Abstract: An arrangement for use in a semiconductor component includes a semiconductor body and an edge structure. The semiconductor body having a first face, a second face, a first semiconductor zone of a first conductance type, at least one second semiconductor zone of a second conductance type, and a semiconductor junction formed therebetween running substantially parallel to the first face. The edge structure is laterally adjacent to the second semiconductor zone and includes at least a first trench. The first trench extends in a vertical direction into the semiconductor body and is filled with a dielectric material. The edge structure further includes a third semiconductor zone of the second conductance type, which, at least partially, is adjacent to a face of the at least one trench which faces away from the first face. The edge structure further includes a fourth semiconductor zone of the first conductance type, which is more heavily doped than the first semiconductor zone, and is proximate to the first face.

Abstract: A circuit arrangement configured to drive a load is disclosed herein. The circuit arrangement comprises a first and a second supply potential terminal for application of a first supply potential and a second supply potential. A load terminal is provided between the first and second supply potential for connection of the load. The circuit arrangement further comprises a first transistor component of a first conduction type. The first transistor component includes a load path and a control terminal, with the load path connected between the first supply potential terminal and the load terminal. The circuit arrangement also comprises a freewheeling element. The freewheeling element is provided as a second transistor of a second conduction type connected up as a diode. The second transistor is connected between the load terminal and the second supply potential terminal. The first transistor component and the freewheeling element are integrated in a common semiconductor body.

Abstract: The present invention relates to a metal-semiconductor contact comprising a semiconductor layer and comprising a metallization applied to the semiconductor layer, a high dopant concentration being introduced into the semiconductor layer such that a non-reactive metal-semiconductor contact is formed between the metallization and the semiconductor layer. The metallization and/or the semiconductor layer are formed in such a way that only a fraction of the introduced doping concentration is electrically active, and a semiconductor layer doped only with this fraction of the doping concentration only forms a Schottky contact when contact is made with the metallization. Furthermore, the invention relates to a semiconductor component comprising a drain zone, body zones embedded therein and source zones again embedded therein. The semiconductor component has metal-semiconductor contacts in which the contacts made contact only with the source zones but not with the body zones.

Abstract: The invention relates to a MOSFET circuit having reduced output voltage oscillations, in which a smaller CoolMOS transistor (T2) with a zener diode (Z1) connected upstream of its gate is located in parallel with a larger CoolMOS transistor (T1), so that, during a switch-off operation, after the larger transistor has been switched off, the smaller transistor (T2) carries a tail current on account of the zener voltage still present, which tail current attenuates output oscillations of the voltage.

Abstract: The invention relates to a circuit arrangement having connecting terminals (K1, K2) for application of a supply voltage (V+) and having a load transistor (M) for connecting a load (Z) to the supply voltage, said load transistor having a control terminal (G) and a first and second load terminal (D, S), the control terminal (G) of the load transistor (2) being coupled to a drive terminal (IN) for application of a drive signal (Sin). A voltage limiting circuit (10) is connected between one (D) of the load terminals and the drive terminal (G) of the transistor, a deactivation circuit (20) being provided, which is designed to deactivate the voltage limiting circuit (10) in a manner dependent on the supply voltage (V+).

Abstract: The present invention relates to a semiconductor component. The component includes a semiconductor body with a first semiconductor layer of a first conduction type and a second semiconductor layer of a second conduction type. The component includes, in the second semiconductor layer, a first terminal zone of the second conduction type, a drift zone of the second conduction type, a channel zone of the first conduction type, which is formed between the first terminal zone and the drift zone, and a second terminal zone of the second conduction type, which is arranged at a distance from the channel zone in the lateral direction of the semiconductor body. The component also includes a first drive electrode and at least one second drive electrode.

Abstract: The invention relates to a vertical field-effect transistor in source-down structure, in which the active zones (10, 7, 11) are introduced from trenches (5, 8, 9) into a semiconductor body (1), a source electrode (18) being connected via the filling (6) of a body trench (5) to a highly doped substrate (2) via a conductive connection (15).

Abstract: A semiconductor component arrangement comprises a semiconductor substrate of a first conduction type, an insulation layer arranged on the substrate, and a semiconductor layer arranged on the insulation layer. A semiconductor component is formed in said semiconductor layer. The semiconductor component includes a first semiconductor zone of a first conduction type, a second semiconductor zone of a second conduction type adjoining the first semiconductor zone, and a third semiconductor zone which is doped more heavily than the second semiconductor zone and positioned at a distance from the first semiconductor zone. The semiconductor zone further comprises a fourth semiconductor zone of the second conduction type. The fourth semiconductor zone has a first section formed in the second semiconductor zone and a second section formed in the underlying substrate.

Abstract: The invention relates to a field effect controllable semiconductor component, comprising a semiconductor body with a first terminal zone and a second terminal zone, a channel zone formed between the two terminal zones, a control electrode, and also a plurality of compensation zones. The semiconductor component furthermore has additional doping zones which are arranged in spatial proximity to the compensation zones or in a manner merged therewith. The additional doping zones are connected to the first terminal zone, if appropriate via a series diode.

