Abstract: An apparatus for removing an adhesive film on a chip that has been cut. The adhesive film is adhered to a bottom surface of the chip. The apparatus includes a sucker, a push-up needle device, and a vacuum chamber. The sucker is arranged above the chip with the adhesive film to suck the chip. The push-up needle device is arranged under the bottom surface of the chip and has a slim support surface to support the adhesive film on the bottom surface of the chip. The vacuum chamber is arranged below the bottom surface of the chip to suck the adhesive film downward and separate the adhesive film from the chip. Accordingly, it is possible to prevent the chip 38 from being broken or cracked owing to the uneven force.

Abstract: A mechanism for positioning a substrate of an image sensor. The substrate has first to fourth edges. The mechanism includes a standard unit, a link unit, and a push-up needle unit. The standard unit has adjacent first and second standard planes, both of which define a positioning region for receiving the substrate. The first and second edges contact the first and second standard planes, respectively. The link unit includes a first link and a second link pivotally mounted to the first link at a pivotal portion for positioning the third edge of the substrate. The push-up needle unit positions the fourth edge. When the link unit operates, the push-up needle unit and the pivotal portion of the link unit are moved toward the fourth edge and the third edge of the substrate, respectively, to position the substrate.