesting guide. The present disclosure also provides a method of processing a bone by using the bone harvester and/or other tools of the present disclosure. Bone cores having distorted cylindrical bodies are also described.

Abstract: Disclosed herein are related to a memory system including unit storage circuits. In one aspect, each of the unit storage circuits abuts an adjacent one of the unit storage circuits. In one aspect, each of the unit storage circuits includes a first group of memory cells, a second group of memory cells, a first sub-word line driver to apply a first control signal to the first group of memory cells through a first sub-word line extending along a direction, and a second sub-word line driver to apply a second control signal to the second group of memory cells through a second sub-word line extending along the direction. In one aspect, the memory system includes a common word line driver abutting one of the unit storage circuits and configured to apply a common control signal to the unit storage circuits through a word line extending along the direction.

Abstract: An input/output circuit comprises a bypass circuit, a first latch, a second latch, a first transistor, and a second transistor. The bypass circuit is configured to directly receive a data signal and indirectly receive a write enable signal. The first latch is coupled between a first data line and a second data line. The second latch is operatively coupled to the first latch and configured to generate a data output signal based on a voltage level presented on the second data line. The first transistor is coupled to the first latch and gated by a sense enable signal. The second transistor is coupled to the first latch and gated by a clock signal. The first transistor and the second transistor are alternately activated in each of a plurality of operation modes of the input/output circuit.

Abstract: A device is disclosed and includes an input stage circuit, a switching circuit, and a first latch circuit. The input stage circuit generates a first input signal having a first voltage and a second input signal based on a third input signal. The switching circuit operates in response to a first control signal, and adjusts a voltage level of a first data line according to the first input signal and a voltage level of a second data line according to the second input signal. The first latch circuit is coupled to the switching circuit by the first data line and the second data line. The first latch circuit latches a data in response to the first control signal and a second control signal, and adjusts the voltage level of the first data line based on a second voltage different from the first voltage.

Abstract: A device includes first and second gate electrodes, a word line and a first metal island. The first gate electrode corresponds to transistors of a memory cell. The second gate electrode is separated from the first gate electrode and corresponds to the transistors. The word line is coupled to the memory cell and located between the first and the second gate electrodes. The first metal island is configured to couple a first power supply to the memory cell. A first boundary of the first metal island is located between first and second boundaries of the first gate electrode and is located between first and second boundaries of the word line, and each of the first boundary of the first gate electrode and the first boundary of the word line is located between first and second boundaries of the first metal island.