Abstract: A fabrication method of a pixel structure includes the following steps. A first metal layer is patterned to form a source electrode and a drain electrode. A semiconductor material layer is patterned to form a channel layer and a pixel pattern. A first insulation layer is formed to cover the channel layer, the source electrode, the drain electrode and the pixel pattern. A gate electrode is formed on the first insulation layer located above the channel layer. A second insulation layer is formed to cover the gate electrode and the first insulation layer. A pixel opening is formed in the first insulation layer and the second insulation layer to expose a partial region of the pixel pattern. The partial region of the pixel pattern exposed by the pixel opening is modified so as to form a pixel electrode electrically connected to the drain electrode.

Abstract: A fabrication method of a pixel structure includes the following steps. A first metal layer is patterned to form a source electrode and a drain electrode. A semiconductor material layer is patterned to form a channel layer and a pixel pattern. A first insulation layer is formed to cover the channel layer, the source electrode, the drain electrode and the pixel pattern. A gate electrode is formed on the first insulation layer located above the channel layer. A second insulation layer is formed to cover the gate electrode and the first insulation layer. A pixel opening is formed in the first insulation layer and the second insulation layer to expose a partial region of the pixel pattern. The partial region of the pixel pattern exposed by the pixel opening is modified so as to form a pixel electrode electrically connected to the drain electrode.

Abstract: A fabrication method of a pixel structure includes the following steps. A first metal layer is patterned to form a source electrode and a drain electrode. A semiconductor material layer is patterned to form a channel layer and a pixel pattern. A first insulation layer is formed to cover the channel layer, the source electrode, the drain electrode and the pixel pattern. A gate electrode is formed on the first insulation layer located above the channel layer. A second insulation layer is formed to cover the gate electrode and the first insulation layer. A pixel opening is formed in the first insulation layer and the second insulation layer to expose a partial region of the pixel pattern. The partial region of the pixel pattern exposed by the pixel opening is modified so as to form a pixel electrode electrically connected to the drain electrode.

Abstract: A fabrication method of a pixel structure includes the following steps. A first metal layer is patterned to form a source electrode and a drain electrode. A semiconductor material layer is patterned to form a channel layer and a pixel pattern. A first insulation layer is formed to cover the channel layer, the source electrode, the drain electrode and the pixel pattern. A gate electrode is formed on the first insulation layer located above the channel layer. A second insulation layer is formed to cover the gate electrode and the first insulation layer. A pixel opening is formed in the first insulation layer and the second insulation layer to expose a partial region of the pixel pattern. The partial region of the pixel pattern exposed by the pixel opening is modified so as to form a pixel electrode electrically connected to the drain electrode.

Abstract: A pixel structure of an organic electroluminescence apparatus includes at least an active device connected to a scan line and a data line, a first electrode, a dielectric material layer, a first isolating layer, a second isolating layer, an organic light-emitting material layer and a second electrode. The dielectric material layer is disposed on the first electrode and has a first opening to expose the first electrode. The first isolating layer disposed on the dielectric material layer includes an oxide semiconductor material and has a second opening to expose the first electrode. The second isolating layer is disposed on the first isolating layer and has a third opening to expose the first electrode in the first opening and the first isolating layer in a sidewall of the second opening. The organic light-emitting material layer is in the third opening. The second electrode is on the organic light-emitting layer.

Abstract: A touch control pen for a portable electronic device includes a resilient positioning sleeve sleeved sealingly on an elongate main body and disposed adjacent to a head end of the main body. When the touch control pen is inserted into a slot defined by a looped surrounding wall of a housing of the portable electronic device, the positioning sleeve contacts watertightly an inner annular surface of the looped surrounding wall of the housing.

Abstract: A handheld electronic device includes a casing, a camera unit, and a sealing unit. The casing confines an accommodating space, and is formed with a recess that is defined by a recess-defining wall. The recess-defining wall is formed with a hole that is in spatial communication with the recess and the accommodating space. The camera unit includes a camera housing and an electrical wire. The camera housing is disposed in the recess, and has a first end portion that is received rotatably in the hole in the recess-defining wall. The electrical wire has a first end portion that extends into the camera housing, and a second end portion that extends into the accommodating space. The sealing unit is disposed between and is in airtight contact with the recess-defining wall and the camera housing.

Abstract: A card-securing device has a plate body for securing a card to a printed circuit board. The plate body includes a main plate, and a pair of side-securing plates and an end-securing plate which extend transversely from the main plate. Each of the side-securing plates and the end-securing plate has a base portion connected to the main plate, a neck portion extending and reduced in length from the corresponding base portion, and a tab portion bent and extending from the corresponding neck portion through the printed circuit board to anchor on a bottom surface of the printed circuit board.