Abstract: A front light module which includes a light guide plate, a light-emitting component and a barrier layer is provided. The light guide plate has a light incident surface and a light exiting surface which is adjacent to the light incident surface, and the light-emitting component emits the light toward the light incident surface. The barrier layer which includes the materials with silicon bonding is located on the light exiting surface of the light guide plate. The water vapor transmission rate of the barrier layer is lower than 0.1 g/m2/day.

Abstract: A display device includes a driving circuit substrate, a display layer, an opposite substrate, and a conducting structure. The driving circuit substrate includes a first substrate and a driving circuit layer disposed on the first substrate. The driving circuit layer includes a display region, a peripheral region at the periphery of the display region, and a conducting pad located between the peripheral region and an edge of the first substrate. The opposite substrate includes a second substrate and an opposite electrode layer disposed on the second substrate. The display layer is located between the opposite electrode layer and the driving circuit layer. A conductive member of the conducting structure is connected between the conducting pad and the opposite electrode layer. The conducting structure has a first width. The peripheral region has a second width. The first width is less than or equal to 2.5 times the second width.

Abstract: A display device includes a driving substrate, a display medium layer, a protection assembly, a sealant layer, a driving chip, and a conductive substance. The driving substrate has a display area, a sealed area, and a peripheral area. The display medium layer is disposed in the display area of the driving substrate. The protection assembly is located on the display medium layer and includes a cover plate and a transparent conductive layer disposed on the cover plate. The sealant layer is disposed in the sealed area of the driving substrate to as least cover a periphery of the display medium layer. The driving chip is disposed in the peripheral area of the driving substrate. The conductive substance is disposed on the transparent conductive layer of the protection assembly.

Abstract: A display device includes a driving substrate, a display medium layer and a material layer. The display medium layer is disposed on the driving substrate. The material layer is disposed on a side of the display medium layer, and extends to the driving substrate. The material layer is a material layer with conductivity properties.

Abstract: An electronic paper display device includes a thin film transistor (TFT) array substrate, a light-transmitting substrate, a top electrode layer, a display medium layer, and a barrier layer. The top surface of the TFT array substrate has a bottom electrode layer. The light-transmitting substrate is located above the TFT array substrate. The top electrode layer is located on the bottom surface of the light-transmitting substrate. The display medium layer is located between the top electrode layer and the bottom electrode layer. The barrier layer is directly formed on at least one of the top surface and the bottom surface of the light-transmitting substrate. The barrier layer is in direct contact with the light-transmitting substrate, and is configured to resist moisture.

Abstract: A display device includes a driving substrate, a display medium layer, a water vapor barrier layer, a protective layer, and a glue layer. The display medium layer is disposed on the driving substrate. The water vapor barrier layer is disposed on the display medium layer and covers a periphery of the display medium layer. The protective layer is disposed on the water vapor barrier layer. The glue layer covers a periphery of the water vapor barrier layer and at least part of a periphery of the protective layer. A water vapor transmission rate of the water vapor barrier layer is less than a water vapor transmission rate of the glue layer.

Abstract: An electronic paper package structure including a substrate, an electronic ink layer, a cover plate, at least one water vapor barrier and a sealant is provided. The electronic ink layer is disposed on the substrate. The cover plate covers the electronic ink layer, wherein the electronic ink layer is located between the substrate and the cover plate, and a groove is defined by a lower surface of the cover plate, a side surface of the electronic ink layer and an upper surface of the substrate. The at least one water vapor barrier is disposed in the groove. The sealant is filled into the groove to cover the at least one water vapor barrier.

Abstract: A display device includes a driving substrate, a display medium layer, a glue layer, and a protective layer. The display medium layer is disposed on the driving substrate. The glue layer is disposed around the display medium layer. The protective layer covers the display medium layer and the glue layer, and the protective layer is bent toward the driving substrate along the glue layer.

Abstract: An electronic paper package structure, including a substrate, an electronic ink layer, a cover plate, a water vapor barrier film and an adhesive layer, is provided. The electronic ink layer is disposed on the substrate. The cover plate covers the electronic ink layer. The water vapor barrier film covers the substrate and the electronic ink layer. The adhesive layer is directly bonded between the cover plate and the water vapor barrier film to seal the substrate and the electronic ink layer. The adhesive layer is not bonded between the cover plate and the electronic ink layer.

