Abstract: Method and circuit for adaptive column-select line signal generation for a memory device are provided. The method comprises the following steps. A first signal is generated in response to a memory access command. A second signal is generated according to a candidate signal selected from a plurality of candidate signals including a first candidate signal and a second candidate signal, wherein after the first signal is asserted, the first candidate signal is asserted when a configurable time interval with respect to a parameter from a register set elapses and the second candidate signal is asserted when a specified time interval elapses, and the selected candidate signal is asserted before a remaining part of the candidate signals after the first signal is asserted. A column-select line signal is generated according to the first signal and the second signal.

Abstract: Method and circuit for adaptive column-select line signal generation for a memory device are provided. The method comprises the following steps. A first signal is generated in response to a memory access command. A second signal is generated according to a candidate signal selected from a plurality of candidate signals including a first candidate signal and a second candidate signal, wherein after the first signal is asserted, the first candidate signal is asserted when a configurable time interval with respect to a parameter from a register set elapses and the second candidate signal is asserted when a specified time interval elapses, and the selected candidate signal is asserted before a remaining part of the candidate signals after the first signal is asserted. A column-select line signal is generated according to the first signal and the second signal.

Abstract: A signal processing circuit includes a delay locked loop (DLL) circuit, a data output path circuit, and a first phase detector circuit. The DLL circuit is arranged to receive a memory clock signal, and generate a DLL output signal according to the memory clock signal and a DLL feedback signal. The data output path circuit is coupled to the DLL circuit, and is arranged to generate a DQS signal according to the DLL output signal. The first phase detector circuit is coupled to the data output path circuit, and is arranged to receive the memory clock signal and the DQS signal, and detect a phase difference between the memory clock signal and the DQS signal to generate a first phase detection result.

Abstract: A signal processing circuit includes a delay locked loop (DLL) circuit, a data output path circuit, and a first phase detector circuit. The DLL circuit is arranged to receive a memory clock signal, and generate a DLL output signal according to the memory clock signal and a DLL feedback signal. The data output path circuit is coupled to the DLL circuit, and is arranged to generate a DQS signal according to the DLL output signal. The first phase detector circuit is coupled to the data output path circuit, and is arranged to receive the memory clock signal and the DQS signal, and detect a phase difference between the memory clock signal and the DQS signal to generate a first phase detection result.

Abstract: A data control circuit includes a first latch circuit, a self-block circuit, a second latch circuit, a third latch circuit, a first data timing-labeled signal generating circuit, and a second data timing-labeled signal generating circuit. The first latch circuit is arranged to receive a data window signal. The self-block circuit is coupled to the first latch circuit, and is arranged to generate a protection signal. The second latch circuit is coupled to the self-block circuit, and is arranged to output a first data timing-labeled signal. The third latch circuit is coupled to the second latch circuit, and is arranged to generate a second data timing-labeled signal. The first data timing-labeled signal generating circuit is arranged to generate a third data timing-labeled signal. The second data timing-labeled signal generating circuit is arranged to generate a fourth data timing-labeled signal.

Abstract: A data first-in first-out (FIFO) circuit includes a register unit, a plurality of data multiplexers, and an output multiplexer. The register unit includes a plurality of decoders and a plurality of N registers. The decoders are used for outputting a plurality of decoded signals in response to a plurality of corresponding input control signals and at least one input enabling signal. The N registers are configured to receive input data in response to the corresponding decoded signals from the corresponding decoders. The data multiplexers each are coupled to M ones of the registers, wherein N and M are positive integers, N is equal to or greater than four, M is equal to or greater than two, and N is greater than M. The output multiplexer, coupled to the data multiplexers, is used for providing a corresponding output from the data multiplexers sequentially.

Abstract: A synchronization circuit and a cascaded synchronization circuit for converting an asynchronous signal into at least one synchronous signal are provided. The synchronization circuit includes a signal control circuit, a flip-flop circuit, a clock enable circuit and a clock control circuit. The flip-flop circuit is coupled to the signal control circuit, the clock enable circuit is coupled to the signal control circuit and the flip-flop circuit, and the clock enable circuit is coupled to the signal control circuit and the flip-flop circuit. The signal control circuit and the clock control circuit can guarantee hold time and setup time is sufficient to allow the flip-flop circuit to output the synchronous signal without glitch regardless of the asynchronous signal.

Abstract: A synchronization circuit and a cascaded synchronization circuit for converting an asynchronous signal into at least one synchronous signal are provided. The synchronization circuit includes a signal control circuit, a flip-flop circuit, a clock enable circuit and a clock control circuit. The flip-flop circuit is coupled to the signal control circuit, the clock enable circuit is coupled to the signal control circuit and the flip-flop circuit, and the clock enable circuit is coupled to the signal control circuit and the flip-flop circuit. The signal control circuit and the clock control circuit can guarantee hold time and setup time is sufficient to allow the flip-flop circuit to output the synchronous signal without glitch regardless of the asynchronous signal.

Abstract: A target row refresh method includes: providing first table having M entries each capable of storing information of target row address; providing second table having K entries respectively capable of storing information of different/identical candidate row addresses; determining whether an input address in an input address register matches address information recorded in the first table; when not match, determining whether to update information of a target row latch by using the input address in the input address register according to a sample policy so as to determine whether to compare the input address with address information recorded in the second table to determine a target row address; and performing a target row refresh operation to refresh a memory device's row(s) adjacent to a target row corresponding to the target row address.

