Patents by Inventor Jeng-Ting LI

Jeng-Ting LI has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Publication number: 20220271208
    Abstract: A light emitting diode (LED) package structure includes a glass substrate, conductive through holes, active elements, an insulating layer, LEDs and pads. The glass substrate has an upper surface and a lower surface. The conductive through holes penetrate the glass substrate and connect the upper and the lower surfaces. The active elements are disposed on the upper surface of the glass substrate and electrically connected to the conductive through holes. The insulating layer is disposed on the upper surface and covers the active elements. The LEDs are disposed on the insulating layer and electrically connected to at least one of the active elements. The pads are disposed on the lower surface of the glass substrate and electrically connected to the conductive through holes. A source of at least one active elements is directly electrically connected to at least one of the corresponding pads through the corresponding conductive through hole.
    Type: Application
    Filed: April 12, 2021
    Publication date: August 25, 2022
    Applicant: Unimicron Technology Corp.
    Inventors: Jeng-Ting Li, Chi-Hai Kuo, Cheng-Ta Ko, Pu-Ju Lin
  • Publication number: 20220068742
    Abstract: A chip package includes a redistribution layer, a chip, and an encapsulation member. The redistribution layer includes an insulation part, a plurality of first pads and a plurality of second pads, where the insulation part has a first surface, a second surface opposite to the first surface, and a side surface between the first surface and the second surface. The first pads and the second pads are located at the first surface and the second surface respectively. The chip is disposed on the first surface and electrically connected to the first pads. The encapsulation member wraps the chip and the redistribution layer, and covers the first surface and the side surface, where the encapsulation member exposes the second pads, and the encapsulation member is not flush with the first surface and the side surface.
    Type: Application
    Filed: November 4, 2021
    Publication date: March 3, 2022
    Inventors: Cheng-Hui WU, Jeng-Ting LI, Ping-Tsung LIN, Kai-Ming YANG, Pu-Ju LIN, Cheng-Ta KO