Patents by Inventor Jen Liu

Jen Liu has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • IN-SITU DEFECT COUNT DETECTION IN POST CHEMICAL MECHANICAL POLISHING
    Publication number: 20230298949
    Abstract: In-situ defect count detection in post chemical mechanical polishing (post-CMP) is provided. Post-CMP is performed, in-situ and according to a recipe, on a surface of a semiconductor wafer within a post-CMP chamber. A light signal is scanned over a target area of the surface of the semiconductor wafer and a reflected light signal reflected from the target area is detected. A defect count of defects present in the target area is determined based on the reflected light signal reflected from the target area.
    Type: Application
    Filed: March 16, 2022
    Publication date: September 21, 2023
    Inventors: Chun-Hung LIAO, Jeng-Chi LIN, Chi-Jen LIU, Liang-Guang CHEN, Huang-Lin CHAO
  • EXTERNAL HEATING SYSTEM FOR USE IN CHEMICAL MECHANICAL POLISHING SYSTEM
    Publication number: 20230294237
    Abstract: A chemical mechanical polishing (CMP) system includes a polishing pad configured to polish a substrate. The CMP system further includes a heating system configured to adjust a temperature of the polishing pad. The heating system comprises at least one heating element spaced apart from the polishing pad. The CMP system further includes a sensor configured to measure the temperature of the polishing pad.
    Type: Application
    Filed: March 21, 2023
    Publication date: September 21, 2023
    Inventors: Yi-Sheng LIN, Chi-Hsiang SHEN, Chi-Jen LIU, Chun-Wei Hsu, Yang-Chun CHENG, Kei-Wei CHEN
  • OPTICAL SYSTEM
    Publication number: 20230266635
    Abstract: An optical system includes a first optical element driving mechanism, including a first fixed assembly, a first movable assembly, and a first driving assembly. The first movable assembly is configured to be connected to at least two first optical elements. The first movable assembly includes a first movable element. The first driving assembly is configured to drive the first movable assembly to move relative to the first fixed assembly. The first fixed assembly and the first movable assembly are arranged along a main axis. The first driving assembly is configured to drive the first movable element to move around the main axis. A portion of the first driving assembly is disposed on the first movable element. When viewed in a direction perpendicular to the main axis, the first driving assembly exceeds the first fixed assembly and the first movable assembly.
    Type: Application
    Filed: February 22, 2023
    Publication date: August 24, 2023
    Inventors: Chan-Jung HSU, Chen-Hsin HUANG, Chen-Hung CHAO, Yi-Ho CHEN, Kun-Shih LIN, Shou-Jen LIU
  • OPTICAL SYSTEM
    Publication number: 20230266603
    Abstract: An optical system is provided and includes a first optical element driving mechanism, which includes a first fixed assembly, a first movable assembly, and a first driving assembly. The first movable assembly is configured to be connected to a first optical element, and the first movable assembly is movable relative to the first fixed assembly. The first movable assembly includes a first movable element and a second movable element. The first driving assembly is configured to drive the first movable assembly to move relative to the first fixed assembly. The first fixed assembly and the first movable assembly are arranged along a main axis, and when viewed along the main axis, a portion of the first movable element overlaps the second movable element.
    Type: Application
    Filed: September 2, 2022
    Publication date: August 24, 2023
    Inventors: Chan-Jung HSU, Chen-Hsin HUANG, Chen-Hung CHAO, Yi-Ho CHEN, Kun-Shih LIN, Shou-Jen LIU
  • OPTICAL SYSTEM
    Publication number: 20230269451
    Abstract: An optical system is provided and includes a first optical element driving mechanism, which includes a first fixed assembly, a first movable assembly, and a first driving assembly. The first movable assembly is configured to be connected to at least two first optical element, and the first movable assembly is movable relative to the first fixed assembly. The first movable assembly includes a first movable element. The first drive assembly is configured to drive the first movable assembly to move relative to the first fixed assembly. The first fixed assembly and the first movable assembly are arranged along a main axis, the first driving assembly is configured to drive the first movable element to move around the main axis, and a portion of the first driving assembly is disposed on the first movable element.