Abstract: An aspect of the present invention is to provide a test system for detecting whether a continuity fault condition, e.g., a short or open condition, exists in the path between a tester and chips on a wafer during a wafer level burn-in testing. According to one embodiment of the present invention, the test system comprises a probe card and n chips. The probe card comprises m first signal contacts for receiving m test signals from the tester, n second signal contacts for providing n test results to the tester, and a contact array. The probe card is in contact with the chips on the wafer through a plurality of needles. In this manner, the test system can detect whether the continuity fault condition exists in the path between the tester and the chips on the wafer during the wafer level burn-in testing.

Abstract: A semiconductor memory device having a compression test mode is provided. The semiconductor memory device comprises a memory unit, i test pads, a timing circuit, a compression circuit, and a signal distribution circuit. The memory unit comprises m memory banks divided into n activating groups, wherein each bank comprises a plurality of sensing amplifiers for sensing and amplifying data in bit lines. The timing circuit sequentially generates n control signals each for activating a plurality of sensing amplifiers in one of the n activating groups. The compression circuit compresses data sensed and amplified by the plurality of sensing amplifiers in each bank in a compression test mode. The signal distribution circuit distributes signals output from the compression circuit among the i data pads in rotation. The integer n and the integer i are adjustable.

Abstract: An aspect of the present invention is to provide a test system for detecting whether a continuity fault condition, e.g., a short or open condition, exists in the path between a tester and chips on a wafer during a wafer level burn-in testing. According to one embodiment of the present invention, the test system comprises a probe card and n chips. The probe card comprises m first signal contacts for receiving m test signals from the tester, n second signal contacts for providing n test results to the tester, and a contact array. The probe card is in contact with the chips on the wafer through a plurality of needles. In this manner, the test system can detect whether the continuity fault condition exists in the path between the tester and the chips on the wafer during the wafer level burn-in testing.

Abstract: A semiconductor memory device having a compression test mode is provided. The semiconductor memory device comprises a memory unit, i test pads, a timing circuit, a compression circuit, and a signal distribution circuit. The memory unit comprises m memory banks divided into n activating groups, wherein each bank comprises a plurality of sensing amplifiers for sensing and amplifying data in bit lines. The timing circuit sequentially generates n control signals each for activating a plurality of sensing amplifiers in one of the n activating groups. The compression circuit compresses data sensed and amplified by the plurality of sensing amplifiers in each bank in a compression test mode. The signal distribution circuit distributes signals output from the compression circuit among the i data pads in rotation. The integer n and the integer i are adjustable.

Abstract: A novelty repairing method and circuit are provided by the embodiments of the present invention, wherein the input/output (IO) compression manner can be used therein to reduce the access time during the chip probing 1 (CP1) test, and each redundant column selected line (RCSL) can be divided into several partial redundant column selected lines (P-RCSLs) which are respectively responsible for repairing the defects of the corresponding regions. Based upon the repairing method, the memory circuit can reduce the number of the RCSLs. Furthermore, a variable region dividing manner is applied therein, so as to increase the probability for repairing the defect of the memory circuit.

Abstract: A phase interpolation module comprising a first, second, and third phase interpolation units is proposed. Each of the first, second, and third phase interpolation units comprises a first through third inverters, a first and second resistors, wherein the first resistor is coupled between an output end of the first inverter and an input end of the third inverter, and the second resistor is coupled between an output end of the second inverter and the input end of the third inverter. The first and second inverters of the first phase interpolation unit receive a first signal, the first and second inverters of the third phase interpolation unit receive a second signal, and the first and second inverters of the second phase interpolation unit respectively receive the first and second signals.

Abstract: A phase interpolation module comprising a first, second, and third phase interpolation units is proposed. Each of the first, second, and third phase interpolation units comprises a first through third inverters, a first and second resistors, wherein the first resistor is coupled between an output end of the first inverter and an input end of the third inverter, and the second resistor is coupled between an output end of the second inverter and the input end of the third inverter. The first and second inverters of the first phase interpolation unit receive a first signal, the first and second inverters of the third phase interpolation unit receive a second signal, and the first and second inverters of the second phase interpolation unit respectively receive the first and second signals.

Abstract: A novelty repairing method and circuit are provided by the embodiments of the present invention, wherein the input/output (IO) compression manner can be used therein to reduce the access time during the chip probing 1 (CP1) test, and each redundant column selected line (RCSL) can be divided into several partial redundant column selected lines (P-RCSLs) which are respectively responsible for repairing the defects of the corresponding regions. Based upon the repairing method, the memory circuit can reduce the number of the RCSLs. Furthermore, a variable region dividing manner is applied therein, so as to increase the probability for repairing the defect of the memory circuit.

Abstract: A semiconductor memory device and a method of testing the same are provided. In the method, the semiconductor memory device enters a test mode after receiving a mode selection signal. After the semiconductor memory device enters the test mode, a first word line is activated. Test data are then sequentially written into a plurality of memory cells coupled to the first word line. The first word line is deactivated, and data between each pair of bit lines are latched. A second word line is activated. After the second word line is activated, the data latched between each pair of bit lines are directly written into the memory cells coupled to the second word line.

Abstract: A testing system with data compressing function includes a third data end, a first encoder, and a second encoder. The testing system receives testing data and testing address for testing if any memory cell fails in a memory. The memory includes a first data end, a second end, and an address end. The first encoder encodes the testing data to the data type of the first data end according to the testing address. The second encoder encodes the testing data to the data type of the second data end according to the testing address. In this way, the corresponding memory cells of the first data and second ends store same testing data.

Abstract: A trigger circuit for triggering corresponding memory cells of a column redundant circuit includes a determining circuit for generating a determining signal according to an accessed row address, and a plurality of comparing circuits jointly electrically connected to the column redundant circuit for receiving the determining signal, each of the comparing circuits selectively generating a trigger signal to the column redundant circuit according to the determining signal and an accessed column address.