Patents by Inventor Jen-Too Hsieh

Jen-Too Hsieh has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 8188035
    Abstract: This invention relates to a method of using nano carbon to refine collagen into nanoparticulate collagen. As nano carbon particle are mixed into collagen, the pored structure of the nano carbon absorb and adhere to the collagen outer cell membrane and subsequently tears the collagen apart into nanoparticulates via ultrasound vibration, Thus it creates an advanced nanoparticulate collagen small enough to be practically and efficiently absorbed by the skin when applied directly.
    Type: Grant
    Filed: May 4, 2009
    Date of Patent: May 29, 2012
    Inventor: Jen-Too Hsieh
  • Publication number: 20100280226
    Abstract: This invention relates to a method of using nano carbon to refine collagen into nanoparticulate collagen. As nano carbon particle are mixed into collagen, the pored structure of the nano carbon absorb and adhere to the collagen outer cell membrane and subsequently tears the collagen apart into nanoparticulates via ultrasound vibration, Thus it creates an advanced nanoparticulate collagen small enough to be practically and efficiently absorbed by the skin when applied directly.
    Type: Application
    Filed: May 4, 2009
    Publication date: November 4, 2010
    Inventor: Jen-Too Hsieh
  • Publication number: 20080047695
    Abstract: The invention relates to an improved cooling structure for electronics and machines, which produce heat during working and have been provided with cooling fins or grid. A nanocarbon layer is covered on IC boards, CPUs, and the cooling fins or grids, that facilitates the cooling effect obviously because of increased surface area. Hence, the working electronics and machines can be cooled more conveniently and effectively and input energy will be also saved.
    Type: Application
    Filed: August 14, 2007
    Publication date: February 28, 2008
    Inventor: Jen-Too Hsieh