    Type: Application
    Filed: November 17, 2022
    Publication date: August 24, 2023
    Inventors: Chan-Jung HSU, Chen-Hsin HUANG, Chen-Hung CHAO, Yi-Ho CHEN, Kun-Shih LIN, Shou-Jen LIU
  • OPTICAL SYSTEM
    Publication number: 20230266561
    Abstract: An optical system is provided and includes a first optical element driving mechanism, which includes a first fixed assembly, a first movable assembly, and a first driving assembly. The first movable assembly is configured to be connected to a first optical element, and the first movable assembly is movable relative to the first fixed assembly. The first movable assembly includes a first movable element. The first drive assembly is configured to drive the first movable assembly to move relative to the first fixed assembly. The first fixed assembly and the first movable assembly are arranged along a main axis, and the first driving assembly is configured to drive the first movable element to move around the main axis.
    Type: Application
    Filed: August 5, 2022
    Publication date: August 24, 2023
    Inventors: Chan-Jung HSU, Chen-Hsin HUANG, Chen-Hung CHAO, Yi-Ho CHEN, Kun-Shih LIN, Shou-Jen LIU
  • OPTICAL SYSTEM
    Publication number: 20230266637
    Abstract: An optical system is provided and includes a first optical element driving mechanism, which includes a first fixed assembly, a first movable assembly, and a first driving assembly. The first movable assembly is configured to be connected to a first optical element, and the first movable assembly is movable relative to the first fixed assembly. The first movable assembly includes a first movable element and a second movable element. The first driving assembly is configured to drive the first movable assembly to move relative to the first fixed assembly. The first fixed assembly and the first movable assembly are arranged along a main axis, and the first driving assembly is configured to drive the second movable element to move along a first axis, thereby driving the first movable element to move around the main axis.
    Type: Application
    Filed: October 6, 2022
    Publication date: August 24, 2023
    Inventors: Chan-Jung HSU, Chen-Hsin HUANG, Chen-Hung CHAO, Yi-Ho CHEN, Kun-Shih LIN, Shou-Jen LIU
  • Polygonal optical mechanism and optical system
    Patent number: 11711597
    Abstract: An optical mechanism is provided. The optical mechanism includes an immovable part, a movable part, a drive assembly, and a guidance assembly. The movable part is connected to an optical element. The movable part is movable relative to the immovable part. The drive assembly drives the movable part to move relative to the immovable part. The guidance assembly guides the movable part to move along a first axis.
    Type: Grant
    Filed: October 22, 2021
    Date of Patent: July 25, 2023
    Assignee: TDK TAIWAN CORP.
    Inventors: Chen-Hsin Huang, Yi-Ho Chen, Ya-Hsiu Wu, Shou-Jen Liu
  • METAL HETEROJUNCTION STRUCTURE WITH CAPPING METAL LAYER
    Publication number: 20230230846
    Abstract: The current disclosure describes techniques of protecting a metal interconnect structure from being damaged by subsequent chemical mechanical polishing processes used for forming other metal structures over the metal interconnect structure. The metal interconnect structure is receded to form a recess between the metal interconnect structure and the surrounding dielectric layer. A metal cap structure is formed within the recess. An upper portion of the dielectric layer is strained to include a tensile stress which expands the dielectric layer against the metal cap structure to reduce or eliminate a gap in the interface between the metal cap structure and the dielectric layer.
