Abstract: Disclosed herein is a system for controlling a chilled water plant comprising one or more chillers, one or more water pumps, and a controller. The system comprise one or more processors configured to receive information comprising historical data for a plurality of system variables for the chilled water plant; determine historical performance information for the chilled water plant; prepare performance models comprising: at least one chiller predictive model; and at least one pump predictive model; prepare a field load predictive model for a field load demand; prepare a chilled water plant model; simulate operation of the chilled water plant and determining first optimised control parameters for the chilled water plant; determine an energy consumption of the chilled water plant; determine optimised control parameters for the chilled water plant; and output the optimised control parameters to the controller of the chilled water plant to optimise control of the chilled water plant.

Abstract: A 3D pop-up card assembly having a base card and a pop-up construct that pops up when the base card is opened. The pop-up construct is attached to the base card using a plurality of hinge elements. Each of the hinge elements has a transition section that leads to an anchor tab. The transition section contains fold lines along which each of the hinge elements can fold. The anchor tab of each hinge element is attached to the base card. When the base card is opened, each hinge element can rotate in unaligned planes, therein applying tension to the pop-up construct as the orientation between the base card and the pop-up construct changes.

Abstract: A system on a chip (SoC) with a Universal Asynchronous Receiver/Transmitter (UART) interface includes a UART interface circuit, a detection circuit, and a control circuit. The UART interface circuit includes: a plurality of UART signal pads for receiving and transmitting signals; and a UART voltage pad for receiving an external operating voltage. The detection circuit is configured to detect the magnitude of the external operating voltage and thereby generate a detection result. The control circuit is configured to determine setting of a supply voltage for the plurality of UART signal pads according to the detection result. The control circuit makes the setting of the supply voltage be compatible with the external operating voltage according to the detection result, wherein the external operating voltage is a lower first voltage or a higher second voltage, and the first lower voltage is equal to an internal device operating voltage of the SoC.

Abstract: A method includes forming an insulating layer over a package. The package has a plurality of locations where openings are subsequently formed. A first laser shot is performed, location by location, on each of the locations across the package. A first laser spot of the first laser shot overlaps with each of the locations. The first laser shot removes a first portion of the insulating layer below the first laser spot. Another laser shot is performed, location by location, on each of the locations across the package. Another laser spot of the another laser shot overlaps with each of the locations. The another laser shot removes another portion of the insulating layer below the another laser spot. Performing the another laser shot, location by location, on each of the locations across the package is repeated multiple times, until desired portions of the insulating layer are removed.

Abstract: A fan wheel heat dissipation structure includes a fan wheel and an air diversion radiator plate having an airflow guide ring surrounding a rotating shaft and airflow guide ribs with an air duct formed between each two adjacent airflow guide ribs, each air duct having an air inlet slot on one side to guide in external airflow and an airflow turning curved surface on an opposite side to guide intake airflow to be extruded outward, and a fan frame including an accommodation space for mounting the fan wheel and a shaft seat, a shaft seat disc mounted in the shaft seat, a shaft seat bracket, a fan air outlet, a shaft sleeve protruding from shaft seat disc for assembly of the rotating shaft, and through holes located outside the shaft seat and aligned with the internal space of the fan hub.

Abstract: A book assembly with internal electronics. The book assembly has the structure of a book with a front cover, a rear cover, and at least one page. A plurality of touch sensors are disposed within the book with at least some of the pages containing a touch sensor. A microphone and speaker are supported by the book assembly and are usable with the book assembly being either open or closed. The book assembly contains circuitry for recording and storing custom audio files made via the microphone. The circuity can also hold preset audio files that come with the book assembly. At least one control switch is accessible on the book structure for selecting between a recording mode and a play mode. In the recording mode, the circuitry records a custom audio file for each of said plurality of touch sensors. The custom audio recording is assigned to the touch sensor that is activated at the time of the recording.

Abstract: A fan anti-foreign matter structure includes a fan frame, and a fan wheel mounted in the fan frame to leave only the gap between the fan hub and a fan frame axle seat disk or a circuit board on a fan hub and the axle seat disk (i.e. fan hub interior space air outlet). The fan wheel is equipped with an air diversion radiator plate surrounding a rotating shaft, so that air ducts are defined between airflow guide ribs and airflow guide ring of the air diversion radiator plate. Each air duct has an air inlet slot one side, and an airflow turning curved surface on the other side for squeezing airflow entering the air duct outward to discharge hot air downward so that a positive pressure is formed at an air outlet to prevent dirty air containing dust, salt, etc. from the external space from entering a fan hub.

Abstract: A test equipment is provided, which includes a cabin for providing a low-temperature testing environment for elements under test, and an air curtain structure surrounding the cabin to send dry air toward the cabin. The air curtain structure includes a ring body and a plurality of openings disposedinside the ring body, so that the ring body can send dry air toward the cabin through the plurality of openings, thereby reducing the ambient humidity and preventing condensation water dripping from causing the test equipment damage.

Abstract: Electronic system and physiological monitoring method are provided. The electronic system includes a camera, an auxiliary feature sensor, and an accelerator. The camera is configured to take a facial image of a user. The auxiliary feature sensor is configured to sense an auxiliary feature of the user. The accelerator is configured to calculate an emotional status of the user according to the facial image. When it is determined that the emotional status meets a preset emotional status, the accelerator is configured to calculate an emotional level of the user by analyzing the auxiliary feature, and determine whether to issue an alert signal accordingly.