Abstract: A display device includes a first substrate, a second substrate, a display layer, a bump, and a sealing material. The second substrate is disposed over the first substrate. The display layer is disposed between the first substrate and the second substrate, and has a boundary. The bump is connected to the first substrate or the second substrate and protrudes in a direction toward the opposite second substrate or first substrate, and is disposed around the boundary. The sealing material is filled between the bump and the display layer. The water vapor transmission rate of the bump is less than the water vapor transmission rate of the sealing material.

Abstract: An electronic paper package structure, including a substrate, an electronic ink layer, a cover plate, a water vapor barrier film and an adhesive layer, is provided. The electronic ink layer is disposed on the substrate. The cover plate covers the electronic ink layer. The water vapor barrier film covers the substrate and the electronic ink layer. The adhesive layer is directly bonded between the cover plate and the water vapor barrier film to seal the substrate and the electronic ink layer. The adhesive layer is not bonded between the cover plate and the electronic ink layer.

Abstract: An electronic paper package structure including a substrate, an electronic ink layer, a cover plate, at least one water vapor barrier and a sealant is provided. The electronic ink layer is disposed on the substrate. The cover plate covers the electronic ink layer, wherein the electronic ink layer is located between the substrate and the cover plate, and a groove is defined by a lower surface of the cover plate, a side surface of the electronic ink layer and an upper surface of the substrate. The at least one water vapor barrier is disposed in the groove. The sealant is filled into the groove to cover the at least one water vapor barrier.

Abstract: An inspection method including following steps is provided. A pixel array substrate including a plurality of pixel units is in contact with a photoelectric inspection device. A plurality of electrical signals is inputted to the pixel units of the pixel array substrate and the photoelectric inspection device. Based on an optical property of the photoelectric inspection device, the pixel units of the pixel array substrate are being examined on whether they are normal or not. Moreover, an inspection apparatus realizing the inspection method is also provided.

Abstract: A display device includes an active element array substrate, a display layer and a transparent shock absorption layer. The display layer is disposed on the active element array substrate. The transparent shock absorption layer is disposed on the display layer. The transparent shock absorption layer is formed by curing liquid adhesive material. A manufacturing method of display device is also provided.

Abstract: An electronic device includes a shell, a display module and a cushion. The shell includes a bottom plate and a top plate. The top plate defines an opening. The display module is disposed in the shell and faces the opening. The display module is spaced from the bottom plate of the shell. The cushion is disposed between the display module and the bottom plate of the shell, and brought into contact with the display module for cushioning the display module when an external force is applied to the display module.

Abstract: The invention discloses a curved display module and a display device. The curved display module includes an enclosure, at least one opening, a flexible display panel and an Optical Clear Adhesive (OCA) layer. There is a first curved surface inside the enclosure. A cavity is formed within the enclosure. The at least one opening are disposed on at least one edge of the enclosure and connected to the cavity. The flexible display panel is disposed on the first curved surface in the cavity. The OCA layer is disposed within the cavity. The OCA layer directly covers the flexible display panel.

Abstract: An inspection method including following steps is provided. A pixel array substrate including a plurality of pixel units is in contact with a photoelectric inspection device. A plurality of electrical signals is inputted to the pixel units of the pixel array substrate and the photoelectric inspection device. Based on an optical property of the photoelectric inspection device, the pixel units of the pixel array substrate are being examined on whether they are normal or not. Moreover, an inspection apparatus realizing the inspection method is also provided.

Abstract: A mobile device is disclosed. The mobile device includes a display, a touch panel, and a buffer structure. The touch panel is disposed on one side of the display. The buffer structure has a gas fluid layer and is disposed between the display and the touch panel.

Abstract: A touch panel and a method of manufacturing the same are disclosed in this invention. The touch panel is with a central induction region and a peripheral region, and at least includes an upper electrode portion having an upper substrate located in the central induction region and the peripheral region, a first signal induction layer located in the central induction region and the peripheral region, and a first circuit layer located in the peripheral region only. The first signal induction layer covers the upper substrate in the central induction region. The first circuit layer is sandwiched between the upper substrate and the first signal induction layer, and electrically connected the first signal induction layer.

Abstract: An electro-phoretic display device includes a first substrate, an active elements array, a driving circuit, a conductive flexible board, an electro-phoretic layer and a second substrate. The first substrate has a first surface defining a display area and a circuit area, and a second surface. The active elements array is disposed within the display area and the driving circuit is disposed within the circuit area and electrically connected to the active elements array. The conductive flexible board is partially disposed at the first substrate and electrically connected to the driving circuit. The electro-phoretic layer and the second substrate are sequentially disposed on the active elements array and the driving circuit. A fabricating method of electro-phoretic display device is also disclosed.