Abstract: Laser processing equipment includes a base, a platform, a first image capturing device, a main control device, a second image capturing device and a laser module. The platform, the first and second image capturing device and the laser module are arranged on the top surface of the base and are electrically connected with the main control device. The first image capturing device shoots a workpiece and generates a first image. The main control device searches a target area in the workpiece based on the first image, and the target area includes specific features. The second image capturing device shoots the target area and generates a second image. The main control device performs a feature identification step for specific features based on the first or second image and controls the laser module to process the workpiece based on the result of identification. The invention also provides a laser processing method.

Abstract: An oscillator frequency modulation method includes: providing a piezoelectric material having a surface and an interior; and performing a pattern process on the piezoelectric material by a laser. A patterned processing zone is formed on the surface and/or in the interior of the piezoelectric material. The pattern process may be a material removal and/or a material modification. Therefore, without changing the appearance of the piezoelectric material, the pattern process on the piezoelectric material through the laser can accurately adjust the frequency of the oscillator and block unnecessary mode at the same time. An oscillator piezoelectric structure with frequency modulation is also provided.

Abstract: The present invention relates to a hybrid material processing method includes steps of: emitting a laser beam toward an intended-to-be-modified area intended on a workpiece by a laser to perform a property modification for the intended-to-be-modified area; applying an optical image positioning assisted equipment to perform a precise positioning for a modified area or a positioning marker on the workpiece, so as to align a machine tool to the modified area; and driving the machine tool to perform a processing for the modified area.

Abstract: A method for slicing an ingot column is provided, including the following steps: immersing the column into a solution; rotating the column; focusing the rotating column with a focusing device; and using a laser device to cut the rotating column into sliced wafers. The slicing equipment of the present invention has a simple structure, easy operation, small kerf of the column, and fast slicing speed.

Abstract: A measuring device includes a furnace, a draining vessel, a loader and a computing system for physical properties. The draining vessel with molten metal fluid is in the furnace. The loader accumulates the molten metal fluid from the draining vessel. The computing system includes a recording unit, transform unit, computing unit and processor. The recording unit records the vessel information. By the assumed physical parameters and the vessel information, the transform unit transforms a weight of the molten metal fluid in the loader into a first length criterion, and the computing unit simulates the flowing of the molten metal fluid to have a second length criterion. The processor minimizes the difference of the first and the second length criterion by changing the assumed physical parameters. The physical properties of the molten metal fluid are determined when the difference is minimized.

Abstract: A measuring device includes a furnace, a draining vessel, a loader and a computing system for physical properties. The draining vessel with molten metal fluid is in the furnace. The loader accumulates the molten metal fluid from the draining vessel. The computing system includes a recording unit, transform unit, computing unit and processor. The recording unit records the vessel information. By the assumed physical parameters and the vessel information, the transform unit transforms a weight of the molten metal fluid in the loader into a first length criterion, and the computing unit simulates the flowing of the molten metal fluid to have a second length criterion. The processor minimizes the difference of the first and the second length criterion by changing the assumed physical parameters. The physical properties of the molten metal fluid are determined when the difference is minimized.

Abstract: A roller microcontact printing device and a printing method of the device are revealed. The roller microcontact printing device includes a transfer module with a transfer roller and a supply module. The supply module provides an isolating solution and a thin film material to the transfer module to form an isolation layer and a thin film layer in turn on the surface of the transfer roller. Then the thin film is transferred to a substrate by the transfer roller. The microcontact print device and method are used in a roll-to-roll printing process. Thus the production efficiency of the thin film layer on the substrate is improved and the cost is reduced.

Abstract: A thickness adjustment device for thin-film coating is revealed. The thickness adjustment device for thin-film coating includes a coating device, a support set, and a thickness adjustment unit. The coating device consists of a work piece conveyor that delivers a work piece, and a material supply unit that carries a coating material onto a surface of the work piece to form a film. The support set is connected to the coating device while the thickness adjustment unit is inserted through and mounted on the support set. The thickness adjustment unit includes a scrape part disposed correspondingly to the work piece and used for applying coating material to form the film. The thickness of the film is adjusted according to a controlling force or torque of the thickness adjustment unit that presses downward. Thus the film is coated on the work piece evenly and the film coating quality is increased.

