Abstract: A hot swap fan includes a fan and a puller structure. The puller structure covers a side surface of the fan. The puller structure includes a base, a holder, and a fixing structure. A first end of the base is pivoted to the fan. The holder and the fixing structure are on a second end of the base.

Abstract: A heat dissipation device and fan module. The fan module is fixed to a fan tray, which has a track with a first engaging portion. A securing member is disposed on a shield, comprising a second engaging portion. The second engaging portion enters the first engaging portion, fixing the fan module to the fan tray. An actuator connects the securing member and the shield. When external force deforms the actuator, the securing member deforms therewith, withdrawing the second engaging portion from the first engaging portion.

Abstract: A method to pattern films into dimensions smaller than the printed pixel mask size. A printed mask is deposited on a thin film on a substrate. The second mask layer is selectively deposited onto the film, but not to the printed mask. A third mask is then printed onto the substrate to pattern a portion of the second mask. Certain solvents are then used to remove the printed mask but not the mask layer on the thin film. The mask layer is then used to form a pattern on the thin film in combination with etching. The features formed in the thin film are smaller than the smallest dimension of the printed mask. The coated mask layer can be a self-assembled mono-layer or other material that selectively binds to the thin film.

Abstract: In one aspect, an electromechanical switching device is illustrated. The electromechanical switching device includes a relay with at least one first conductive portion, at least one second conductive portion, and at least one actuation component that moves the at least one first conductive portion and the at least one second conductive portion into and out of conductive contact. The at least one first conductive portion includes a conductive stationary end coupled to a substrate and a conductive free-floating end. The at least one actuation component includes an actuation stationary end coupled to the substrate and an actuation free-floating end. The actuation free floating end, when the at least one actuation component is not energized, curls, which curls the conductive free floating end into or out of conductive contact with the at least one second conductive portion.

Abstract: Various traveling wave grid configurations are disclosed. The grids and systems are well suited for transporting, separating, and classifying small particles dispersed in liquid or gaseous media. Also disclosed are various separation strategies and purification cells utilizing such traveling wave arrays and strategies.

Abstract: Xerographic micro-assembler systems and methods are disclosed. The systems and methods involve manipulating charge-encoded micro-objects. The charge encoding identifies each micro-object and specifies its orientation for sorting. The micro-objects are sorted in a sorting unit so that they have defined positions and orientations. The sorting unit has the capability of electrostatically and magnetically manipulating the micro-objects based on their select charge encoding. The sorted micro-objects are provided to an image transfer unit. The image transfer unit is adapted to receive the sorted micro-objects, maintain them in their sorted order and orientation, and deliver them to a substrate. Maintaining the sorted order as the micro-objects are delivered to the substrate may be accomplished through the use of an electrostatic image, as is done in xerography.

Abstract: A hot swap fan includes a fan and a puller structure. The puller structure covers a side surface of the fan. The puller structure includes a base, a holder, and a fixing structure. A first end of the base is pivoted to the fan. The holder and the fixing structure are on a second end of the base.

Abstract: An out-of-plane micro-structure which can be used for on-chip integration of high-Q inductors and transformers places the magnetic field direction parallel to the substrate plane without requiring high aspect ratio processing. The photolithographically patterned coil structure includes an elastic member having an intrinsic stress profile. The intrinsic stress profile biases a free portion away from the substrate forming a loop winding. An anchor portion remains fixed to the substrate. The free portion end becomes a second anchor portion which may be connected to the substrate via soldering or plating. A series of individual coil structures can be joined via their anchor portions to form inductors and transformers.

Abstract: An improved transistor array for a display or sensor device is described. The display or sensor device includes a plurality of pixels. Each pixel includes a width and a length. Each pixel is addressed by a transistor. The transistor addressing each pixel has a channel with a channel width. Each channel width is greater than the width or length of the pixel being addressed. By fabricating transistors with extremely long channel widths, lower mobility semiconductor materials can easily be used to fabricate the display device.

Abstract: A heat dissipation device and fan module. The fan module is fixed to a fan tray, which has a track with a first engaging portion. A securing member is disposed on a shield, comprising a second engaging portion. The second engaging portion enters the first engaging portion, fixing the fan module to the fan tray. An actuator connects the securing member and the shield. When external force deforms the actuator, the securing member deforms therewith, withdrawing the second engaging portion from the first engaging portion.

Abstract: An improved transistor array for a display or sensor device is described. The display or sensor device includes a plurality of pixels. Each pixel includes a width and a length. Each pixel is addressed by a transistor. The transistor addressing each pixel has a channel with a channel width. Each channel width is greater than the width or length of the pixel being addressed. By fabricating transistors with extremely long channel widths, lower mobility semiconductor materials can easily be used to fabricate the display device.

Abstract: Various traveling wave grids and related systems are disclosed that are particularly beneficial for the separation, transport, and focusing of biomolecules or other charged species. An implementation of a vertically integrated traveling wave module is described which allows for scalability to arbitrary gel dimensions through tiling. In addition, several unique traveling wave algorithms are also described which when used in conjunction with the traveling wave grids, impart selective motion to biomolecules or other charged species.

Abstract: An improved fuel cell is described. The invention addresses the problem of mechanical failure in thin electrolytes. One embodiment varies the thickness of the electrolyte and positions at least either the anode or cathode in the recessed region to provide a short travel distance for ions traveling from the anode to the cathode or from the cathode to the anode. A second embodiment uses a uniquely shaped manifold cover to allow close positioning of the anode to the cathode. Using the described structures results in a substantial improvement in fuel cell reliability and performance.

Abstract: Spring structures are subjected to pre-release and post-release annealing to tune their tip height to match a specified target. Post-release annealing increases tip height, and pre-release annealing decreases tip height. The amount of tuning is related to the annealing temperature and/or time. Annealing schedules are determined for a pre-fabricated cache of unreleased spring structures such that finished spring structures having a variety of target heights can be economically produced by releasing/annealing the cache according to associated annealing schedules. Selective annealing is performed using lasers and heat absorbing/reflecting materials. Localized annealing is used to generate various spring structure shapes. Both stress-engineered and strain-engineered spring structures are tuned by annealing.