Abstract: A water-cooled server and an electronic device are provided. The water-cooled server comprises a cooling main tubing, wherein the cooling main tubing guides cooling water; a drainage branch tubing operatively coupled to cooling main tubing; a piston having a first end disposed in the drainage branch tubing and a second end disposed in the cooling main tubing, wherein the first end drives the second end to a first position under pressure of the cooling water to prevent the second end from plugging the cooling main tubing; and an elastic member operatively coupled to the piston, wherein the elastic member drives the second end of the piston to move to a second position to plug the cooling main tubing. An elastic force applied to the piston by the elastic member is smaller than maximum pressure applied to the piston by the cooling water.

Abstract: A water-cooled server and an electronic device are provided. The water-cooled server comprises a cooling main tubing, wherein the cooling main tubing guides cooling water; a drainage branch tubing operatively coupled to cooling main tubing; a piston having a first end disposed in the drainage branch tubing and a second end disposed in the cooling main tubing, wherein the first end drives the second end to a first position under pressure of the cooling water to prevent the second end from plugging the cooling main tubing; and an elastic member operatively coupled to the piston, wherein the elastic member drives the second end of the piston to move to a second position to plug the cooling main tubing. An elastic force applied to the piston by the elastic member is smaller than maximum pressure applied to the piston by the cooling water.

Abstract: A cooling system includes a first heat exchanging component configured to connect to a heat source and obtain heat of the heat source by heat transfer, to dissipate heat of the heat source; and a first pipe configured to connect to the first heat exchanging component and a second heat exchanging component and form a loop between the first and second heat exchanging components, and to transfer the heat obtained by the first heat exchanging component to the second heat exchanging component via the loop. A first position relationship is provided between the first heat exchanging component and the second heat exchanging component, to allow a cooling liquid in the first pipe to automatically flow into the second heat exchanging component after the cooling liquid exchanges heat with the first heat exchanging component, to transfer the heat generated by the heat source to the second heat exchanging component.

Abstract: One embodiment provides rotating shaft, including: a spindle comprising an internal first channel; a wheel casing operatively coupled to the spindle, wherein the wheel casing comprises an internal second channel; and a bearing housing the spindle, comprising a third channel located between the bearing and the spindle; wherein the first channel, the second channel, and the third channel are located to form an enclosed annular channel configured to hold a substance. Other aspects are described and claimed.

Abstract: One embodiment provides rotating shaft, including: a spindle comprising an internal first channel; a wheel casing operatively coupled to the spindle, wherein the wheel casing comprises an internal second channel; and a bearing housing the spindle, comprising a third channel located between the bearing and the spindle; wherein the first channel, the second channel, and the third channel are located to form an enclosed annular channel configured to hold a substance. Other aspects are described and claimed.

Abstract: An electronic device with component detaching function includes a casing, a cover and an electronic component. An opening is formed on the casing. The cover is adapted to shelter the opening. The cover is movably disposed on the casing close to the opening, and can move relative to the casing to be switched between a first position and a second portion. The cover includes a first connecting portion. The electronic component including a second connecting portion is detachably disposed on the opening. The second connecting portion is detachably assembled with the first connecting portion. When the electronic component is separated from the casing, the electronic component utilizes an assembly of the first connecting portion and the second connecting portion to slide the cover relative to the casing, and the cover moves from the first position to the second portion.

Abstract: The present invention discloses a protective cover mechanism for protecting a socket of an electronic device. The protective cover mechanism includes a base and a fluid restrictor. The base is disposed on the socket for covering the socket. The fluid restrictor is installed on the base and is for blocking airflow on a side of the socket, so as to guide the airflow to a neighboring electronic component.