Abstract: An arrangement for use in a semiconductor component includes a semiconductor body and an edge structure. The semiconductor body having a first face, a second face, a first semiconductor zone of a first conductance type, at least one second semiconductor zone of a second conductance type, and a semiconductor junction formed therebetween running substantially parallel to the first face. The edge structure is laterally adjacent to the second semiconductor zone and includes at least a first trench. The first trench extends in a vertical direction into the semiconductor body and is filled with a dielectric material. The edge structure further includes a third semiconductor zone of the second conductance type, which, at least partially, is adjacent to a face of the at least one trench which faces away from the first face. The edge structure further includes a fourth semiconductor zone of the first conductance type, which is more heavily doped than the first semiconductor zone, and is proximate to the first face.

Abstract: A semiconductor component includes a semiconductor body having a substrate of a first conduction type and a first layer of a second conduction type that is located above the substrate. A channel zone of the first conduction type is formed in the first layer. A first terminal zone of the second conduction type is configured adjacent the channel zone. A second terminal zone of the first conduction type is formed in the first layer. Compensation zones of the first conduction type are formed in the first layer.

Abstract: The invention relates to a semiconductor arrangement having a MOSFET structure and an active zener function. A n+-doped zone and a p+-doped zone are provided at the bottom of a trench for the purpose of forming zener diodes, the n+-doped zone being directly connected to the gate electrode.

Abstract: The invention relates to a method for fabricating a drift zone of a vertical semiconductor component and to a vertical semiconductor component having the following features: a semiconductor body (100) having a first side (101) and a second side (102), a drift zone (30) of a first conduction type which is arranged in the region between the first and the second sides (101, 102) and is formed for the purpose of taking up a reverse voltage, a field electrode arrangement arranged in the drift zone (30) and having at least one electrically conducted field electrode (40; 40A–40E; 90A–90J) arranged in a manner insulated from the semiconductor body (100), an electrical potential of the at least one field electrode (40; 40A–40E; 90A–90J) varying in the vertical direction of the semiconductor body (100) at least when a reverse voltage is applied.

Abstract: A circuit arrangement configured to drive a load is disclosed herein. The circuit arrangement comprises a first and a second supply potential terminal for application of a first supply potential and a second supply potential. A load terminal is provided between the first and second supply potential for connection of the load. The circuit arrangement further comprises a first transistor component of a first conduction type. The first transistor component includes a load path and a control terminal, with the load path connected between the first supply potential terminal and the load terminal. The circuit arrangement also comprises a freewheeling element. The freewheeling element is provided as a second transistor of a second conduction type connected up as a diode. The second transistor is connected between the load terminal and the second supply potential terminal. The first transistor component and the freewheeling element are integrated in a common semiconductor body.

Abstract: The power switch has a first transistor, a limiting transistor, and an auxiliary transistor. The first transistor has a load path and a control electrode. The limiting transistor, which limits a voltage drop across the load path of the first transistor, has a load path connected in series with the load path of the first transistor, and a control electrode. The auxiliary transistor has a load path connected between the control electrode of the limiting transistor and a reference node, and having a control electrode connected between the first transistor and the limiting transistor.

Abstract: The present invention relates to a metal-semiconductor contact comprising a semiconductor layer and comprising a metallization applied to the semiconductor layer, a high dopant concentration being introduced into the semiconductor layer such that a non-reactive metal-semiconductor contact is formed between the metallization and the semiconductor layer. The metallization and/or the semiconductor layer are formed in such a way that only a fraction of the introduced doping concentration is electrically active, and a semiconductor layer doped only with this fraction of the doping concentration only forms a Schottky contact when contact is made with the metallization. Furthermore, the invention relates to a semiconductor component comprising a drain zone, body zones embedded therein and source zones again embedded therein. The semiconductor component has metal-semiconductor contacts in which the contacts made contact only with the source zones but not with the body zones.

Abstract: The power transistor has a trench cell in a semiconductor body. A lower edge of the gate electrode has a profile which is not horizontal, i.e., not planar with respect to the field electrode.

Abstract: The invention relates to a semiconductor component, in which regions of the conduction type opposite to the conduction type of the drift zone are incorporated in the drift zone and also in the region of the active zones.

Abstract: The present invention relates to a metal-semiconductor contact comprising a semiconductor layer and comprising a metallization applied to the semiconductor layer, a high dopant concentration being introduced into the semiconductor layer such that a non-reactive metal-semiconductor contact is formed between the metallization and the semiconductor layer. The metallization and/or the semiconductor layer are formed in such a way that only a fraction of the introduced doping concentration is electrically active, and a semiconductor layer doped only with this fraction of the doping concentration only forms a Schottky contact when contact is made with the metallization. Furthermore, the invention relates to a semiconductor component comprising a drain zone, body zones embedded therein and source zones again embedded therein. The semiconductor component has metal-semiconductor contacts in which the contacts made contact only with the source zones but not with the body zones.

Abstract: The system has at least two electronic units between which signals are transferred from a first electronic unit and a second electronic unit. The first electronic unit has a signal source. The second electronic unit has a signal sink. A signal to be transferred is converted into a line-independent electromagnetic wave with a transmitting unit and transmitted to a receiving unit. The line-independent electromagnetic wave is received with the receiving unit and converted into a reception signal.