Patents by Inventor Jeng-Hua Lin

Jeng-Hua Lin has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Publication number: 20240087986
    Abstract: A semiconductor device including a substrate, a semiconductor package, a thermal conductive bonding layer, and a lid is provided. The semiconductor package is disposed on the substrate. The thermal conductive bonding layer is disposed on the semiconductor package. The lid is attached to the thermal conductive bonding layer and covers the semiconductor package to prevent coolant from contacting the semiconductor package.
    Type: Application
    Filed: November 15, 2023
    Publication date: March 14, 2024
    Applicant: Taiwan Semiconductor Manufacturing Company, Ltd.
    Inventors: Chen-Hua Yu, Chun-Hui Yu, Jeng-Nan Hung, Kuo-Chung Yee, Po-Fan Lin
  • Publication number: 20240079392
    Abstract: A semiconductor structure includes a first tier, a redistribution circuit structure, and a second tier. The first tier includes at least one first die. The redistribution circuit structure is disposed on the first tier and electrically coupled to the at least one first die, where the redistribution circuit structure has a multi-layer structure and includes a vertical connection structure continuously extending from a first side of the redistribution circuit structure to a second side of the redistribution circuit structure, and the first side is opposite to the second side along a stacking direction of the first tier and the redistribution circuit structure. The second tier includes a plurality of second dies, and is disposed on and electrically coupled to the redistribution circuit structure.
    Type: Application
    Filed: January 10, 2023
    Publication date: March 7, 2024
    Applicant: Taiwan Semiconductor Manufacturing Company, Ltd.
    Inventors: Chuei-Tang WANG, Tso-Jung Chang, Jeng-Shien Hsieh, Shih-Ping Lin, Chih-Peng Lin, Chieh-Yen Chen, Chen-Hua Yu
  • Publication number: 20120014022
    Abstract: An electrical circuit to minimize the damage to internal electronics in the event of a lightning strike or power surge that may flow into the unit through the home run cable used to supply power to device loads, for example load cells and weigh terminals. The circuitry can not only protect, but it can also detect and distinguish from several overvoltage and undervoltage conditions that can occur.
    Type: Application
    Filed: July 13, 2010
    Publication date: January 19, 2012
    Applicant: METTLER-TOLEDO, INC.
    Inventors: Jeng-Hua Lin, Russell Vires, Cyrill Bucher
  • Publication number: 20080247107
    Abstract: A weighing apparatus having a circuit for monitoring, detecting and recovering from an overcurrent condition is described. The circuit may include a switch, current sensor, latch circuitry and microprocessor. The microprocessor may allow the circuit to recover from the overcurrent condition.
    Type: Application
    Filed: April 5, 2007
    Publication date: October 9, 2008
    Applicant: Mettler-Toledo, Inc.
    Inventors: Jeng-Hua Lin, Art Towslee, Russell Vires
  • Patent number: 5490036
    Abstract: A keyboard structure is recessed within an open-topped base housing portion of a compact portable computer such as a notebook or laptop computer. Front comer portions of the keyboard structure are secured to the base housing in a manner permitting the keyboard structure to be pivoted relative to the base housing between a storage/transport orientation in which the top side of the keyboard structure is generally parallel to the bottom side of the base housing, a tilted use orientation in which the top side of the keyboard structure slopes forwardly and downwardly toward the user and an access position which allows easy access to the interior portion of the computer for making modifications to a mother board that has been positioned in the upper interior portion of the base housing. A resilient latch assembly has cooperable detent structures that are disposed on the keyboard structure and the base housing.
    Type: Grant
    Filed: January 18, 1994
    Date of Patent: February 6, 1996
    Assignee: Dell USA, L.P.
    Inventors: Jeng-Hua Lin, John P. Busch, James W. Huffman