Abstract: A system includes a rack of servers and a fluid circuit for cooling the rack of servers. The fluid circuit includes one or more cooling modules, a heat-exchanging module, and a pump. The one or more cooling modules are thermally connected to a conduit for flowing a coolant therethrough. Each cooling module includes a heat-exchanger thermally connected to the conduit and a chiller fluidly coupled to the heat-exchanger. The heat-exchanging module is fluidly connected to an outlet of the conduit. The pump is configured to drive the coolant from the heat-exchanging module to each server in the rack of servers.

Abstract: A computing device comprises a housing, a heat-generating electronic component, at least one additional electronic component, and a liquid cooling module. The heat-generating component, the at least one additional electronic component, and the liquid cooling module are all positioned inside the housing. The liquid cooling module is configured to cool the heat-generating electronic component, and includes at least one movable radiator. The at least one movable radiator is configured to move between a first position and a second position. When the at least one movable radiator is in the first position, the at least one movable radiator blocks access to the at least one additional electronic component within the housing. When the at least one movable radiator is in the second position, the at least one movable radiator allows access to the at least one additional electronic component within the housing.

Abstract: A method and system controls cooling system leaks in a rack. The method includes monitoring leak detection sensors positioned at computer systems and below sections of a liquid conveyance system. In response to determining if a signal was received from one of the leak detection sensors that is indicative of a leak, the leak detection sensor and the corresponding one of the plurality of computer systems associated the received signal is determined. Power is disconnected to the corresponding one of the computer systems and a signal is transmitted to implement moving first and second valves from open to closed positions. The first valve is positioned within the liquid conveyance system between a hot rack manifold and a thermal contact structure associated with the computer system associated with the received signal. The second valve is positioned within the liquid conveyance system between a cool rack manifold and the thermal contact structure.

Abstract: A method and system controls cooling system leaks in a rack. The method includes monitoring leak detection sensors positioned at computer systems and below sections of a liquid conveyance system. In response to determining if a signal was received from one of the leak detection sensors that is indicative of a leak, the leak detection sensor and the corresponding one of the plurality of computer systems associated the received signal is determined. Power is disconnected to the corresponding one of the computer systems and a signal is transmitted to implement moving first and second valves from open to closed positions. The first valve is positioned within the liquid conveyance system between a hot rack manifold and a thermal contact structure associated with the computer system associated with the received signal. The second valve is positioned within the liquid conveyance system between a cool rack manifold and the thermal contact structure.

Abstract: A method and system controls cooling system leaks in a rack. The method includes monitoring leak detection sensors positioned at computer systems and below sections of a liquid conveyance system. In response to determining if a signal was received from one of the leak detection sensors that is indicative of a leak, the leak detection sensor and the corresponding one of the plurality of computer systems associated the received signal is determined. Power is disconnected to the corresponding one of the computer systems and a signal is transmitted to implement moving first and second valves from open to closed positions. The first valve is positioned within the liquid conveyance system between a hot rack manifold and a thermal contact structure associated with the computer system associated with the received signal. The second valve is positioned within the liquid conveyance system between a cool rack manifold and the thermal contact structure.

Abstract: A power supply system for a computer system having a fan module that protects the power supply system from backflow from the fan module is disclosed. A power supply unit has an internal fan emitting an airflow from one end of the power supply unit. The power supply unit is mountable next to the fan module. The power supply system is mountable in proximity to an air baffle that diverts the airflow generated by the internal fan. An air tunnel is located on one side of the power supply unit. The air tunnel has an opening on one end for receiving the airflow diverted by the air baffle from the internal fan. The air tunnel has an opposite end in proximity to a second opening to divert the received airflow under the power supply unit.

Abstract: Embodiments of the disclosure relate to active cooling devices for cooling an electronic assembly positioned downstream in a computing system. In one embodiment, an electronic assembly positioned downstream of the computing system is disclosed. The electronic assembly includes a printed circuit board electrically connected to the computing system; an air duct disposed over the printed circuit board; and an active cooling device thermally coupled to the printed circuit board. The printed circuit board includes a transceiver socket configured to receive at least one optical transceiver and one or more heat-generating components disposed thereon. The at least one optical transceiver is configured to mate with an active optical cable.

Abstract: A computing device comprises a housing, a heat-generating electronic component, at least one additional electronic component, and a liquid cooling module. The heat-generating component, the at least one additional electronic component, and the liquid cooling module are all positioned inside the housing. The liquid cooling module is configured to cool the heat-generating electronic component, and includes at least one movable radiator. The at least one movable radiator is configured to move between a first position and a second position. When the at least one movable radiator is in the first position tank, the at least one movable radiator blocks access to the at least one additional electronic component within the housing. When the at least one movable radiator is in the second position, the at least one movable radiator allows access to the at least one additional electronic component within the housing.

Abstract: A field-replaceable unit (FRU) identification circuit includes a reference voltage source, a reference resistor, a plurality of comparators, and a plurality of comparator input voltage sources. The reference voltage source provides a reference voltage. A first end of the reference resistor is electrically connected to the reference voltage source. Each comparator has two inputs and an output. A first input of each comparator is electrically connected to a second end of the reference resistor. The comparator input voltage sources each provide a comparator input voltage to the second input of one of the comparators. When an FRU is electrically connected to a circuit board where the FRU identification circuit is located, the outputs of the comparators are set to a distinct combination of logical values that uniquely identifies the FRU.

