Patents by Inventor Jen-Mao CHEN

Jen-Mao CHEN has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 10986751
    Abstract: An external air baffle nozzle has a top surface, a bottom surface, and a pair of sidewalls separating the top surface from the bottom surface. An end of the pair of sidewalls, an end of the top surface and an end of the bottom surface define an inlet. An opposite end of the pair of sidewalls, an opposite end of the top surface, and an opposite end of the bottom surface define an outlet. The outlet has a smaller cross section than a cross section of the inlet.
    Type: Grant
    Filed: January 27, 2020
    Date of Patent: April 20, 2021
    Assignee: QUANTA COMPUTER INC.
    Inventors: Yi-Chieh Chen, Jen-Mao Chen, Wei-Te Wang, Shuo-Ting Jian
  • Patent number: 10381761
    Abstract: A circuit card assembly includes a circuit card having front and back ends, substantially parallel longitudinal edges between the front and back ends, and a bus connector extending from one of the longitudinal edges. The circuit card assembly includes a bracket structure providing a mounting surface, the mounting surface comprising a bracket for engaging with a plurality of adjacent ones of a plurality of bracket slots with openings at a fixed pitch. The circuit card assembly includes a connector assembly at the surface of said circuit card at the first end, with at least a first input/output (I/O) connector, and a second I/O connector in a stacked arrangement with respect to the surface of said circuit card, where the first I/O connector and the second I/O connector extend through the bracket and are separated by the fixed pitch.
    Type: Grant
    Filed: February 1, 2018
    Date of Patent: August 13, 2019
    Assignee: QUANTA COMPUTER INC.
    Inventors: Maw-Zan Jau, Jen-Mao Chen, Chun Chang
  • Publication number: 20190116690
    Abstract: The present disclosure provides a system and method for dynamically adjusting maximum fan duties in a server system. In accordance with one aspect of the present disclosure, a computer-implemented method for dynamically adjusting maximum fan duties in the server system, comprises: powering on the server system; receiving, from BIOS, bus interface information of a system board of the server system; determining that there is no rotation-vibration issues (RVI) sensitive device directly connected to the system board; and setting a first maximum fan duty for one or more cooling fans of the server system.
    Type: Application
    Filed: October 12, 2017
    Publication date: April 18, 2019
    Inventors: Chao-Jung CHEN, Yi-Chieh CHEN, Jen-Mao CHEN, Kai-Fan KU
  • Patent number: 10219365
    Abstract: A circuit card assembly includes a circuit card, a plurality of components disposed on a first surface of the circuit card in a shadow arrangement, and a plurality of air-cooled heat sink structures disposed on each of the components. Each of the plurality of heat sink structures comprises a plurality of impedance zones arranged in series substantially perpendicular to the airflow path, where the plurality of impedance zones comprise a first impedance zone having a first air impedance, and a second impedance zone having a second air impedance less than the first air impedance. Further, the plurality of zones in the plurality of heat sink structures are aligned so that the first impedance zone in one of the plurality of heat sink structures does not overlap with the first impedance zone in another of the plurality of heat sink structures, relative to the airflow path.
    Type: Grant
    Filed: February 23, 2018
    Date of Patent: February 26, 2019
    Assignee: QUANTA COMPUTER INC.
    Inventors: Chao-Jung Chen, Yi-Chieh Chen, Ming-Hung Tsai, Jen-Mao Chen
  • Publication number: 20190027850
    Abstract: A circuit card assembly includes a circuit card having front and back ends, substantially parallel longitudinal edges between the front and back ends, and a bus connector extending from one of the longitudinal edges. The circuit card assembly includes a bracket structure providing a mounting surface, the mounting surface comprising a bracket for engaging with a plurality of adjacent ones of a plurality of bracket slots with openings at a fixed pitch. The circuit card assembly includes a connector assembly at the surface of said circuit card at the first end, with at least a first input/output (I/O) connector, and a second I/O connector in a stacked arrangement with respect to the surface of said circuit card, where the first I/O connector and the second I/O connector extend through the bracket and are separated by the fixed pitch.
    Type: Application
    Filed: February 1, 2018
    Publication date: January 24, 2019
    Inventors: Maw-Zan JAU, Jen-Mao CHEN, Chun CHANG
  • Patent number: 9968005
    Abstract: Systems, methods and computer-readable media for reducing upstream preheat for high-density hard disk drive storage. A system can include first and second rows of storage devices installed in a storage rack, the first and second rows having a first distance between consecutive storage devices. The second row can be located behind the first row and farther away from a source of an airflow than the first row. The system can monitor a temperature associated with the second row and when the temperature rises above a threshold, the system can remove a storage device from the first row. The system can then adjust placement within the first row such that the remaining devices have a second, larger distance between each other to increase airflow to storage devices in the second row and reduce system impedance.
    Type: Grant
    Filed: March 8, 2016
    Date of Patent: May 8, 2018
    Assignee: QUANTA COMPUTER, INC.
    Inventors: Chao-Jung Chen, Yi-Chieh Chen, Jen-Mao Chen, Wei-Chun Chang
  • Patent number: 9968009
    Abstract: The present technology provides a system for supplying fresh air to downstream components. The system comprises a housing with a first end and a second end, a first plurality of partitions disposed in the housing, and a second plurality of partitions disposed in the housing. The housing comprises a base portion and first and second opposing sidewalls extending from the first end to the second end. Each of the first plurality of partitions includes at least one first ventilation opening associated with each of the plurality of compartments. Each one of the second plurality of partitions comprises at least one partition duct extending through the plurality of partition rows and at least one second ventilation opening connecting the at least one partition duct to associated ones of the plurality of compartments.
    Type: Grant
    Filed: January 24, 2017
    Date of Patent: May 8, 2018
    Assignee: QUANTA COMPUTER INC.
    Inventors: Chao-Jung Chen, Yi-Chieh Chen, Jen-Mao Chen, Wei-Chun Chang
  • Publication number: 20170325361
    Abstract: The present technology provides a system for supplying fresh air to downstream components. The system comprises a housing with a first end and a second end, a first plurality of partitions disposed in the housing, and a second plurality of partitions disposed in the housing. The housing comprises a base portion and first and second opposing sidewalls extending from the first end to the second end. Each of the first plurality of partitions includes at least one first ventilation opening associated with each of the plurality of compartments. Each one of the second plurality of partitions comprises at least one partition duct extending through the plurality of partition rows and at least one second ventilation opening connecting the at least one partition duct to associated ones of the plurality of compartments.
    Type: Application
    Filed: January 24, 2017
    Publication date: November 9, 2017
    Inventors: Chao-Jung CHEN, Yi-Chieh CHEN, Jen-Mao CHEN, Wei-Chun CHANG
  • Publication number: 20170265332
    Abstract: Systems, methods and computer-readable media for reducing upstream preheat for high-density hard disk drive storage. A system can include first and second rows of storage devices installed in a storage rack, the first and second rows having a first distance between consecutive storage devices. The second row can be located behind the first row and farther away from a source of an airflow than the first row. The system can monitor a temperature associated with the second row and when the temperature rises above a threshold, the system can remove a storage device from the first row. The system can then adjust placement within the first row such that the remaining devices have a second, larger distance between each other to increase airflow to storage devices in the second row and reduce system impedance.
    Type: Application
    Filed: March 8, 2016
    Publication date: September 14, 2017
    Inventors: Chao-Jung CHEN, Yi-Chieh CHEN, Jen-Mao CHEN, Wei-Chun CHANG