Abstract: A polishing pad and a chemical mechanical polishing apparatus are provided. The polishing pad includes: a central portion, designed with a central recess; and a peripheral portion surrounding the central portion, and designed with at least one peripheral recess. The at least one peripheral recess is disposed along an annulus contour. A lower part of the peripheral recess is greater than an upper part of the peripheral recess in terms of diameter area, and is different from the upper part in shape.

Abstract: A workpiece holder includes a chuck body and a seal ring. The chuck body includes a receiving surface configured to receive a workpiece and at least one vacuum port configured to apply a vacuum seal. The seal ring surrounds a side surface of the chuck body. A top surface of the seal ring is higher than the receiving surface of the chuck body, and the workpiece leans against the seal ring when the vacuum seal is applied between the workpiece and the chuck body.

Abstract: A microfluidic sensor chip includes a body comprising a substrate and an upper cover, and the upper cover having at least one opening, at least one microfluidic channel formed on the substrate and has a supporting surface, wherein the at least one microfluidic channel communicates with the at least one opening, and a metamaterial layer coated on the supporting surface, wherein the metamaterial layer has a plurality of regions, and each region has a corresponding resonance pattern. The present disclosure further provides a measuring system for microfluidic sensor chip includes a carrying board, a plurality of the microfluidic sensor chips, a transmitter emitting a terahertz wave corresponding to the resonance pattern of one of the microfluidic sensor chips, a receiver receiving a reflected wave corresponding to the terahertz wave, and a processor receiving the reflected wave from the processor, and determining a testing sample characteristic according to the reflected wave.

Abstract: A semiconductor package includes a package substrate, an integrated interconnect structure, an optical engine module, and an integrated circuit package. The integrated interconnect structure is bonded over the package substrate and includes an insulation body, a plurality of through vias extending through the insulation body. The optical engine module includes an electronic die, a photonic die, and a waveguide. A portion of the optical engine module is embedded in the integrated interconnect structure. The integrated circuit package is bonded over the integrated interconnect structure and electrically coupled to the optical engine module.

Abstract: A manufacturing method of a semiconductor package includes the following steps. A semiconductor device is attached to a carrier by an adhesive layer on the carrier. The semiconductor device is encapsulated by an encapsulating material. A redistribution structure is provided over the semiconductor device and the encapsulating material. The carrier is removed. The adhesive layer is partially removed by anisotropic etching process to form an adhesive residue, wherein the adhesive residue at least reveals a back surface of the semiconductor device and at least partially covers the encapsulating material.

Abstract: An invasive multi-electrode electrochemical sensor includes a substrate, plural wire electrodes and plural gold fingers. Each wire electrode includes an electrically conductive core and an insulating sheath that substantially covers, but exposes a proximal end and a distal end of, the electrically conductive core. Each wire electrode has a substrate section provided on the substrate and an invasion section extending outward from an edge of the substrate. The proximal end and distal end of the electrically conductive core of each wire electrode are located at the substrate section and invasion section of the wire electrode respectively. The invasion sections are at least partially wound around one another spirally. The electrically conductive core in the substrate section of each wire electrode is electrically connected to the corresponding gold finger. At least a part of the gold fingers is printed on the substrat by screen printing.

Abstract: An invasive multi-electrode electrochemical sensor includes a substrate and plural wire electrodes. Each wire electrode includes an electrically conductive core and an insulating sheath that substantially covers, but exposes a proximal end and a distal end of, the electrically conductive core. Each wire electrode has a substrate section provided on the substrate and an invasion section extending outward from an edge of the substrate. The proximal end and distal end of the electrically conductive core of each wire electrode are located at the substrate section and invasion section of the wire electrode respectively. The invasion sections are at least partially wound around one another spirally. The distal end of at least one of the electrically conductive cores is made of a material different from that of the other portion of the electrically conductive core.

Abstract: An invasive multi-electrode electrochemical sensor includes a substrate and plural wire electrodes. Each wire electrode includes an electrically conductive core and an insulating sheath that substantially covers, but exposes a proximal end and a distal end of, the electrically conductive core. Each wire electrode has a substrate section provided on the substrate and an invasion section extending outward from an edge of the substrate. The proximal end and distal end of the electrically conductive core of each wire electrode are located at the substrate section and invasion section of the wire electrode respectively. The invasion sections are at least partially wound around one another spirally. The electrically conductive core in the invasion section of at least one of the wire electrodes is different in material from the electrically conductive cores of the other wire electrodes.

Abstract: A 3D pop-up card assembly having a base card and a foldable figure that pops up when the base card is opened. The foldable figure is attached to the base card using a plurality of paper hinge constructs. Each of the paper hinge constructs has a first tab, a second tab and a transition section. The transition section contains fold lines along which each of the paper hinge constructs can fold. The first tab of each paper hinge construct is attached to the base card. The second tab of each paper hinge construct is attached to the foldable figure. When the base card is opened, each paper hinge construct can rotate in unaligned planes, therein applying tension to the foldable figure as the orientation between the base card and the foldable figure changes.

Abstract: According to an exemplary embodiment, a substrate having a first area and a second area is provided. The substrate includes a plurality of pads. Each of the pads has a pad size. The pad size in the first area is larger than the pad size in the second area.