Abstract: A stacked integrated circuit (IC) device and a method are disclosed. The stacked IC device includes a first semiconductor element. The first substrate includes a dielectric block in the first substrate; and a plurality of first conductive features formed in first inter-metal dielectric layers over the first substrate. The stacked IC device also includes a second semiconductor element bonded on the first semiconductor element. The second semiconductor element includes a second substrate and a plurality of second conductive features formed in second inter-metal dielectric layers over the second substrate. The stacked IC device also includes a conductive deep-interconnection-plug coupled between the first conductive features and the second conductive features. The conductive deep-interconnection-plug is isolated by dielectric block, the first inter-metal-dielectric layers and the second inter-metal-dielectric layers.

Abstract: A diffusion plate is used in a concentrator for solar light. By the diffusion plate, solar beams is evenly distributed on a solar cell. As a result, the whole solar cell can evenly receives the solar beams for energy transformation.

Abstract: A electrical flame-off (EFO) wand 200 for emitting an electrical discharge to form a length of bonding wire into a ball comprising a stainless steel tube mounting section 305 for mounting, a platinum rod electrode 315 inserted partially into the tube 305 and secured with electrically conductive epoxy 310. The dimensions of EFO wand 200 allows the capillary 110 to be positioned close to the die-lead frame assembly, improving the productivity of the bonding process and providing economical, good quality and more reliable wire bonding.