Abstract: A closed-loop liquid cooling system includes a liquid coolant conduit, a cold plate, a pump and a heat exchanger. The liquid coolant conduit is in proximity to a heat-generating electrical component. The liquid coolant conduit allows circulation of a liquid coolant to extract heat therefrom. The liquid coolant conduit includes an inner portion that surrounds and contains the liquid coolant, and an outer portion configured to prevent or inhibit leakage of the liquid coolant from the inner portion and also detect any leakage from the inner portion. The cold plate is in thermal communication with the liquid coolant. The pump is configured to transport the liquid coolant in the liquid coolant conduit. The heat exchanger is coupled to the liquid coolant conduit to extract heat therefrom.

Abstract: A power supply system for a computer system having a fan module that protects the power supply system from backflow from the fan module is disclosed. A power supply unit has an internal fan emitting an airflow from one end of the power supply unit. The power supply unit is mountable next to the fan module. The power supply system is mountable in proximity to an air baffle that diverts the airflow generated by the internal fan. An air tunnel is located on one side of the power supply unit. The air tunnel has an opening on one end for receiving the airflow diverted by the air baffle from the internal fan. The air tunnel has an opposite end in proximity to a second opening to divert the received airflow under the power supply unit.

Abstract: A system includes a rack of servers and a fluid circuit for cooling the rack of servers. The fluid circuit includes one or more cooling modules, a heat-exchanging module, and a pump. The one or more cooling modules are thermally connected to a conduit for flowing a coolant therethrough. Each cooling module includes a heat-exchanger thermally connected to the conduit and a chiller fluidly coupled to the heat-exchanger. The heat-exchanging module is fluidly connected to an outlet of the conduit. The pump is configured to drive the coolant from the heat-exchanging module to each server in the rack of servers.

Abstract: Embodiments of the disclosure relate to active cooling devices for cooling an electronic assembly positioned downstream in a computing system. In one embodiment, an electronic assembly positioned downstream of the computing system is disclosed. The electronic assembly includes a printed circuit board electrically connected to the computing system; an air duct disposed over the printed circuit board; and an active cooling device thermally coupled to the printed circuit board. The printed circuit board includes a transceiver socket configured to receive at least one optical transceiver and one or more heat-generating components disposed thereon. The at least one optical transceiver is configured to mate with an active optical cable.

Abstract: A computing device has a fan housing that includes a dual rotor fan with a first rotor and a second rotor. The computing device also includes a controller communicatively coupled to the dual rotor fan. The controller is operable to detect a failure associated with the first rotor. In response to detecting the failure, the controller is operable to drive the second rotor at a higher speed than a fan-speed at which the second rotor was being driven before the failure.

Abstract: A computing device has a fan housing that includes a dual rotor fan with a first rotor and a second rotor. The computing device also includes a controller communicatively coupled to the dual rotor fan. The controller is operable to detect a failure associated with the first rotor. In response to detecting the failure, the controller is operable to drive the second rotor at a higher speed than a fan-speed at which the second rotor was being driven before the failure.

Abstract: An electronic device operating in standby mode is provided. The electronic device includes a power supply unit, a cooling device coupled to the power supply unit, at least one electronic component cooled by the cooling device, and a controller coupled to the cooling device. The controller is operable to periodically monitor power data and the temperature of the at least one electronic component in standby mode. The controller is also operable to regulate power supplied to the cooling device based on the monitored power data and the temperature of the at least one electronic component.

Abstract: An external air baffle nozzle has a top surface, a bottom surface, and a pair of sidewalls separating the top surface from the bottom surface. An end of the pair of sidewalls, an end of the top surface and an end of the bottom surface define an inlet. An opposite end of the pair of sidewalls, an opposite end of the top surface, and an opposite end of the bottom surface define an outlet. The outlet has a smaller cross section than a cross section of the inlet.

Abstract: A circuit card assembly includes a circuit card having front and back ends, substantially parallel longitudinal edges between the front and back ends, and a bus connector extending from one of the longitudinal edges. The circuit card assembly includes a bracket structure providing a mounting surface, the mounting surface comprising a bracket for engaging with a plurality of adjacent ones of a plurality of bracket slots with openings at a fixed pitch. The circuit card assembly includes a connector assembly at the surface of said circuit card at the first end, with at least a first input/output (I/O) connector, and a second I/O connector in a stacked arrangement with respect to the surface of said circuit card, where the first I/O connector and the second I/O connector extend through the bracket and are separated by the fixed pitch.

Abstract: The present disclosure provides a system and method for dynamically adjusting maximum fan duties in a server system. In accordance with one aspect of the present disclosure, a computer-implemented method for dynamically adjusting maximum fan duties in the server system, comprises: powering on the server system; receiving, from BIOS, bus interface information of a system board of the server system; determining that there is no rotation-vibration issues (RVI) sensitive device directly connected to the system board; and setting a first maximum fan duty for one or more cooling fans of the server system.

Abstract: A circuit card assembly includes a circuit card, a plurality of components disposed on a first surface of the circuit card in a shadow arrangement, and a plurality of air-cooled heat sink structures disposed on each of the components. Each of the plurality of heat sink structures comprises a plurality of impedance zones arranged in series substantially perpendicular to the airflow path, where the plurality of impedance zones comprise a first impedance zone having a first air impedance, and a second impedance zone having a second air impedance less than the first air impedance. Further, the plurality of zones in the plurality of heat sink structures are aligned so that the first impedance zone in one of the plurality of heat sink structures does not overlap with the first impedance zone in another of the plurality of heat sink structures, relative to the airflow path.