Abstract: An EMI shield apparatus includes an EMI shield (10) and a heat sink (20). The EMI shield comprises a pair of first sidewalls (14), a pair of second sidewalls (16), and an interconnecting top wall (12). The top wall and the first and second sidewalls cooperatively surround a receiving space (18). An electronic component (64) is received in the receiving space to be shielded. The heat sink is mounted between the top wall and the electronic component. A pair of receiving grooves (22) is defined in opposite sides of the heat sink. At least one projection (142) is stamped into an inner face of each of the first sidewalls, the projections received in the corresponding receiving groove. The EMI shield apparatus can not only protect the electronic component from EMI, but also can effectively dissipate heat generated by the electronic component.