Abstract: An electronic apparatus and a data verification method using the same are provided. The electronic apparatus includes a first read-only memory having first data, a second read-only memory having second data and a controller. A correspondence relation exists between the first data and the second data. The controller is coupled to the first read-only memory and the second read-only memory. The controller reads first sub-data of the first data from the first read-only memory, and reads second sub-data of the second data corresponding to the first sub-data from the second read-only memory according to the correspondence relation. The first sub-data includes to-be-verified data. The controller performs a verification operation to the to-be-verified data according to the first sub-data, the second sub-data and the correspondence relation.

Abstract: An electronic apparatus and a data verification method using the same are provided. The electronic apparatus includes a first read-only memory having first data, a second read-only memory having second data and a controller. A correspondence relation exists between the first data and the second data. The controller is coupled to the first read-only memory and the second read-only memory. The controller reads first sub-data of the first data from the first read-only memory, and reads second sub-data of the second data corresponding to the first sub-data from the second read-only memory according to the correspondence relation. The first sub-data includes to-be-verified data. The controller perfoi ins a verification operation to the to-be-verified data according to the first sub-data, the second sub-data and the correspondence relation.

Abstract: A method for soldering an electrical element to a mother board includes the following steps. Firstly, the electrical element is prepared for soldering and deposited on an appropriate machine. Secondly, solder balls are deposited at openings of terminal receiving passageways of the electrical element by means of appropriate tools. Thirdly, the solder balls are heated to a semi-meltdown status and top surfaces of the solder balls are leveled by means of leveling tools. Lastly, the solder balls are mounted onto corresponding electrical contact pads of the mother board and reheated to melting temperature thereby completing the soldering process.