Abstract: A semiconductor package with improved solderability at sidewall includes a chip, a molding compound encapsulating the chip, and multiple leads distributed at sidewalls of the semiconductor package. The leads are formed as a conductive layer that is electrically connected to bonding pads of the chip. Each of the leads has a stepped surface exposed from the molding compound, wherein the stepped surface is shaped by two sequentially overlapped photoresist layers. The stepped surface of each lead allows to accommodate more solder to enhance the reliability of a solder joint between the semiconductor and a printed circuit board. Therefore, the solder joints of the semiconductor package are easily inspected by automatic optical inspection (AOI) equipment.