    Type: Application
    Filed: March 15, 2023
    Publication date: July 20, 2023
    Inventors: Yi-Sheng LIN, Chi-Jen LIU, Chi-Hsiang SHEN, Te-Ming KUNG, Chun-Wei HSU, Chia-Wei HO, Yang-Chun CHENG, William Weilun HONG, Liang-Guang CHEN, Kei-Wei CHEN
  • Optical system
    Patent number: 11693213
    Abstract: An optical system includes a fixed module, a movable module and a driving assembly. The movable module moves relative to the fixed module, and the movable module includes a lens unit which includes a first lens, a second lens, a first side wall and a second side wall. The first side wall has a first surface, which directly contacts the second lens, and the second side wall directly contacts the first lens. A portion of the driving assembly is directly disposed on the lens unit, configured to drive the lens unit to move along an optical axis of the first lens. The first side wall further has a second surface opposite to the first surface, and the second surface directly contacts the portion of the driving assembly. The thickness of the first side wall is different from the thickness of the second side wall.
    Type: Grant
    Filed: August 11, 2021
    Date of Patent: July 4, 2023
    Assignee: TDK TAIWAN CORP.
    Inventors: Chih-Wei Weng, Chia-Pin Hsu, Shao-Kuang Huang, Kun-Shih Lin, Shou-Jen Liu, Sin-Jhong Song
  • OPTICAL ELEMENT DRIVING MECHANISM
    Publication number: 20230204901
    Abstract: An optical element driving mechanism is provided and includes a fixed assembly, a movable assembly, a driving assembly and a circuit assembly. The movable assembly is configured to connect an optical element, the movable assembly is movable relative to the fixed assembly, and the optical element has an optical axis. The driving assembly is configured to drive the movable assembly to move relative to the fixed assembly. The circuit assembly includes a plurality of circuits and is affixed to the fixed assembly.
    Type: Application
    Filed: February 23, 2023
    Publication date: June 29, 2023
    Inventors: Sin-Hong LIN, Yung-Ping YANG, Wen-Yen HUANG, Yu-Cheng LIN, Kun-Shih LIN, Chao-Chang HU, Yung-Hsien YEH, Mao-Kuo HSU, Chih-Wei WENG, Ching-Chieh HUANG, Chih-Shiang WU, Chun-Chia LIAO, Chia-Yu CHANG, Hung-Ping CHEN, Wei-Zhong LUO, Wen-Chang LIN, Shou-Jen LIU, Shao-Chung CHANG, Chen-Hsin HUANG, Meng-Ting LIN, Yen-Cheng CHEN, I-Mei HUANG, Yun-Fei WANG, Wei-Jhe SHEN
  • Chemical mechanical polishing slurry composition, method for chemical mechanical polishing and method for forming connecting structure
    Patent number: 11658065
    Abstract: A method for CMP includes following operations. A metal layer is received. A CMP slurry composition is provided in a CMP apparatus. The CMP slurry composition includes at least a first oxidizer and a second oxidizer different from each other. The first oxidizer is oxidized to form a peroxidant by the second oxidizer. A portion of the metal layer is oxidized to form a first metal oxide by the peroxidant. The first metal oxide is re-oxidized to form a second metal oxide by the second oxidizer.
    Type: Grant
    Filed: June 15, 2020
    Date of Patent: May 23, 2023
    Assignee: TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY LTD.
    Inventors: Ji Cui, Fu-Ming Huang, Ting-Kui Chang, Tang-Kuei Chang, Chun-Chieh Lin, Wei-Wei Liang, Chi-Hsiang Shen, Ting-Hsun Chang, Li-Chieh Wu, Hung Yen, Chi-Jen Liu, Liang-Guang Chen, Kei-Wei Chen
  • SMART WIRELESS CHARGING CONTROL SYSTEM
    Publication number: 20230135257
    Abstract: A smart wireless charging control system including at least one receiver and a transmitter is provided. The receiver is configured to receive a charging signal to be charged and to start operating. The transmitter is configured to transmit the charging signal to scan the receiver to charge the receiver during an initialization period. During the initialization period, the transmitter rotates an angle for transmitting the charging signal by the transmitter and records a time of transmitting the charging signal and the angle for transmitting the charging signal.