Abstract: A thickness adjustment device for thin-film coating is revealed. The thickness adjustment device for thin-film coating includes a coating device, a support set, and a thickness adjustment unit. The coating device consists of a work piece conveyor that delivers a work piece, and a material supply unit that carries a coating material onto a surface of the work piece to form a film. The support set is connected to the coating device while the thickness adjustment unit is inserted through and mounted on the support set. The thickness adjustment unit includes a scrape part disposed correspondingly to the work piece and used for applying coating material to form the film. The thickness of the film is adjusted according to a controlling force or torque of the thickness adjustment unit that presses downward. Thus the film is coated on the work piece evenly and the film coating quality is increased.

Abstract: A roller microcontact printing device and a printing method of the device are revealed. The roller microcontact printing device includes a transfer module with a transfer roller and a supply module. The supply module provides an isolating solution and a thin film material to the transfer module to form an isolation layer and a thin film layer in turn on the surface of the transfer roller. Then the thin film is transferred to a substrate by the transfer roller. The microcontact print device and method are used in a roll-to-roll printing process. Thus the production efficiency of the thin film layer on the substrate is improved and the cost is reduced.

Abstract: An organic field effect transistor (OFET) having a block copolymer (BCP) layer is provided. The OFET includes a gate, an optional dielectric layer, a BCP layer, an organic semiconductor layer, a drain, and a source. The BCP layer is formed between the dielectric layer and the organic semiconductor layer when the dielectric layer exists. Otherwise, the BCP layer is formed between the gate and the organic semiconductor layer when the dielectric layer does not exist. When being positioned between the gate and the organic semiconductor layer without the dielectric layer, the BCP layer also functions as a dielectric layer. Inclusion of the BCP layer enhances the electrical properties, such as the charge carrier mobility, of the OFET.

Abstract: This invention discloses a fabrication method of organic thin-film transistors (OTFTs) using the micro-contact printing. The OTFT can be of the bottom-gate or top-gate configuration. The micro-contact printing operation of this fabrication method does not require clean-room environment and high processing temperature, and does not have the problem of 2D shrinkage of the printed patterns either. Furthermore, the pre-wetting technique employed in the micro-contact printing results in improved fidelity in the pattern transfer and solves the problems of pairing and cross-talking between neighboring patterns.

Abstract: The present invention discloses a method of fabricating organic light emitting diode array, which adopts a directional spin coating technology to grow different organic light-emitting materials on the same plane so as to control the color of the emitted light and accomplish monochrome or full color organic light emitting diodes.

Abstract: A method of fabricating carbon nanotube (CNT) pattern includes the following steps. First, one surface of a first transparent substrate is denoted as the first surface. A CNT thin film layer is coated on the first surface by a thin film deposition method. Then, a second substrate is disposed opposite to the first surface coated with a CNT thin film layer. By adopting a laser transfer method, a laser source irradiates on the CNT thin film layer coated on the fist surface, such that the CNT on the irradiated area explodes to depart from the first surface due to the high temperature resulted from the energy imparted by the laser light, so as to form a CNT pattern on the opposite second substrate.

Abstract: The disclosed is a physisorption-based microcontact printing process capable of controlling film thickness, primarily for creating patterns of thin film of organic molecules in micron and submicron scales, comprising an inking phase, a printing phase, and a demolding phase. The inking phase is combined with a thin-film growth approach, wherein the thin-film approach enables growth of an organic thin film with desired thickness onto a stamp, effectively controls the thickness of the pattern of the organic thin film transferred in the next printing phase. The demolding phase enables proper control of the temperature of and the printing pressure upon the transferred thin-film pattern to control the quality of surface roughness and residual internal stress in the printed pattern.

Abstract: A direct and effective method of fabricating full-color OLED arrays on the basis of microcontact printing process is disclosed. The key of the method lies in a physisorption-based microcontact printing process capable of controlling thickness of the printed films. The organic EL materials involved can be of either small or large molecular weights, as long as they are suitable for solution process.

Abstract: The present invention discloses a method of fabricating organic light emitting diode array, which adopts a directional spin coating technology to grow different organic light-emitting materials on the same plane so as to control the color of the emitted light and accomplish monochrome or full color organic light emitting diodes.

Abstract: The present invention discloses a method of forming linear patterns, called “directional spin coating” technology. Parallel banks are formed on a substrate to define some trenches; the substrate is vertically erected on outer edge of a spin disc; and a liquid material is applied to the trenches, the spin disc is rotated, and with the centrifugal force of rotation, the material is uniformly coated on the substrate within individual trenches to form a linear pattern. The thickness of the formed pattern is similar to that achievable using the conventional spin-coating approach. The present invention can create linear patterns made of more than one material by selectively coating different materials on specific trenches.