Patents by Inventor Jen-Shing CHEN

Jen-Shing CHEN has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Fixing structure of electronic device
    Patent number: 10079441
    Abstract: A fixing structure of electronic components has a first substrate, at least one second substrate, at least one electronic component, and at least one fixing mechanism. Each second substrate has at least two first pins to electrically connect to the first substrate. Multiple second pins formed on a side surface of the electronic component are electrically connected to the second substrate. The at least one fixing mechanism covers the at least one electronic component and the at least one second substrate. A first mounting part and a second mounting part respectively extend downward from opposite sides of the at least one fixing mechanism for clamping the electronic component and the second substrate so that the at least one electronic component and the at least one second substrate are erectly mounted on the first substrate. Thus, more electronic components are allowed to be erectly mounted on the first substrate.
    Type: Grant
    Filed: February 27, 2017
    Date of Patent: September 18, 2018
    Assignee: JIANGYIN SINBON ELECTRONICS CO., LTD.
    Inventors: Jen-Shing Chen, Xue Feng Zhang, Jian Zhou
  • FIXING STRUCTURE OF ELECTRONIC DEVICE
    Publication number: 20180166805
    Abstract: A fixing structure of electronic components has a first substrate, at least one second substrate, at least one electronic component, and at least one fixing mechanism. Each second substrate has at least two first pins to electrically connect to the first substrate. Multiple second pins formed on a side surface of the electronic component are electrically connected to the second substrate. The at least one fixing mechanism covers the at least one electronic component and the at least one second substrate. A first mounting part and a second mounting part respectively extend downward from opposite sides of the at least one fixing mechanism for clamping the electronic component and the second substrate so that the at least one electronic component and the at least one second substrate are erectly mounted on the first substrate. Thus, more electronic components are allowed to be erectly mounted on the first substrate.
    Type: Application
    Filed: February 27, 2017
    Publication date: June 14, 2018
    Applicant: JIANGYIN SINBON ELECTRONICS CO., LTD.
    Inventors: Jen-Shing CHEN, Xue Feng ZHANG, Jian ZHOU