    Type: Application
    Filed: July 4, 2022
    Publication date: May 4, 2023
    Applicant: E Ink Holdings Inc.
    Inventors: Chuen-Jen Liu, Jia-Hong Xu
  • Metal heterojunction structure with capping metal layer
    Patent number: 11637021
    Abstract: The current disclosure describes techniques of protecting a metal interconnect structure from being damaged by subsequent chemical mechanical polishing processes used for forming other metal structures over the metal interconnect structure. The metal interconnect structure is receded to form a recess between the metal interconnect structure and the surrounding dielectric layer. A metal cap structure is formed within the recess. An upper portion of the dielectric layer is strained to include a tensile stress which expands the dielectric layer against the metal cap structure to reduce or eliminate a gap in the interface between the metal cap structure and the dielectric layer.
    Type: Grant
    Filed: May 18, 2021
    Date of Patent: April 25, 2023
    Assignee: Taiwan Semiconductor Manufacturing Co., Ltd.
    Inventors: Yi-Sheng Lin, Chi-Jen Liu, Chi-Hsiang Shen, Te-Ming Kung, Chun-Wei Hsu, Chia-Wei Ho, Yang-Chun Cheng, William Weilun Hong, Liang-Guang Chen, Kei-Wei Chen
  • Electronic device and heat dissipating electromagnetic shielding structure
    Patent number: 11638367
    Abstract: An electronic device includes a substrate, at least one electronic element and a heat dissipating electromagnetic shielding structure. The heat dissipating electromagnetic shielding structure is disposed on the substrate and covers the at least one electronic element, wherein the heat dissipating electromagnetic shielding structure includes a shielding frame and a heatsink. The shielding frame includes a plurality of spring members. The spring members are bent toward the substrate and partially abut against the heatsink. When the heatsink and the shielding frame are correspondingly arranged, a shielding space is defined, the electronic element is disposed in the shielding space, and a heat generated by the at least one electronic element is conducted out of the shielding space via the heatsink.
    Type: Grant
    Filed: June 18, 2021
    Date of Patent: April 25, 2023
    Assignee: WISTRON NEWEB CORPORATION
    Inventors: Yan-Da Chen, Chien-Ming Peng, Yu-Jen Liu, Chih-Chuan Lin, Chi-Te Lin
  • External heating system for use in chemical mechanical polishing system
    Patent number: 11633829
    Abstract: A chemical mechanical polishing (CMP) system includes a polishing pad configured to polish a substrate. The CMP system further includes a heating system configured to adjust a temperature of the polishing pad. The heating system comprises at least one heating element spaced apart from the polishing pad. The CMP system further includes a sensor configured to measure the temperature of the polishing pad.
    Type: Grant
    Filed: September 17, 2019
    Date of Patent: April 25, 2023
    Assignee: Taiwan Semiconductor Manufacturing Co., Ltd.
    Inventors: Yi-Sheng Lin, Chi-Hsiang Shen, Chi-Jen Liu, Chun-Wei Hsu, Yang-Chun Cheng, Kei-Wei Chen
  • OPTICAL ELEMENT DRIVING MECHANISM
    Publication number: 20230120771
    Abstract: An optical element driving mechanism is provided and includes a fixed assembly, a movable assembly, a driving assembly and a stopping assembly. The fixed assembly has a main axis. The movable assembly is configured to connect an optical element, and the movable assembly is movable relative to the fixed assembly. The driving assembly is configured to drive the movable assembly to move relative to the fixed assembly. The stopping assembly is configured to limit the movement of the movable assembly relative to the fixed assembly within a range of motion.
