Patents by Inventor Jen-Yang Chaung

Jen-Yang Chaung has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Semiconductor Integrated Circuit Fabrication With Pattern-Reversing Process
    Publication number: 20150332922
    Abstract: A method of fabricating a semiconductor integrated circuit (IC) is disclosed. An inverse mask is provided. A sacrificial layer is deposited over a substrate. A patterned photoresist layer is formed over the sacrificial layer using the inverse mask. The sacrificial layer is then etched through the patterned photoresist layer to form a patterned sacrificial layer. A hard mask layer is deposited over the patterned sacrificial layer. The patterned sacrificial layer is then removed to form a second pattern on the hard mask layer.
    Type: Application
    Filed: May 16, 2014
    Publication date: November 19, 2015
    Applicant: Taiwan Semiconductor Manufacturing Company, Ltd.
    Inventors: Ming-Chin Chien, Jui-Ching Wu, Shu-Hao Chang, Shang-Chieh Chien, Jen-Yang Chaung, Kuo-Chang Kau, Jeng-Horng Chen