Patents by Inventor Jen Tseng

Jen Tseng has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Method for fabricating chip package structure
    Publication number: 20070228541
    Abstract: A method for fabricating a chip package structure is disclosed. One or plural patterned plates are used to fabricate the inner circuits and the outer circuits, and some fabricating steps can be proceeded repeatedly to form a stack structure, and after a protective layer is formed, the carrier is removed. Using the plate as a mask to fabricate the circuits can enhance the yield and simplify the fabricating processes of the package. Further, the removed carrier can be recycled to reduce the production cost.
    Type: Application
    Filed: May 29, 2007
    Publication date: October 4, 2007
    Inventors: Chi Lin, Bo Sun, Hung Wang, Jen Tseng