    Type: Application
    Filed: December 15, 2022
    Publication date: April 20, 2023
    Inventors: Chao-Chang HU, Liang-Ting HO, Chen-Er HSU, Yi-Liang CHAN, Fu-Lai TSENG, Fu-Yuan WU, Chen-Chi KUO, Ying-Jen WANG, Wei-Han HSIA, Yi-Hsin TSENG, Wen-Chang LIN, Chun-Chia LIAO, Shou-Jen LIU, Chao-Chun CHANG, Yi-Chieh LIN, Shang-Yu HSU, Yu-Huai LIAO, Shih-Wei HUNG, Sin-Hong LIN, Kun-Shih LIN, Yu-Cheng LIN, Wen-Yen HUANG, Wei-Jhe SHEN, Chih-Shiang WU, Sin-Jhong SONG, Che-Hsiang CHIU, Sheng-Chang LIN
  • Optical element driving mechanism
    Patent number: 11619800
    Abstract: An optical element driving mechanism is provided and includes a fixed assembly, a movable assembly, a driving assembly and a circuit assembly. The movable assembly is configured to connect an optical element, the movable assembly is movable relative to the fixed assembly, and the optical element has an optical axis. The driving assembly is configured to drive the movable assembly to move relative to the fixed assembly. The circuit assembly includes a plurality of circuits and is affixed to the fixed assembly.
    Type: Grant
    Filed: October 9, 2020
    Date of Patent: April 4, 2023
    Assignee: TDK TAIWAN CORP.
    Inventors: Sin-Hong Lin, Yung-Ping Yang, Wen-Yen Huang, Yu-Cheng Lin, Kun-Shih Lin, Chao-Chang Hu, Yung-Hsien Yeh, Mao-Kuo Hsu, Chih-Wei Weng, Ching-Chieh Huang, Chih-Shiang Wu, Chun-Chia Liao, Chia-Yu Chang, Hung-Ping Chen, Wei-Zhong Luo, Wen-Chang Lin, Shou-Jen Liu, Shao-Chung Chang, Chen-Hsin Huang, Meng-Ting Lin, Yen-Cheng Chen, I-Mei Huang, Yun-Fei Wang, Wei-Jhe Shen
  • METHODS FOR CHEMICAL MECHANICAL POLISHING AND FORMING INTERCONNECT STRUCTURE
    Publication number: 20230082084
    Abstract: A method for CMP includes following operations. A metal stack is received. The metal layer stack includes at least a first metal layer and a second metal layer, and a top surface of the first metal layer and a top surface of the second metal layer are exposed. A protecting layer is formed over the second metal layer. A portion of the first metal layer is etched. The protecting layer protects the second metal layer during the etching of the portion of the first metal layer. A top surface of the etched first metal layer is lower than a top surface of the protecting layer. The protecting layer is removed from the second metal layer.
    Type: Application
    Filed: November 21, 2022
    Publication date: March 16, 2023
    Inventors: JI CUI, FU-MING HUANG, TING-KUI CHANG, TANG-KUEI CHANG, CHUN-CHIEH LIN, WEI-WEI LIANG, LIANG-GUANG CHEN, KEI-WEI CHEN, HUNG YEN, TING-HSUN CHANG, CHI-HSIANG SHEN, LI-CHIEH WU, CHI-JEN LIU
  • SLURRY COMPOSITION, SEMICONDUCTOR STRUCTURE AND METHOD FOR FORMING THE SAME
    Publication number: 20230064918
    Abstract: A slurry composition, a semiconductor structure and a method for forming a semiconductor structure are provided. The slurry composition includes a slurry and a precipitant dispensed in the slurry. The semiconductor structure comprises a blocking layer including at least one element of the precipitant. The method includes using the slurry composition with the precipitant to polish a conductive layer and causing the precipitant to flow into the gap.
    Type: Application
    Filed: August 30, 2021
    Publication date: March 2, 2023
    Inventors: CHUN-WEI HSU, CHIH-CHIEH CHANG, YI-SHENG LIN, JIAN-CI LIN, JENG-CHI LIN, TING-HSUN CHANG, LIANG-GUANG CHEN, JI CUI, KEI-WEI CHEN, CHI-JEN LIU