Abstract: An electronic device with component detaching function includes a casing, a cover and an electronic component. An opening is formed on the casing. The cover is adapted to shelter the opening. The cover is movably disposed on the casing close to the opening, and can move relative to the casing to be switched between a first position and a second portion. The cover includes a first connecting portion. The electronic component including a second connecting portion is detachably disposed on the opening. The second connecting portion is detachably assembled with the first connecting portion. When the electronic component is separated from the casing, the electronic component utilizes an assembly of the first connecting portion and the second connecting portion to slide the cover relative to the casing, and the cover moves from the first position to the second portion.

Abstract: A heat dissipating assembly which releases heat produced by an electronic device comprising a heat dissipating device and a plurality of elastic fastening members. The heat dissipating assembly includes a base plate having a plurality of engaging holes formed thereon. Each elastic fastening member includes a connecting member and a spring. The connecting member has a head portion and a bolt body that extends therefrom. The bolt body has an outer thread formed on the surface thereof and is being insertable into the respective engaging hole. The spring includes a winding portion woundable around the outer periphery of the bolt body, a clutching portion outwardly extended and downwardly bent from the bottom end of the winding portion to the base surface of the base plate, and a fastening segment extending from the clutching portion back under the winding portion. The instant disclosure further provides an elastic fastening member.

Abstract: The present invention discloses a protective cover mechanism for protecting a socket of an electronic device. The protective cover mechanism includes a base and a fluid restrictor. The base is disposed on the socket for covering the socket. The fluid restrictor is installed on the base and is for blocking airflow on a side of the socket, so as to guide the airflow to a neighboring electronic component.

Abstract: A heat dissipating assembly which releases heat produced by an electronic device comprising a heat dissipating device and a plurality of elastic fastening members. The heat dissipating assembly includes a base plate having a plurality of engaging holes formed thereon. Each elastic fastening member includes a connecting member and a spring. The connecting member has a head portion and a bolt body that extends therefrom. The bolt body has an outer thread formed on the surface thereof and is being insertable into the respective engaging hole. The spring includes a winding portion woundable around the outer periphery of the bolt body, a clutching portion outwardly extended and downwardly bent from the bottom end of the winding portion to the base surface of the base plate, and a fastening segment extending from the clutching portion back under the winding portion. The instant disclosure further provides an elastic fastening member.

Abstract: By using a base in cooperation with a moving board, a first flowing area formed by a plurality of openings on the base may be partially blocked by the moving board moving relative to the base, thereby forming a second flowing area that provides different flow resistances. The flow resistance of an adjustable flow resistance device can be adjusted easily and dynamically, without replacing to another device. The flow resistance of the device may also be adjusted to various predefined default settings precisely and speedily by further applying a positioning mechanism that utilizes various predefined positioning holes or a rotary element.

Abstract: By using a base in cooperation with a moving board, a first flowing area formed by a plurality of openings on the base may be partially blocked by the moving board moving relative to the base, thereby forming a second flowing area that provides different flow resistances. The flow resistance of an adjustable flow resistance device can be adjusted easily and dynamically, without replacing to another device. The flow resistance of the device may also be adjusted to various predefined default settings precisely and speedily by further applying a positioning mechanism that utilizes various predefined positioning holes or a rotary element.

Abstract: A heat dissipating device includes a supporting component installed on a circuit board. A plurality of openings is formed on the supporting component. The heat dissipating device further includes a plurality of heat dissipating components disposed on a side of the supporting component and installed inside the plurality of openings respectively for dissipating heat generated by a plurality of heat sources disposed on the other side of the supporting component. The heat dissipating device further includes a plurality of elastic components for pressing the plurality of heat dissipating components so that the plurality of heat dissipating components contacts the plurality of heat sources closely.

Abstract: A heat dissipating mechanism includes a housing. A hollow space is formed inside the housing. The heat dissipating mechanism further includes an airflow guiding structure installed inside the hollow space for separating the hollow space into a first channel and a second channel. An inlet and an outlet are formed on the airflow guiding structure. Airflow enters the first channel via the inlet and jets out of the outlet for mixing with thermal current generated by a heat source in the second channel.